RT/duroid® 6002 is a low-loss, low dielectric constant laminate offering excellent electrical and mechanical properties for robust microwave structures. It balances high frequency performance with manufacturability. It provides superior performance, safety, and product longevity with great price-performance value.
In this article, we’ll discuss what really characterizes the high frequency Rogers RT/duroid® 6002 laminate. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the high frequency print circuit board, so please feel free to contact us.

What is the Rogers RT/duroid® 6002 laminate?
RT/duroid® 6002 microwave material is the first low-loss, low dielectric constant laminate that provides superior electrical and mechanical properties, which are critical for designing mechanically robust and electrically stable complex microwave structures.
The thermal coefficient of the dielectric constant is extremely low over the temperature range from -55°C to +150°C (-67°F to 302°F), providing designers of filters, oscillators, and delay lines with the electrical stability required for today’s demanding applications.A low Z-axis coefficient of thermal expansion (CTE) ensures excellent reliability of plated through-holes. RT/duroid® 6002 materials have successfully undergone more than 5000 temperature cycles (-55°C to 125°C [-67°F to 257°F ]) without a single via failure.
Excellent dimensional stability (0.2 to 0.5 mils/inch) is achieved by matching the X and Y coefficients of thermal expansion to copper, often eliminating the need for double etching to achieve tight positional tolerances. The low tensile modulus in the X and Y directions significantly reduces stress on solder joints and allows the laminate’s expansion to be constrained by a minimal amount of low CTE metal (6 ppm/°C), further enhancing surface mount reliability.
Rogers RT/duroid® 6002 laminate data sheet

Features of the Rogers RT/duroid® 6002 laminate
Dielectric Constant (Dk) of 2.94 at 10GHz
The material boasts a Dielectric Constant (Dk) of 2.94 ±0.04 at 10GHz, ensuring exceptional consistency and stability even at high frequencies. Offers tight tolerance control on both dielectric constant and thickness, ensuring consistent performance and minimizing variability between batches.
Dissipation Factor (Df) of 0.0012 at 10 GHz
With a low loss tangent of 0.0012 at 10 GHz, this laminate exhibits minimal signal loss during high frequency transmission. This characteristic is crucial for ensuring efficient signal integrity and system performance in advanced communication systems.
Excellent Electrical and Mechanical Properties
Its woven glass-reinforced hydrocarbon ceramic composite structure offers high strength, thermal resistance, and resistance to moisture absorption. Features outstanding electrical properties combined with robust mechanical strength, providing reliable performance under various conditions. Ensures long-term reliability and durability, even in challenging environments.
Extremely Low Thermal Coefficient of Dielectric Constant
A thermal coefficient of dielectric constant of +12ppm/°C ensures minimal frequency drift across temperature fluctuations, vital for outdoor and aerospace systems. Maintains a stable dielectric constant across temperature variations, ensuring consistent performance and reducing the impact of thermal stress.
In-Plane Expansion Coefficient Matched to Copper
The in-plane expansion coefficient closely matches that of copper, reducing the risk of delamination or other thermal-induced issues. Improves long-term reliability by minimizing the effects of thermal cycling on board performance.
Low Z-Axis Expansion
Provides excellent dimensional stability along the Z-axis, crucial for maintaining structural integrity in multilayer constructions. Minimizes warping during thermal cycling, enhancing reliability in multilayer designs. Facilitates precise drilling and routing operations, essential for maintaining tight tolerances in complex designs.
Low outgassing, Ideal for space applications
With low outgassing properties, RT/duroid® 6002 is suitable for use in vacuum environments where material outgassing could otherwise compromise performance. Ensures reliable operation in sensitive environments, such as those encountered in aerospace applications.
Applications of the Rogers RT/duroid® 6002 laminate
Applications particularly suited to the unique properties of RT/duroid 6002 material include at and non-planar structures such as antennas, complex multilayer circuits with interlayer connections, and microwave circuits for aerospace designs in hostile environments.
Its stable Dk and low loss enable precise beam steering in radar and 5G networks. Essential for antennas needing high phase stability and consistent performance across temperature variations.
Ground-Based and Airborne Radar Systems
Performs reliably in harsh environments, from military jets to weather monitoring stations. Suitable for radar systems requiring high precision and reliability under varying environmental conditions.
Global Positioning System Antennas
Ensures accurate signal reception for navigation and timing systems. Critical for GPS antennas requiring precise timing and synchronization for accurate location determination.
Supports high-speed digital circuits with minimal insertion loss and crosstalk. Necessary for backplanes needing efficient power distribution with minimal losses and reliable operation.
Commercial Airline Collision Avoidance Systems
Ensures reliable operation in collision avoidance systems, contributing to aviation safety. Critical for low-latency, high-reliability communication in avionics.
Beam Forming Networks
Ideal for beam forming networks requiring precise control and management of signal paths. Facilitates complex signal routing in satellite and telecom infrastructure.
Processing advantages of Rogers RT/duroid® 6002 laminate
When it comes to processing, Rogers RT/DUROID® 6002 PTFE laminate offers several distinct advantages, making it a preferred choice for engineers and manufacturers. Key processing benefits include:
High Reliability Complex Multilayer Circuits
Compatible with sequential lamination processes, enabling complex RF/mixed-signal PCBs for aerospace and defense. Supports the fabrication of highly complex, multilayer circuits with intricate geometries and tight tolerances. Ensures long-term reliability and performance in sophisticated electronic assemblies.
Available Clad with Aluminum, Brass or Copper Plates
Available with copper foil (standard), aluminum, or brass plates, catering to thermal management or lightweight designs. Allows designers to choose the best material combination for their specific needs, optimizing both performance and cost.
Ease of Processing
Compatible with standard PCB fabrication techniques drilling, etching, and plating, can be reducing production costs. Low outgassing and radiation resistance meet stringent requirements for satellites and space exploration.

Rogers RT/duroid® 6002 PCB Material Standard Thickness
0.005” (0.127mm) +/- 0.0007”
0.010” (0.254mm) +/- 0.0007”
0.020” (0.508mm) +/- 0.0010”
0.030” (0.762mm) +/- 0.0010”
0.060” (1.524mm) +/- 0.0020”
0.120” (3.048mm) +/- 0.0030”
Additional non-standard thicknesses available 0.005” – 0.250” in increments of 0.005”, And PCB material standard size is 18” X 12” (457mm X 305mm),18” X 24” (457mm X 610mm).
Rogers RT/duroid® 6002 PCB Material Standard Copper Clad Electrodeposited Copper Foil
½ oz. (18µm) H/H
1 oz. (35µm) 1/1
2 oz. (70µm) 2/2
Rolled Copper Foil
½ oz. (18µm) H/H
1 oz. (35µm) 1/1
2 oz. (70µm) 2/2
Ultimately, Rogers RT/duroid® 6002 microwave laminate bridges the gap between high frequency performance and manufacturability. By choosing Rogers RT/duroid® 6002, manufacturers can achieve superior performance, enhanced safety, and extended product lifetimes while benefiting from excellent price-performance value.
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