MAGTREX™ 555 laminate is a low-loss material with controlled permeability and permittivity, using a ceramic filler and thermoplastic matrix. It offers mechanical and electrical stability, compatibility with standard PCB processing, and impedance matching to air. By balancing μ and ε, it enables antenna miniaturization without bandwidth loss. This makes it ideal for shrinking antennas while maintaining or improving efficiency, especially for devices operating.
In this article, we’ll discuss what really characterizes the Rogers MAGTREX™ 555 high impedance laminate. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the high frequency print circuit board, so please feel free to contact us.
What is The Rogers MAGTREX™ 555 High Impedance Laminate?
MAGTREX™ 555 laminate is an industry-first low-loss laminate with controlled permeability and permittivity. MAGTREX 555 materials are composed of a proprietary, low-loss, high resistivity ceramic filler and a high temperature thermoplastic matrix. This combination results in a system that is conformable, compatible with standard PCB processing techniques, and exhibits both mechanical and electrical stability.
MAGTREX 555 materials provide a miniaturization factor equivalent to a material with a dielectric constant of 30, while maintaining an intrinsic impedance comparable to a material with a dielectric constant of 1. This unique combination makes the material highly suitable for miniaturizing antennas operating below 500 MHz.
When used as part of an antenna design, MAGTREX 555 materials offer designers the ability to produce electrically small antennas with bandwidth and efffciencies not previously possible.
MAGTREX 555 materials are available either with copper for use as a laminate material or without copper for use as a loading element in cavity-backed antennas.
When ordering MAGTREX 555 materials, it is crucial to specify the laminate thickness, whether copper is required, and if so, the desired copper thickness.
Rogers MAGTREX™ 555 High Impedance Laminate Data Sheet
Features of The MAGTREX™ 555 High Impedance Laminate
Matched Permeability and Permittivity with High Miniaturization Factor εμ
The MAGTREX® 555 laminate is designed to deliver substrate impedance closely matched to air (free space), a critical feature for optimizing antenna performance. By balancing magnetic permeability (μ) and dielectric permittivity (ε), it enables antenna miniaturization without sacrificing bandwidth. This unique property allows designers to shrink antenna footprints while maintaining or even improving radiation efficiency a game changer for space constrained devices.
High Temperature Thermoplastic Composite with Low Moisture Absorption
Built for reliability, this laminate is formulated as a high temperature thermoplastic composite that withstands harsh operating conditions. Its low moisture absorption ensures stable performance in humid environments, making it ideal for outdoor or industrial applications where exposure to moisture is unavoidable.
Low Dielectric and Magnetic Loss Below 500 MHz
At frequencies below 500 MHz, the material exhibits exceptionally low dielectric (tan δ) and magnetic losses, translating to high antenna efficiency and reduced energy dissipation. This makes it a prime candidate for VHF/UHF systems where signal integrity and power efficiency are paramount.
Applications of The Rogers MAGTREX™ 555 High Impedance Laminate
The versatility of MAGTREX™ 555 makes it suitable for a wide range of sophisticated applications:
Low-Profile VHF/UHF Antennas
Enable sleek, compact designs for IoT devices, wearables, and military communication systems. The high miniaturization factor allows for the design of compact, efficient antennas suitable for space-constrained applications.
Electrically Small VHF/UHF Antennas
Perfect for applications requiring miniaturized antennas with broad bandwidth, such as RFID tags, medical implants, and portable sensors. The matched permeability and permittivity enhance performance in electrically small antenna designs, ensuring improved radiation efficiency.
VHF Magnetic Components (e.g., Inductors, Transformers)
The material’s low dielectric and magnetic loss characteristics support the development of high efficiency magnetic components, reducing power dissipation and improving system performance. Supports high efficiency inductors, transformers, and filters in power electronics and RF circuits.
Manufacturing Advantages of Rogers MAGTREX™ 555 High Impedance Laminate
Beyond its electrical and thermal properties, MAGTREX™ 555 offers several advantages in terms of manufacturability and mechanical stability:
Environmentally Stable Electrical Performance
The laminate maintains consistent electrical characteristics even under varying temperature and humidity conditions, ensuring long-term reliability in RF applications. Retains consistent properties across temperature fluctuations and humidity levels, reducing post-deployment performance drift.
Flexible and Mechanically Robust
The thermoplastic composite structure provides mechanical resilience, making it suitable for applications requiring durability and structural integrity.The thermoplastic composite can be molded into complex shapes without cracking, enabling custom geometries for specialized applications.
Compatibility with Standard Fabrication Techniques
Easily processed using conventional PCB manufacturing methods (e.g., laser cutting, drilling, lamination), streamlining integration into existing workflows.
Rogers MAGTREX™ 555 High Impedance Material Standard Thickness
0.040” (1.02mm) +/- 0.002”
0.060” (1.52mm) +/- 0.003”
0.080” (2.03mm) +/- 0.004”
0.100” (2.54mm) +/- 0.005”
0.140” (3.56mm) +/- 0.007”
0.200” (5.08mm) +/- 0.010”
0.260” (6.60mm) +/- 0.013”
Rogers MAGTREX™ 555 High Impedance Material Standard Size
12” X 18” (305 X 457 mm)
Rogers MAGTREX™ 555 High Impedance Material Standard Copper Clad
Electrodeposited Copper Foil
1 oz. (35μm)
Ultimately, Rogers MAGTREX 555 high impedance laminates represent a leap forward in material science, bridging the gap between miniaturization and high frequency performance . Whether you’re developing ultra-compact antennas, resilient VHF components, or next-gen IoT devices, this material offers a robust foundation to innovate with confidence. By harmonizing electrical efficiency, environmental durability, and design flexibility, it empowers engineers to push the boundaries of what’s possible in wireless technology.
