TC600 is a woven fiberglass reinforced, ceramic-filled PTFE composite for printed circuit boards. It offers high thermal conductivity, reducing dielectric and insertion losses, and improving amplifier and antenna performance. Its mechanical durability and thermal management capabilities enhance power handling and device reliability. Lower operating temperatures and matched CTE reduce solder fatigue and improve system reliability.
In this article, we’ll discuss what really characterizes the high frequency Rogers TC600™ laminate. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the high frequency print circuit board, so please feel free to contact us.
What is The Rogers TC600™ Laminate?
TC600™ woven fiberglass reinforced, ceramic filled, PTFE-based composite for use as a printed circuit board substrate is designed to provide enhanced heat-transfer through “Best-In-Class” thermal conductivity, while reducing dielectric loss and insertion loss. This material is engineered to minimize dielectric and insertion losses, leading to improved amplifier and antenna gains/efficiencies. The mechanical durability of TC600 is significantly enhanced, making it suitable for applications requiring a dielectric constant of 6.15. Enhanced thermal conductivity ceramic filled PTFE/Woven fiberglass laminate for microwave printed circuit boards.
The elevated thermal conductivity of the TC600 laminate facilitates higher power handling capabilities, mitigates hot-spot formation, and enhances device reliability. This higher heat transfer within the substrate complements designs using coins, heat sinks or thermal vias to provide designers additional design margin in managing heat. In scenarios where thermal management options are limited, the TC600 laminate substantially improves heat transfer through the substrate, resulting in lower junction temperatures and extended lifespans for active components. This is crucial for improving power amplifier reliability, extending mean time between failures (MTBF), and reducing warranty costs. Furthermore, the lower operating temperatures and matched coefficient of thermal expansion (CTE) between the laminate and components reduce the risk of solder fatigue, solder softening, and joint failure, thereby enhancing overall system reliability.
TC600 laminate has “Best-In-Class” Dielectric Constant Stability across a wide temperature range. This helps Power Amplifier and Antenna designers maximize gain and minimize dead bandwidth lost to dielectric constant drift as operating temperature changes. Dielectric constant stability is also critical to phase sensitive devices such as network transformers utilized for impedance matching networks utilized in power amplifier circuitry.
TC600 laminate has low Z-Direction CTE. This feature provides unsurpassed plated through hole reliability. TC600 laminate is a “soft substrate” and irrelatively insensitive to stress from vibration. Its robust nature overcomes the brittleness of thermoset ceramic loaded hydrocarbons or ceramics (such as alumina or LTCC) through suspension of micro-dispersed ceramics in a relatively soft, woven fiberglass reinforced PTFE-based substrate. This gives RF designers the advantage of low loss, without sacrificing mechanical robustness required to fulfill the needs of shock, drop and impact testing requirements of electronics. It is preferred by board manufacturers, as it can be easily cut, drilled, and routed without being sensitive to cracking.
Rogers TC600™ Laminate Data Sheet
Features of The Rogers TC600™ Laminate
“Best in Class” Thermal Conductivity (1.1 W/m.K) and Dielectric Constant Stability Across Wide Temperatures (-75 ppm/ºC)
With a thermal conductivity of 1.1 W/m.K, TC600™ leads the market in heat dissipation capabilities, ensuring cooler operation and higher reliability. Offers exceptional dielectric constant stability across a wide range of temperatures (-75 ppm/ºC), providing consistent performance even under extreme conditions.
Very Low Loss Tangent Provides Higher Amplifier or Antenna Efficiency
This property enhances amplifier and antenna efficiency by minimizing signal loss. The material’s exceptionally low dissipation factor minimizes signal loss, enabling higher efficiency in amplifiers, antennas, and filters. This translates to better power handling and longer battery life in portable devices.
Mechanically Robust，Replaces Brittle Laminates That Cannot Withstand Processing, Impact, or High G Forces
Unlike brittle ceramic substrates or fragile laminates, TC600 is designed to withstand harsh processing, high-G forces, and mechanical stress. Its durability makes it ideal for aerospace, automotive, and handheld devices. Suitable for use in demanding environments where durability is essential.
Priced Affordably for Commercial Applications
Delivers high performance at an affordable price point, making it an excellent choice for a wide range of RF and microwave applications. Ensures broader accessibility to high-performance materials for a wider range of manufacturers.
High Peel Strength for Reliable Narrow Lines
Ensures reliable adhesion of narrow circuit lines, enhancing durability and manufacturing reliability. Facilitates precise engineering of circuits with fine details and tight tolerances. Reliable adhesion supports fine-line circuitry and dense layouts, critical for miniaturized designs like RFID readers or GPS antennas.
Applications of The Rogers TC600™ Laminate
From avionics to consumer electronics, TC600 laminates are enabling next-generation innovations:
Power Amplifiers, Filters, and Couplers
The low loss tangent and thermal conductivity of TC600™ make it an ideal choice for RF and microwave power amplifiers and filters. High thermal conductivity and low loss make TC600 ideal for 5G base stations, radar systems, and telecom infrastructure, where efficiency and heat dissipation are paramount.
Microwave Combiner and Power Divider Boards in Avionics
Stable Dk and ruggedness ensure reliable performance in aircraft communication systems, even under extreme temperatures and vibrations. Ensures stable performance in demanding aerospace applications.
Small Footprint Antennas
Used in satellite radio (Digital Audio Broadcasting/DAB), GPS modules, and handheld RFID readers, TC600 supports compact, high-gain antenna designs without sacrificing efficiency. Optimized for high-frequency and miniaturized antenna designs.
Digital Audio Broadcasting (DAB) Antennas (Satellite Radio)
Ideal for small footprint antennas, DAB antennas, GPS, and hand-held RFID reader antennas, offering high efficiency and compact designs. Offers low signal loss for superior audio broadcasting quality.
GPS & Hand-held RFID Reader Antennas
Ensures reliable and efficient signal transmission in GPS and RFID applications. TC600 supports compact, high-gain antenna designs without sacrificing efficiency. Optimized for high-frequency and miniaturized antenna designs.
Manufacturing Advantages of Rogers TC600™ Laminate
One of the standout aspects of TC600™ is its ease of processing and manufacturing efficiency. Key advantages include：
Effective Heat Dissipation and Management
Eliminates the need for bulky heat sinks in many designs, saving space and weight. Enhances component reliability and longevity by efficiently dissipating heat. By managing heat effectively, TC600™ helps extend the lifespan of electronic components.
Replacement for Ceramic in Some Applications
Provides a mechanically robust and cost-effective alternative to traditional ceramic-based substrates. Offers a machinable, cost-effective alternative to alumina or other ceramics in applications like power modules or RF shielding.
Improved Processing and Reliability
Compatible with standard PCB fabrication processes, ensuring high yields and manufacturing consistency. Resists delamination and warping during assembly, ensuring high yields in high-volume manufacturing. Ensures consistent quality and performance through repeatable processes and reliable outcomes.
Large Panel Sizes for Multiple Circuit Layout for Lowered Processing Costs
Maximizes panel utilization for multi-circuit layouts, reducing material waste and production costs. The ability to accommodate multiple circuit layouts on a single panel reduces processing costs and material waste. Facilitates scalability in production, making it easier to meet growing demand while maintaining cost-effectiveness.
Rogers TC600™ PCB Material Standard Thickness
0.010″(0.252mm) ±0.0007″
0.020″(0.508mm) ±0.0015″
0.030”(0.762mm) ±0.0020″
0.060″(1.524mm) ±0.0030″
Rogers TC600™ PCB Material Standard Size
12″X 18″(305mm X 457mm)
24″X 18″(610mm x 457mm)
Rogers TC600™ PCB Material Standard Copper Clad
0.010″:
Reverse Treated Electrodeposited Copper Foil
1/2oz.(18um) SH/SH
1oz.(35um) S1/S1
All Other Thicknesses:
Electrodeposited Copper Foil
1/2oz.(18um) HH/HH
1 oz.(35um) H1/H1
Reverse Treated Electrodeposited Copper Foil
1/2oz.(18um) SH/SH
1 oz.(35um) S1/S1
Ultimately, Rogers TC600™ laminates represent a breakthrough in high-frequency PCB materials, combining best-in-class thermal conductivity, excellent dielectric stability, and mechanical robustness. Furthermore, the manufacturing advantages offered by TC600™, including efficient heat dissipation, potential to replace ceramics, and improved processing reliability, make it an invaluable asset for manufacturers seeking to enhance product performance while controlling costs.
