Rogers RO3035™ is a ceramic-filled PTFE laminate for RF and microwave circuits that need a dielectric constant near 3.5, low loss and mechanically stable multilayer construction. Rogers publishes a process Dk of 3.50 ±0.05, a design Dk of 3.60 and a typical dissipation factor of 0.0015 at 10GHz.
Those values do not make every RO3035 board electrically equivalent. Laminate thickness, copper profile, etched geometry, bonding material, solder mask and surface finish still affect impedance and insertion loss. QFPCB therefore reviews the released stackup and RF geometry before quotation or production.
What Is Rogers RO3035?
RO3035 belongs to the Rogers RO3000® family of ceramic-filled PTFE high-frequency laminates. Members of the family use different dielectric constants while maintaining broadly consistent mechanical behavior. This helps designers combine dielectric constants in multilayer structures without treating every layer as a mechanically unrelated material.
Rogers positions RO3035 for 5G, millimeter-wave, sub-6GHz and massive-MIMO designs. Its listed application groups include antenna systems, communications systems and power amplifiers. Rogers states that it can be used in applications up to 30–40GHz; actual circuit bandwidth still depends on geometry, transitions, fabrication and the complete RF loss budget.
Official RO3035 Datasheet Properties
The table below uses the RO3035 column in Rogers Publication 92-130, revision 1687 013024. Values are typical material data unless a tolerance is explicitly shown. Preserve the test method and condition when comparing materials or writing procurement requirements.
| Property | RO3035 value | Unit / direction | Condition / method |
|---|---|---|---|
| Process Dk | 3.50 ±0.05 | Z direction | 10GHz, 23°C; IPC-TM-650 2.5.5.5 |
| Design Dk | 3.60 | Z direction | 8–40GHz; differential phase length |
| Dissipation factor | 0.0015 | Z direction | 10GHz, 23°C; IPC-TM-650 2.5.5.5 |
| TCDk | −45 | ppm/°C | 10GHz, −50 to 150°C; IPC-TM-650 2.5.5.5 |
| CTE X / Y / Z | 17 / 17 / 24 | ppm/°C | −55 to 288°C; IPC-TM-650 2.4.41 |
| Thermal conductivity | 0.50 | W/(m·K) | 50°C; ASTM D5470 |
| Water absorption | 0.04 | % | D48/50; IPC-TM-650 2.6.2.1 |
| Peel strength | 10.2 (1.8) | lb/in (N/mm) | 1oz ED copper; IPC-TM-650 2.4.8 |
| Density | 2.1 | g/cm³ | 23°C; ASTM D792 |
| Flammability | V-0 | UL 94 | Rogers typical-properties table |
| Lead-free compatible | Yes | — | Rogers typical-properties table |
Process Dk Versus Design Dk
RO3035 has two published Dk values because they serve different purposes. The 3.50 ±0.05 process Dk is measured by the clamped-stripline method at 10GHz and 23°C. The 3.60 design Dk is derived from differential phase length measurements over 8–40GHz and is usually the more relevant starting value for transmission-line modeling.
Neither number replaces a stackup model. Copper roughness, finished copper thickness, dielectric thickness after processing, solder mask and actual line geometry change effective dielectric behavior. QFPCB uses the selected construction and target impedance rather than inserting one catalog Dk into every design.
Why RO3035 Fits 5G and mmWave Designs
A Dk near 3.5 can provide practical RF line widths while keeping circuits compact. The published Df of 0.0015 limits dielectric contribution to loss, and the −45ppm/°C TCDk supports more stable resonators and phase-sensitive structures as temperature changes. These properties explain Rogers’ positioning for 5G, sub-6GHz, mmWave and massive-MIMO hardware.
Material data alone cannot establish link margin or antenna efficiency. At higher frequencies, copper profile, conductor finish, launch geometry, via transitions, registration and enclosure interaction become increasingly important. A finished design should be assessed at its real frequency, temperature and geometry.
RO3035 for Power Amplifiers and Antennas
Rogers lists power amplifiers and antenna systems as application groups. RO3035’s 0.50W/(m·K) thermal conductivity is useful design data, but it should not be treated as a substitute for a complete junction-to-ambient thermal model. Copper spreading, ground connections, heat sinks, mounting pressure and airflow still determine operating temperature.
For antennas, Dk tolerance, laminate thickness and etch control influence resonant frequency and impedance. For amplifiers, RF loss, bias-current paths, thermal spreading and stability must be considered together. QFPCB reviews critical dimensions and stackup notes before releasing tooling.
RO3035 Versus RO3003 and RO3203
RO3035 is not a renamed RO3003. RO3003 has a lower process Dk of 3.00 ±0.04 and a lower published Df of 0.0010, while RO3035 provides a higher Dk that can reduce circuit size. See our RO3003 material guide when the design is centered on Dk 3.0 or operation up to 77GHz.
RO3203 has a process/design Dk around 3.02 and a different woven-glass reinforced PTFE construction and mechanical dataset. Our RO3200-series comparison explains that family. Choose by the complete electrical, mechanical, supply and fabrication requirements, not Dk alone.
Standard Thickness, Panel and Copper Options
The current RO3000 datasheet lists RO3035 standard thicknesses of 0.010in (0.25mm), 0.020in (0.51mm) and 0.060in (1.52mm), with respective nominal tolerances of ±0.0005in, ±0.0010in and ±0.0030in. Standard panel sizes are 12 × 18in (305 × 457mm) and 24 × 18in (610 × 457mm).
The datasheet’s standard-configuration table lists 0.5oz (18µm) and 1oz (35µm) electrodeposited copper for RO3035. The dedicated Rogers product page also states rolled-copper availability. Therefore, specify the required foil rather than assuming all thickness-and-copper combinations are interchangeable or in stock. QFPCB confirms the current material configuration for each quotation.
PTFE Fabrication and DFM Risks
RO3035 requires PTFE-specific processing with appropriate drilling, hole-wall preparation, surface treatment, dimensional compensation and bonding controls. It should not be routed through an ordinary FR-4 process without review. Rogers’ RO3000/RO3200 fabrication guidance is the appropriate manufacturer reference for process planning.
For QFPCB high-frequency PCB manufacturing, RO3000-series support and general process windows are starting points only. Finished hole size, aspect ratio, copper thickness, panel utilization and material availability must be checked against the exact layer structure.
Hybrid and Mechanically Drilled Blind-Via Stackups
RO3035 may be used in a homogeneous RF board or a reviewed hybrid stackup with compatible bonding materials and FR-4 sections. Hybrid construction can reserve RO3035 for RF layers while using another material elsewhere, but lamination temperature, CTE, resin flow, copper balance and dimensional movement must be evaluated as one system.
QFPCB does not claim HDI or Any-Layer HDI stackup design for RO3035 or other high-frequency-laminate projects. We provide impedance simulation, stackup design and technical support for reviewed high-frequency hybrid structures or mechanically drilled blind-via stackups. Material, dielectric thickness, blind-via layer pairs and press cycles remain subject to engineering approval.
Impedance Simulation and Engineering Support
QFPCB reviews laminate thickness, copper type and thickness, bonding layers, reference planes, trace geometry, solder mask and finish before confirming a PCB layer stackup. For an impedance-control PCB, include the target impedance, requested tolerance, line type, frequency range and coupon requirements.
PCB engineer Alan has more than 10 years of PCB CAM engineering experience. For RO3035 hybrid or mechanically drilled blind-via stackup support, contact [email protected]. Engineering review does not imply a universal impedance tolerance, named simulation platform, fixed test scope or first-pass guarantee.
Files Needed for an RO3035 PCB Quote
- Gerber or ODB++ files and NC drill data
- Layer order, finished thickness and copper by layer
- Exact RO3035 thickness and copper-foil requirement
- Bonding material and hybrid-material requirements
- Controlled-impedance table with line type and reference layers
- Operating frequency, insertion-loss target and temperature range
- Finished-hole sizes and mechanically drilled blind-via layer pairs, if any
- Surface finish, solder mask and assembly profile
- Material certification, traceability and substitution restrictions
- Prototype and production quantities
These inputs let QFPCB review material availability, impedance, lamination, drilling, plating and inspection before tooling. They also prevent a quotation from silently substituting a different RO3000 grade or copper construction.
Frequently Asked Questions
What is the dielectric constant of Rogers RO3035?
Rogers publishes a process Dk of 3.50 ±0.05 at 10GHz and 23°C using IPC-TM-650 2.5.5.5. The design Dk is 3.60 from differential phase length testing over 8–40GHz. Use the design value as a modeling starting point and include actual stackup, copper and geometry.
What is the dissipation factor of RO3035?
The current official RO3000-series datasheet lists a typical RO3035 Df of 0.0015 at 10GHz and 23°C. Finished-circuit loss also includes conductor roughness, conductor geometry, launches, vias, connectors, radiation and surface finish, so Df alone does not predict total insertion loss.
How high in frequency can RO3035 be used?
Rogers states that RO3035 can be used in applications up to 30–40GHz. This is a material-positioning statement, not a guaranteed finished-PCB bandwidth. Verify the actual circuit using the chosen thickness, copper, transitions, fabrication tolerances, temperature range and RF architecture.
Is RO3035 suitable for 5G and mmWave antennas?
Yes, it is a candidate material. Rogers specifically positions RO3035 for 5G, sub-6GHz, millimeter-wave and massive-MIMO applications and lists antenna systems. Suitability still depends on antenna topology, frequency, bandwidth, loss budget, copper profile, thickness tolerance, surface finish and environmental requirements.
What is the difference between RO3035 and RO3003?
RO3035 has a process Dk of 3.50 ±0.05 and Df of 0.0015, while RO3003 has a process Dk of 3.00 ±0.04 and Df of 0.0010 under the same published 10GHz method. RO3035 can support more compact lines; RO3003 may be preferred when lower Dk or loss is decisive.
Can QFPCB build an HDI RO3035 board?
QFPCB does not claim HDI or Any-Layer HDI stackup design for RO3035 high-frequency-laminate projects. We can review high-frequency hybrid structures or mechanically drilled blind-via stackups and provide impedance simulation and technical support. Send complete layer pairs, hole geometry and bonding requirements for engineering review.
What standard RO3035 thicknesses are listed?
The current datasheet lists 0.010in (0.25mm), 0.020in (0.51mm) and 0.060in (1.52mm). Their nominal tolerances are ±0.0005in, ±0.0010in and ±0.0030in. Confirm the exact thickness, panel and copper configuration before design release and procurement.
What should be specified on an RO3035 fabrication drawing?
Identify Rogers RO3035, laminate thickness, copper type and weight, layer construction, bonding material, finished thickness, controlled-impedance requirements, hole structure, surface finish and material-document requirements. State whether substitutions require written approval. This prevents a visually similar but electrically different RO3000 construction from being used.
Request an RO3035 PCB Review
Send QFPCB your fabrication data, target stackup, impedance table, operating frequency, material construction and quantity. We will review the RO3035 selection, high-frequency hybrid or mechanically drilled blind-via structure, PTFE process route and quotation assumptions before production.
Official source: Rogers RO3000 Series Circuit Materials Data Sheet, Publication 92-130.
