Rogers TC350 Plus Laminate That Is A Premier Choice For High Thermal Conductivity Of 1.24 W/m.K Application

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In this article, we’ll discuss what really characterizes the high frequency Rogers TC350 Plus Laminate. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the high frequency print circuit board, so please feel free to contact us.

2layers tc350 RF circuits
2layers tc350 RF circuits

What is the Rogers TC350 PLUS laminate?

TC350™ Plus laminates are ceramic-filled PTFE-based woven glass reinforced composite materials that offer a cost-effective, high performance, thermally enhanced solution for circuit designers. The low loss tangent of 0.0017 at 10 GHz to enable low loss designs. With a thermal conductivity of 1.24 W/mK, this next generation PTFE based laminate is particularly well suited for high power microwave and industrial heating applications that demand higher maximum operating temperatures, low circuit losses, and superior thermal dissipation within the circuit board.

Moreover, the advanced filler system employed in this composite material significantly improves mechanical drilling performance compared to other competitive laminates, leading to reduced manufacturing costs during circuit board fabrication. high dielectric strength of 650 V/mil to ensure good z-axis insulation between conductor layers, and UL 94 V-0 flammability performance to enable the use of the material in commercial applications.

Rogers TC350 PLUS laminate data sheet

TC350 data sheet
TC350 data sheet

Features of the Rogers TC350 PLUS laminate

High Thermal Conductivity (1.24 W/m•K)

Heat dissipation is a critical challenge in high-power designs. With a thermal conductivity of 1.24 W/m•K, TC350 Plus efficiently transfers heat away from active components, reducing thermal stress and enhancing system reliability. Reduces the risk of overheating, contributing to longer component lifespan and improved reliability under high power conditions.

Low Loss Tangent (0.0017 at 10 GHz)

The ultra-low dissipation factor ensures minimal signal attenuation, even at frequencies as high as 10 GHz. This makes the material ideal for applications requiring precise signal integrity over wide bandwidths. Supports higher data rates with lower power consumption, enhancing overall system performance.

Very Low Insertion Loss & Reduced RF Heat Generation

The laminate’s low insertion loss minimizes energy waste in RF circuits, while its ability to reduce conductor generated heat ensures stable operation under prolonged high-power conditions. Minimizes losses in transmission lines, ensuring efficient power delivery and signal propagation.

Low Z-Axis CTE (38 ppm/°C)

A low coefficient of thermal expansion (CTE) in the Z-axis prevents delamination and via cracking during thermal cycling, ensuring long term durability in fluctuating temperature environments. Facilitates precise fabrication, critical for maintaining tight tolerances in advanced electronic designs.

Low Moisture Absorption

The low moisture absorption of 0.05% to ensure stable performance in a range of operating environments, TC350 Plus maintains consistent electrical and mechanical properties even in humid conditions, making it suitable for harsh operating environments.

UL 94 V-0 Flammability Rating

The material meets the stringent UL 94 V-0 standard for flame resistance, ensuring safety in high temperature applications and compliance with industry regulations.

Applications of the Rogers TC350 PLUS laminate

The unique properties of Rogers TC350 Plus Laminate make it indispensable in advanced RF and microwave systems, including:

High-Power RF/Microwave Power Amplifiers

From aerospace radar systems to 5G base stations, TC350 Plus supports high-power amplifiers by efficiently managing heat and minimizing signal loss, enabling higher output power and efficiency.

Industrial Heating Applications

The material’s thermal stability and low loss are critical for RF-based industrial heating systems, such as plasma generators and microwave drying equipment, where consistent performance at high power levels is essential.

Passive Components (Couplers, Filters, Power Dividers)

TC350 Plus ensures precise impedance control and low passive intermodulation, making it ideal for designing high performance passive components used in telecommunications and defense systems.

Processing advantages of Rogers TC350 PLUS laminate

When it comes to processing, Rogers TC350 PLUS laminate offers several distinct advantages, making it a preferred choice for engineers and manufacturers. Key processing benefits include:

Improved Drilling Performance When Compared to Competitive Materials

Compared to competing materials, TC350 Plus exhibits superior drillability, reducing tool wear and enabling smoother via formation. This translates to lower production costs and higher yields in multilayer PCB fabrication.

Compatibility with Standard Processes

TC350 Plus can be processed using conventional FR-4 fabrication techniques, including etching, plating, and lamination, simplifying integration into existing manufacturing workflows.

Ultimately,Rogers TC350 Plus Laminate represents a significant advancement for engineers addressing the challenges of high power, high frequency designs. By choosing Rogers TC350 Plus, manufacturers can achieve superior performance, enhanced safety, and extended product lifetimes while benefiting from excellent price-performance value.

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