FPCB factory specializes in providing turnkey service of customized PCB & PCBA solutions to meet the diverse needs of our clients. Our factory is committed to providing one-stop PCB & SMT assemble solutions to drive technological advancement and innovation.
In this article, we’ll discuss what really characterizes the high frequency Rogers RO4360G2™ laminate. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the high frequency print circuit board, so please feel free to contact us.
What is the Rogers RO4360G2™ laminate?
RO4360G2™ laminates, characterized by a dielectric constant (Dk) of 6.15, exhibit low loss and are reinforced with glass fibers. These hydrocarbon ceramic-filled thermoset materials offer an optimal balance between performance and ease of processing. RO4360G2 laminates enhance Rogers’ portfolio of high-performance materials by providing a lead-free process capability, superior rigidity for enhanced processability in multi-layer board constructions, and reduced material and fabrication costs.
RO4360G2 laminates, characterized by a dielectric constant (Dk) of 6.15 (Design Dk 6.4), enable designers to minimize circuit dimensions in applications where size and cost are critical factors. These materials represent an optimal value proposition for engineers working on designs such as power amplifiers, patch antennas, ground based radar systems, and other general RF applications.
RO4360G2 laminates exhibit processing characteristics similar to those of FR-4 and are compatible with automated assembly processes. These materials feature a low Z-axis coefficient of thermal expansion (CTE), providing enhanced design flexibility, and possess the same high glass transition temperature (Tg) as other products in the RO4000 series. RO4360G2 laminates can be effectively paired with RO4400™ prepreg and lower-Dk RO4000 laminates in multi-layer designs.
Rogers RO4360G2™ laminate data sheet
Features of the Rogers RO4360G2™ laminate
Stable Dielectric Constant (Dk)
With a Dk of 6.15 at 10 GHz, this material ensures consistent signal integrity, minimizing phase shifts and impedance mismatches in RF designs. This property allows for precise signal transmission in applications where signal integrity and consistency are crucial.
Low Dissipation Factor (Df)
Alongside a Dissipation Factor (Df) of just 0.0038 at 10 GHz, it minimizes energy loss, ensuring efficient performance even in high-speed communication systems. this laminate ensures minimal signal degradation, making it ideal for high-frequency applications.
High Thermal Conductivity
Efficient heat dissipation helps manage thermal loads in power-hungry devices, improving reliability and longevity. Helps in maintaining optimal operating temperatures, thereby enhancing the overall reliability and lifespan of electronic devices. One of the standout features of RO4360G2™ is its high thermal conductivity, which improves heat dissipation in power dense circuits. This property is essential for preventing overheating and maintaining long-term reliability, especially in power amplifiers or other components that generate substantial heat during operation.
Low Z-Axis CTE & High Tg
The low coefficient of thermal expansion (CTE) along the Z-axis, paired with a high glass transition temperature (Tg), ensures dimensional stability under thermal stress. ensures dimensional stability, reducing the risk of warping and stress fractures under thermal cycling conditions. Provides robustness against thermal stresses during assembly processes and operation.
Lead-Free Process Compatibility
RO4360G2™ laminate is compatible with lead-free soldering processes, meets environmental regulations and supports RoHS compliant manufacturing. This feature makes it suitable for lead-free process compatibility, meeting the stringent requirements of modern electronics manufacturing while offering excellent thermal reliability.
CAF Resistance
The material is resistant to Conductive Anodic Filament (CAF), an issue that can cause electrical shorting in PCBs due to long-term exposure to moisture and voltage stress. This CAF resistance adds to the laminate’s longevity, making it a reliable choice for high-reliability applications.
Lower total PCB cost solution than competing PTFE products
Compared to competing PTFE-based pcb laminates, RO4360G2™ offers a lower total PCB cost solution without compromising on performance. This makes it an attractive choice for manufacturers looking to balance cost and performance in high-frequency designs.
Applications of the Rogers RO4360G2™ laminate
Rogers RO4360G2™ is designed for a range of high-performance applications where precise electrical properties and thermal management are critical. Some of the most common applications include:
Base Station Power Amplifiers
RO4360G2™ is ideal for power amplifiers used in base stations, where high-frequency stability and thermal management are essential. The laminate’s low Df and high thermal conductivity ensure that power losses are minimized, and heat is effectively dissipated.
Patch Antenna
RO4360G2™ is commonly used in the construction of patch antennas, which are integral to wireless communication systems. Its low dielectric constant allows for efficient signal transmission, ensuring that wireless devices maintain strong and stable connections.
Small Cell Transceivers
Small cell transceivers, which are a core part of modern wireless communication networks, benefit from the high-frequency performance and low-loss characteristics of RO4360G2™. The material’s high Dk allows for smaller and more efficient designs, making it a preferred choice in small cell applications that require compact, high-speed circuitry.
Ground based Radar Applications
RO4360G2™ laminate is also utilized in ground based radar applications, where it plays a crucial role in enhancing the performance and reliability of radar systems. This high-performance material is specifically designed to meet the demanding requirements of modern radar technology.
Furthermore, the laminate’s compatibility with high-frequency circuits makes it suitable for advanced radar technologies that operate at higher frequencies. As radar systems continue to evolve and require higher performance levels, RO4360G2™ laminate provides a reliable foundation for developing next-generation radar solutions.
Manufacturing advantages of Rogers RO4360G2™ laminate
The superior characteristics of RO4360G2™ also translate into significant manufacturing benefits:
RO4000 Material Repeatability
Rogers RO4360G2™ maintains consistent material properties across production batches, ensuring high repeatability in manufacturing. This consistency is crucial for maintaining the integrity of the final product and reducing the risk of defects.
Design Flexibility
RO4360G2™ offers significant design flexibility, enabling engineers to create optimized circuit designs for high-frequency applications. Its excellent electrical properties allow for more compact, efficient, and reliable circuit designs that can meet the performance demands of modern communication systems.
Plated Through-Hole Reliability
RO4360G2™ exhibits excellent plated through-hole reliability, a critical factor for high-frequency and power applications where reliable electrical connections are essential. This feature ensures that the laminate will perform well under stress conditions, such as thermal cycling and mechanical loading.
Automated Assembly Compatibility
The material is fully compatible with automated assembly processes, enhancing efficiency and reducing the potential for human error. This compatibility is particularly beneficial for mass production environments, where speed and consistency are key.
Quick Turnaround Times
RO4360G2™ enables short lead times and quick inventory turns, helping manufacturers meet tight production schedules and reduce time to market. Readily available inventory and streamlined processing shorten lead times, enabling faster product iterations.
Ease of Fabrication & Processes Similar to FR-4
The fabrication process for RO4360G2™ is similar to that of traditional FR-4 materials, meaning that it can be integrated into existing PCB manufacturing workflows with minimal modification. This ease of processing makes it an attractive option for manufacturers seeking high-performance materials without the complexity associated with more specialized laminates.
Rogers RO4360G2™ high frequency laminate standard thickness
0.008” (0.203mm) +/- 0.0007”
0.016” (0.406mm) +/- 0.0015”
0.020” (0.508mm) +/- 0.0015”
0.024” (0.610mm) +/- 0.0015”
0.032” (0.813mm) +/- 0.0020”
0.060” (1.524mm) +/- 0.0040”
Rogers RO4360G2™ high frequency laminate standard size
12 X 18” (305 X 457mm)
24”X 18”(610 X 457mm)
Rogers RO4360G2™ high frequency laminate standard copper clad
½ oz. (18µm) HH/HH
1 oz. (35µm) H1/H1
Ultimately, Rogers RO4360G2™ laminate bridges the gap between high frequency performance and manufacturability, offering a cost-effective alternative to PTFE-based materials. By choosing RO4360G2™, manufacturers can achieve superior performance, enhanced reliability, and significant cost savings, positioning themselves competitively in today’s fast-paced electronics market.
