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In this article, we’ll discuss what really characterizes the high speed Rogers XtremeSpeed™ RO1200™ laminate. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the high speed print circuit board, so please feel free to contact us.
What is The Rogers XtremeSpeed™ RO1200™ Laminate?
XtremeSpeed™ RO1200™ extremely low loss digital circuit materials are ceramic-filled laminates reinforced with woven fiberglass. These materials are specifically engineered to provide exceptional electrical performance and mechanical stability for the most demanding high-speed applications.
XtremeSpeed RO1200 series laminates integrate the surface smoothness characteristic of non-woven PTFE laminates, enabling finer line etching tolerances, with the structural rigidity of woven-glass PTFE laminates. These materials can be processed into printed circuit boards utilizing standard PTFE circuit board fabrication techniques as detailed in the application note titled “XtremeSpeed RO1200 Extremely Low Loss Digital Laminate Quick Reference Processing Guide.”
The Rogers RO1200™ Series Circuit Materials are designed to address the challenges of high-speed digital and RF applications, offering a unique combination of electrical performance, thermal stability, and manufacturability. The XtremeSpeed RO1200 series laminates are produced under a quality system certified to ISO 9001 standards.
Rogers XtremeSpeed™ RO1200™ Laminate Data Sheet
Features of The Rogers XtremeSpeed™ RO1200™ Laminate
Low Dielectric Constant (Dk)
A lower dielectric constant minimizes signal loss and enhances signal speed, ensuring that circuits operate at optimal efficiency even in high-frequency environments. Optimized for controlled impedance and reduced signal propagation delays, critical for high-speed data transmission.
Ultra-Low Dissipation Factor (Df)
With reduced energy loss as heat, the RO1200™ materials maintain excellent signal integrity, making them ideal for critical communication applications. Minimizes signal loss, ensuring superior signal integrity even at multi-gigabit speeds.
Low Profile Copper for Reduced Insertion Loss
The incorporation of low profile copper minimizes insertion loss, thereby boosting overall circuit performance and ensuring high fidelity in signal transmission. Reduces insertion loss and skin effect, enhancing performance in high frequency RF and millimeter-wave applications.
Low CTE and High Thermal Stability (Td: 500°C TGA)
The material’s low Coefficient of Thermal Expansion (CTE) and high decomposition temperature (Td) ensure outstanding thermal stability, which is crucial for maintaining performance under varying operational conditions. Matches closely with copper, minimizing via cracking and ensuring reliability under thermal stress. Withstands high-temperature processing and harsh operating conditions.
Excellent Thermal and Mechanical Performance
Designed to endure harsh environments, these materials provide robust thermal and mechanical stability, ensuring long-term reliability in electronic systems. Reduces signal skew in high-speed differential pairs, critical for maintaining timing accuracy.
Spread Glass for Reduced Signal Skew
The use of spread glass helps to evenly distribute signals across the circuit board, reducing signal skew and ensuring consistent performance in high-speed digital applications. Ensures dimensional stability and durability in demanding environments.
Applications of The Rogers XtremeSpeed™ RO1200™ Laminate
The impressive performance characteristics of the Rogers RO1200™ Series make it well-suited for a range of high-performance applications, including:
Core/Edge IP Routers and Switches
XtremeSpeed RO1200 series laminates are widely utilized in the manufacturing of Core/Edge IP Routers and Switches, playing a crucial role in enhancing the performance and reliability of these networking devices. These laminates are specifically designed to meet the stringent requirements of high-speed data transmission, ensuring efficient signal integrity and minimal interference.The stable electrical properties support the high data rates and reliability required in critical network infrastructure.
High performance computing (HPC) servers，Switching and Storage
XtremeSpeed RO1200 series laminates are extensively utilized in High Performance Computing (HPC) servers, switching systems, and storage solutions, playing a crucial role in enhancing the performance and reliability of these critical infrastructure components.
In HPC servers, XtremeSpeed RO1200 series laminates provide superior electrical performance, ensuring minimal signal loss and crosstalk. These laminates are designed to support high frequency applications, making them ideal for environments where data processing speed and accuracy are paramount. For instance, in scientific research and complex simulations, even minor improvements in signal integrity can lead to significant gains in computational efficiency.
Backplanes
The high-speed signaling and minimal loss characteristics ensure that backplane designs can meet the rigorous demands of modern data processing and telecommunications systems. Delivers stable performance in high layer count, high density designs for aerospace and defense systems.
Automated Test Equipment (ATE)
Provides repeatable accuracy in high-frequency testing and measurement systems. Precision and repeatability in testing circuits are achieved thanks to the consistent performance of the RO1200™ Series, making them a trusted choice in the ATE industry.
Manufacturing Advantages of Rogers XtremeSpeed™ RO1200™ Laminate
The unique characteristics of RO1200™ also provide significant benefits in the manufacturing process:
Improved Rigidity for Ease of Handling
The enhanced mechanical rigidity of the materials facilitates easier handling during fabrication, reducing the risk of warpage and defects in complex circuit designs. Facilitates easier handling during lamination and drilling processes, reducing risk of damage.
Optimized for High-Layer-Count Structures
The RO1200™ Series is optimized for use in multilayer circuit boards, where consistent performance and reliability are essential for high-density designs. Maintains performance consistency in complex, multilayer PCB.
Suitable for Lead-Free Processing
Compliance with environmental and regulatory standards is made easier with materials that are well-suited to lead-free soldering processes, supporting modern eco-friendly manufacturing practices. Supports efforts towards creating a healthier environment by reducing the use of hazardous substances in electronic products.
Rogers XtremeSpeed™ RO1200™ PCB Material Standard Thickness
0.003” (0.076mm) +/- 0.0005”
0.004” (0.102mm) +/- 0.0005”
0.005” (0.127mm) +/- 0.0007”
0.006” (0.152mm) +/- 0.0007”
0.007” (0.178mm) +/- 0.001”
0.008” (0.203mm) +/- 0.001”
0.010” (0.254mm) +/- 0.001”
Rogers XtremeSpeed™ RO1200™ PCB Material Standard Size
12” X 18” (305 X 457mm)
24” X 18” (610 X 457mm)
Additional panel sizes available
Rogers XtremeSpeed™ RO1200™ PCB Material Standard Copper Clad
Reverse Treated Electrodeposited Copper Foil
2 oz. (70µm) S2/S2
Rolled Copper Foil
½ oz. (18µm) AH/AH
1 oz. (35µm) A1/A1
Ultimately, Rogers RO1200™ Series Circuit Materials stand at the forefront of high-performance electronics, offering a comprehensive suite of characteristics that ensure low signal loss, robust thermal stability, and reliable mechanical performance. By choosing RO1200™, companies can stay ahead in the fast-paced world of digital electronics, delivering innovative solutions that meet today’s demanding standards.
