Rogers RO3003 is a ceramic-filled PTFE laminate engineered for RF, microwave and millimeter-wave circuits that need low loss and stable dielectric behavior. Rogers publishes a process Dk of 3.00 ± 0.04 and Df of 0.0010 at 10GHz and 23°C. Those numbers are useful only when the test method, thickness, copper and intended circuit geometry remain part of the discussion.
QFPCB treats RO3003 as a high-frequency material, not as ordinary FR-4. Before quotation, we review the exact laminate thickness, cladding, layer structure, bonding system, impedance geometry, hole design, finish and frequency range. We do not apply a generic FR-4 stackup to a PTFE design.
What is Rogers RO3003?
RO3003 belongs to the Rogers RO3000 series of ceramic-filled PTFE high-frequency laminates. Rogers designed the family for commercial microwave and RF applications with consistent mechanical behavior across several dielectric constants. RO3003 is the low-Dk member in the current RO3003, RO3035, RO3006 and RO3010 datasheet.
The official document highlights low dielectric loss, stable Dk versus temperature and frequency, copper-matched in-plane expansion, reliable stripline and multilayer construction, and compatibility with epoxy-glass hybrid designs. Typical applications include automotive radar, satellite antennas, cellular power amplifiers and antennas, patch antennas, broadcast satellite systems, cable datalink, remote meter readers and power backplanes.
RO3003 datasheet values and test conditions
The table below uses the RO3003 column from Rogers Publication #92-130, revised 1687 013024. Rogers states that the figures are typical population averages and should not be used as specification limits. A purchase drawing should therefore identify the material, construction and required acceptance criteria rather than converting every typical value into a tolerance.
| Property | RO3003 typical value | Unit | Condition / method |
|---|---|---|---|
| Dielectric constant, process | 3.00 ± 0.04 | – | 10GHz, 23°C; IPC-TM-650 2.5.5.5 |
| Dielectric constant, design | 3.00 | – | 8-40GHz; differential phase length method |
| Dissipation factor | 0.0010 | – | 10GHz, 23°C; IPC-TM-650 2.5.5.5 |
| Thermal coefficient of Dk | -3 | ppm/°C | -50 to 150°C at 10GHz; IPC-TM-650 2.5.5.5 |
| Decomposition temperature, Td | 500 | °C TGA | ASTM D3850 |
| CTE, X / Y / Z | 17 / 16 / 25 | ppm/°C | -55 to 288°C, 23°C/50% RH; IPC-TM-650 2.4.41 |
| Thermal conductivity | 0.50 | W/(m·K) | 50°C; ASTM D5470 |
| Moisture absorption | 0.04 | % | D48/50; IPC-TM-650 2.6.2.1 |
| Density | 2.1 | g/cm³ | 23°C; ASTM D792 |
| Flammability | V-0 | rating | UL 94 |
| Lead-free process compatible | Yes | – | Rogers typical-properties table |
Process Dk versus design Dk
Rogers publishes both a process Dk and a design Dk of 3.00 for RO3003, but they come from different methods. The process value is measured at 10GHz using IPC-TM-650 2.5.5.5. The design value is an average derived from differential phase length testing across 8-40GHz and common thicknesses.
For impedance work, the design value is a starting point, not a complete stackup model. Copper roughness, conductor thickness, solder mask, etched geometry, surface finish, bonding layer and the selected laminate thickness all affect the finished structure. QFPCB uses the released stackup and trace geometry for calculation rather than treating Dk as the only variable.
Why TCDk and CTE matter in an RO3003 PCB
RO3003 has a published TCDk of -3ppm/°C from -50 to 150°C at 10GHz. This low absolute change supports circuits whose phase or resonant frequency must remain stable across temperature. It does not mean the complete PCB or assembled module will have zero temperature drift; copper, solder mask, components, housing and geometry also contribute.
Rogers publishes X/Y/Z CTE values of 17/16/25ppm/°C. The in-plane values are close to copper, while the 25ppm/°C Z-axis figure supports plated-through-hole reliability. Drill quality, hole-wall preparation, aspect ratio, copper plating and thermal cycling still require manufacturing review.
Standard RO3003 thickness, panel and copper options
The official datasheet lists five standard RO3003 thicknesses and their tolerances. It also lists standard panel and cladding options. Other configurations may be available through Rogers, but QFPCB confirms the exact material and supply position for each quotation rather than claiming every combination is stocked.
| Nominal thickness | Metric thickness | Published tolerance | Standard configuration note |
|---|---|---|---|
| 0.005in | 0.13mm | ±0.0005in | Standard RO3003 thickness |
| 0.010in | 0.25mm | ±0.0007in | Standard RO3003 thickness |
| 0.020in | 0.51mm | ±0.0010in | Standard RO3003 thickness |
| 0.030in | 0.76mm | ±0.0015in | Standard RO3003 thickness |
| 0.060in | 1.52mm | ±0.0030in | Standard RO3003 thickness |
| Panel sizes | 305 × 457mm; 610 × 457mm | 12 × 18in; 24 × 18in | 0.005in and 0.010in also list 610 × 533mm (24 × 21in) |
| Electrodeposited copper | 18µm / 35µm | 1/2oz / 1oz | Standard cladding |
| Rolled copper | 18µm / 35µm | 1/2oz / 1oz | Standard cladding |
RO3003 versus RO3003G2
RO3003 and RO3003G2 are different Rogers products. They share a nominal Dk family and both target demanding high-frequency circuits, but a RO3003 drawing must not be silently converted to RO3003G2. The G2 product has its own datasheet, mechanical characteristics and available configurations.
If a supplier proposes RO3003G2, compare the current official datasheets, laminate thickness, copper option, Dk/Df method, mechanical data, fabrication route and qualification requirements. Customer or regulatory approval may be necessary before substitution.
Where RO3003 fits – and where it may be unnecessary
RO3003 is a strong candidate when low loss, stable phase with temperature or broadband consistency drives the design. Common examples include radar antennas, microwave filters, satellite links and RF power circuits. Its published Df of 0.0010 is substantially below many hydrocarbon-ceramic and FR-4 systems, but that alone does not prove the lowest total channel loss.
Do not specify RO3003 simply because a board operates at “high speed.” A shorter digital channel may meet its loss budget with a lower-cost material. Compare insertion loss, phase stability, manufacturing process, supply risk and total stackup cost before selecting a laminate.
PTFE fabrication risks to review before quotation
RO3003 uses PTFE-specific circuit-board processing rather than a standard FR-4 route. Hole-wall preparation, drilling parameters, plasma or chemical treatment, copper adhesion, dimensional compensation and bonding materials require review. We do not transfer a competitor’s stated process limits, press cycles or inventory claims to QFPCB.
For QFPCB high-frequency PCB manufacturing, the general process baseline lists RO3000-series material support, review-based hybrid multilayers from 4 to 70 layers, a 4mil minimum core reference and a 0.25mm minimum hole in PTFE material. These are starting windows, not unconditional limits for every RO3003 construction.
RO3003 hybrid and mechanically drilled blind-via stackups
RO3003 can be used in homogeneous multilayers or in reviewed hybrid constructions with compatible bonding materials and FR-4 sections. A hybrid can place low-loss material only where RF performance requires it, but CTE, resin flow, copper balance, dimensional movement, lamination temperature and bonding thickness must be evaluated together.
QFPCB does not offer HDI or Any-Layer HDI stackup design for RO3003 or other high-frequency-laminate projects. We can provide impedance simulation, stackup planning and technical support for reviewed high-frequency hybrid structures or mechanically drilled blind-via stackups. Layer pairs, press cycles and hole geometry remain project-specific.
Impedance simulation and engineering support from QFPCB
QFPCB reviews RO3003 thickness, cladding, bonding layers, finished copper, trace geometry, reference planes, solder mask and finish before confirming a PCB layer stackup. For an impedance-control PCB, include the target impedance, tolerance requested by the design, line type, frequency range and coupon requirements in the fabrication package.
PCB engineer Alan has more than 10 years of PCB CAM engineering experience. For RO3003 hybrid or mechanically drilled blind-via stackup questions, contact [email protected]. Engineering support does not imply a universal impedance tolerance, named software platform, test scope or first-pass guarantee.
Files needed for an RO3003 PCB quotation
- Gerber or ODB++ files and NC drill data
- Layer order, finished thickness and copper by layer
- Exact RO3003 thickness, cladding type and copper weight
- Bonding material and hybrid-material requirements
- Controlled-impedance table with line type and reference layers
- Operating frequency, loss target and temperature range
- Finished-hole sizes and any mechanically drilled blind-via layer pairs
- Surface finish, solder mask and assembly profile
- Material substitution, certificate and traceability requirements
- Prototype and production quantities
These inputs let QFPCB review the electrical model, material availability, lamination, drilling, plating and inspection plan before tooling. They also prevent a quotation from silently assuming RO3003G2, another copper type or an inappropriate bonding system.
Frequently asked questions
What is the dielectric constant of Rogers RO3003?
Rogers publishes a process Dk of 3.00 ± 0.04 at 10GHz and 23°C using IPC-TM-650 2.5.5.5. The published design Dk is 3.00 from differential phase length testing across 8-40GHz. Use the design value as a starting point and model the actual stackup, copper and geometry.
What is the dissipation factor of RO3003?
The official RO3000-series datasheet lists a typical RO3003 Df of 0.0010 at 10GHz and 23°C using IPC-TM-650 2.5.5.5. This is a laminate property under a specific method. Finished-circuit loss also includes conductor roughness, trace geometry, connectors, transitions, radiation and surface finish.
Is RO3003 suitable for 77GHz radar?
Rogers states that RO3003 laminates can be used in applications up to 77GHz and lists automotive radar among typical applications. Suitability for a specific radar requires antenna, transmission-line, thickness, copper, finish, fabrication tolerance and environmental analysis. The datasheet statement is not a finished-board performance guarantee.
Is RO3003 the same as RO3003G2?
No. RO3003 and RO3003G2 are separate Rogers products. They should not share a single uncontrolled material line on a drawing. If substitution is proposed, compare the current official datasheets and exact constructions, then obtain the necessary design-owner, customer or regulatory approval before QFPCB changes the material.
Can QFPCB build an HDI RO3003 board?
QFPCB does not offer HDI or Any-Layer HDI stackup design for high-frequency RO3003 projects. We can review high-frequency hybrid stackups or mechanically drilled blind-via structures and provide impedance simulation and technical support. Send the complete layer pairs, hole geometry, bonding system and press-cycle assumptions for engineering review.
What standard RO3003 thicknesses are available?
The official datasheet lists 0.005, 0.010, 0.020, 0.030 and 0.060in, corresponding to 0.13, 0.25, 0.51, 0.76 and 1.52mm. Each thickness has a published tolerance. Other configurations may be available from Rogers, but current supply must be confirmed for the quoted project.
Can RO3003 be combined with FR-4?
Yes, Rogers identifies RO3000 materials as suitable for epoxy-glass multilayer hybrid designs. A workable stackup still requires compatible bonding material, lamination temperature, resin flow, CTE, copper balance and dimensional compensation. QFPCB reviews the complete hybrid construction; the material-family statement does not approve every layer combination.
What should I send for an RO3003 impedance review?
Send the layer stack, exact RO3003 thickness and copper, bonding material, finished copper, trace widths and spaces, reference planes, impedance targets, operating frequency, solder-mask condition, finish and via structure. Include whether the design is homogeneous, hybrid or uses mechanically drilled blind vias so the calculation matches the intended build.
Request a Rogers RO3003 PCB review
Send QFPCB your fabrication data, RO3003 construction, frequency range, impedance table, hybrid layer plan and via requirements. We will review material availability, PTFE processing, stackup feasibility and the inputs needed for a controlled quotation before tooling.
For a nearby low-Dk PTFE comparison, review the RT/duroid 5870 and 5880 material guide; the products use different reinforcement systems and must not be treated as direct drop-in replacements.
Official source: Rogers RO3000 Series Circuit Materials datasheet, Publication #92-130.
