In this article, we’ll explore the standout features of curamik® ceramic substrates, their diverse applications, processing advantages, and why they stand out as a preferred choice for demanding applications. The relevant information is available for PCB design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB Corporation provides solutions with reliability at the board level with curamik® ceramic substrates and strong power distribution with ROLINX® busbars.
What is The Curamik® Ceramic Substrates?
Rogers curamik® product suite offers best-in-class metallized ceramic substrates that enable higher power efficiency. Our curamik® substrates feature pure copper bonded or brazed to a ceramic substrate, enabling them to handle higher currents, offer superior voltage isolation, and operate effectively across an extensive temperature range.
Our curamik® Ceramic substrates offer high heat conductivity, high heat capacity and thermal spreading of the substrates’ thick copper cladding, making our substrates indispensable to power electronics. The low coefficient of thermal expansion of the ceramic substrate means they outperform substrates based on metal or plastic.
In the world of advanced electronics and high-temperature systems, material innovation is the backbone of reliability and efficiency. Rogers Curamik® metallized ceramic substrates stand out as a cutting-edge solution designed to meet the rigorous demands of modern high-performance applications. Combining exceptional thermal management, electrical insulation, and mechanical durability, these substrates are engineered to excel in environments where ordinary materials falter.
Benefits of Curamik® Ceramic Substrates
- Great heat conductivity and temperature resistance
- High insulation voltage
- High heat spreading
- Low coefficient of thermal expansion outperforms metal or plastic substrates
- Adjusted expansion coefficient enables chip on board
- Efficient processing of master cards and single pieces
- Range of formulations optimized for various power applications
Curamik® Ceramic Substrates Product Information
Curamik® Power
Rogers curamik Power substrates are the cost-effective industry standard, with wide-ranging usage in low and medium power output applications.
Our curamik Power substrates are comprised of Al2O3 Direct Bond Copper (DBC), offering the industry’s best price-performance ratio. Al2O3 DBC substrates are offered in many thickness combinations to suit specific applications. This allows control of thermal resistance, which is determined by the heat conductivity and thickness of the ceramics used in the substrate. Our curamik Power substrates can be used in applications with low and medium power output, such as general power electronics, concentrated photovoltaics (CPV), Peltier elements and semiconductor modules for automotive applications.
Features and Benefits：
- Offers thermal conductivity of 24 W/mK @ 20°C
- Available in many thickness combinations
- CTE of 6.8 ppm/K @ 20°C – 300°C
- Offers sufficient thermal and mechanical properties for the most common applications
- Has the capability to carry high electrical currents and high ampacity
- Provides performance and reliability for the life of the product
Curamik® Power Plus
Rogers curamik Power Plus substrates are tough and reliable enough to go the distance for medium power applications.
Our curamik Power Plus substrates are based on Zr doped Al2O3 HPS ceramic. The doping process provides enhanced robustness and improved properties when exposed to mechanical constraints. These substrates offer a longer lifetime and greater reliability and performance than alumina substrates, and it comes at a competitive price point. Common uses include automotive power electronics and advanced industrial applications.
Features and Benefits：
- Alumina (9% ZrO2 doped)
- Offers thermal conductivity of 26 W/mK @ 20°C
- Available in many thickness combinations
- CTE of 7.1 ppm/K @ 20°C – 300°C
- Offers enhanced robustness and reliability for a small price premium
- Has a longer lifetime than alumina substrates
Curamik® Endurance
Rogers curamik Endurance substrates offer enhanced reliability performance and extraordinary increased lifetime compared to its alternative standard DBC substrates.
Our curamik Endurance substrates provide enhanced reliability performance compared to material combinations of the same dimensions. This reliability improvement makes the new substrates well suited for high power applications, such as in EV/HEV, vehicle electrification, general industrial, renewable energy and mass transit. curamik Endurance extends the field of applications for DBC.
Features and Benefits：
- Available copper thickness of 0.3 mm
- Ceramic Types available include Al2O3 , HPS (ZTA), AlN
- Thermal conductivities of 24, 26 and 170 W/mK
- Ceramic available in multiple thicknesses according to standard Rogers DBC design rules
- Enhanced reliability performance compared to material combinations of the same dimensions
- Suitable for high power applications
- Extraordinary increased lifetime
- Known material and combinations allow for easy implementation
The three curamik Endurance Substrates available include:
Curamik Endurance (Al2O3)
- Offers thermal conductivity of 24 W/mK @ 20°C
- CTE of 6.8 ppm/K @ 20°C – 300°C
- Available in many thickness combinations
Curamik Endurance Plus (HPS)
- Alumina (9% ZrO2 doped)
- Offers thermal conductivity of 26 W/mK @ 20°C
- CTE of 7.1 ppm/K @ 20°C – 300°C
- Available in many thickness combinations
Curamik Endurance Thermal (AlN)
- Based on Aluminum Nitride ceramics
- Offers thermal conductivity of 170 W/mK @ 20°C
- CTE of 4.7 ppm/K @ 20°C – 300°C
- Available in many thickness combinations
Curamik® Performance
Rogers curamik Performance substrates offer the best blend of value and performance in demanding, high-power applications.
Our curamik Performance substrates are based on Si3N4 ceramics joined with copper by active metal brazing (AMB). These substrates are ideal for applications that demand a long lifetime, high power density and robustness. Rogers curamik Performance is great for use in automotive power electronics, high reliability power modules, renewable energy and traction.
Features and Benefits：
- Thermal conductivity of 90 W/mK @ 20°C
- Available in 6 thickness combinations
- CTE of 2.5 ppm/K @ 20°C – 300°C
- Superior performance in high demand, high power applications
- Enables higher power density
- Great balance of cost and performance
Curamik® Thermal
Rogers curamik Thermal combines best-in-class thermal conductivity with strong mechanical stability to provide optimal performance in very high power density applications.
Our curamik Thermal substrates offer the best thermal conductivity in the industry. The substrates’ AIN Direct Bond Copper (DBC) provides an adjusted thermal expansion coefficient, which is closer to that of silicon and results in little tension in the solder layer between chip and substrate. Our high-performance curamik Thermal material may be used in very high power density applications, such as train drives, wind turbines and industrial semiconductor modules.
Features and Benefits：
- Based on Aluminum Nitride ceramics
- Offers thermal conductivity of 170 W/mK @ 20°C
- Available in many thickness combinations
- CTE of 4.7 ppm/K @ 20°C – 300°C
- Best thermal conductivity in the industry
- Ideal for very high power density applications
- Low CTE and minimal tension in solder layer between chip and substrate
- Provides a lifetime of high performance and reliability
Performance overview
Curamik® high temperature/high voltage substrates consist of pure copper bonded to a ceramic substrate such as Al2O3 (Alumina), AlN (Aluminum Nitride), HPS (ZrO2 doped) or silicon based Si3N4 (Silicon Nitride).
Curamik provides two technologies to attach the substrate with the copper. DBC (direct bond copper) – a high temperature melting and diffusion process where the pure copper is bonded onto the ceramic and AMB (active metal brazing) – a high temperature process where the pure copper is brazed onto the ceramic substrate.
The high heat conductivity of Al2O3 (24 W/mK), AlN (170 W/mK) and Si3N4 (90 W/mK) as well as the high heat capacity and thermal spreading of the thick copper cladding (127 – 800 µm) makes our substrates indispensable to power electronics. The mechanical stress on silicon chips mounted directly on the substrate (Chip on Board) is very low, since the coefficient of thermal expansion (CTE) of the ceramic substrate is better matched to the CTE of silicon compared to substrates using a metal or a plastic basis. Rogers produces high temperature/high voltage substrates in a master card format that measures 5“ x 7“ and 5.5“ x 7.5“. The individual parts can be left in the master card format to support more efficient assembly and mounting of components before being separated into individual pieces. We also offer single pieces for single piece assembly.
Available thickness combinations DBC
Typ. width of/spacing between conductors
Surface options
Applications of Rogers Curamik® Ceramic Substrates
Rogers Curamik® substrates are pivotal in industries that demand precision, durability, and thermal resilience. Key applications include:
Air Conditioning and Heating
One of the top drivers of global electricity demand is the growth of the air conditioning and heating systems market. HVAC systems increasingly need to meet stringent minimum energy performance standards and must be more energy efficient, easier to use and maintain and capable of programming to optimize comfort and costs. HVAC design engineers focus on increasing motor efficiency and how motors are integrated and controlled within systems. Being able to operate motors at reduced speeds/horsepower to meet actual load requirements and using variable frequency drives or high efficiency torque motors with performance-optimized power electronics has the potential for dramatic energy savings.
Advancement in power electronics has enabled HVAC inverter technology to thrive by the use of microcontroller and IGBT modules to drive the compressor DC or AC motor. The speed of the compressor motor can be varied by using the variable frequency drive. Highly efficient switching power devices, such as IGBTs and MOSFETs, help to increase the efficiency, power density and reliability of power switches, and to provide lowest conduction losses.
Commercial Avionics
Advances in avionics and circuit board design have allowed the aerospace industry to advance. The magnitude of on-board power demand and unique design aspects of on-board avionics systems leads to considerable challenges for thermal management. Environmental conditions often include extreme temperature ranges, pressure variations and the ability to withstand and operate during high g-force maneuvers. If avionics systems are unable to withstand extensive shock, vibrations and thermal challenges, a dangerous situation may ensue.
Control Systems
The trend towards control systems and automation increasing means an importance on enabling advanced power electronics technologies. As the number of control systems has increased throughout operations, so has the number of devices drawing power from the utility grid. This leads to greater dependency on the level of power quality. However, increasingly sensitive electronics make control systems vulnerable to noise, harmonic producing loads and dangerous frequency variations. Companies lose billions of dollars every year due to voltage surges and power outages.
High power quality and system availability are the main drivers that ensure a reliable, high quality process. To assure continuous operation and data protection, control systems need an effective way to minimize distortions and distribute power.
Converters for Wind Turbines and Solar Farms
Wind and solar energy are industries undergoing momentous technological changes. The power grid parity goal —where the cost of solar or wind power matches and exceeds that of traditional energy electricity generation types—is getting closer, as the conversion of dc power from the systems to usable ac becomes more efficient and affordable. In wind turbines and solar farms, power semiconductors convert variable voltage inputs to fixed voltage outputs for connection to the grid. Power system circuitry must be able to operate safely in a wide range of harsh environments involving widely varying temperatures, humidity and even salt levels in offshore installations. Designs must be high reliability, high efficiency, with low voltage ride through and very low output frequencies.
The next wave of advancement in wind turbines and solar panels for renewable energy will be driven by new technologies for power converter systems. The emergence of advanced and sophisticated multilevel power switching topologies will enable faster power switches, higher operating voltages (up to 1600 VDC) and higher performance. Smaller, faster systems will require improvements throughout the power conversion chain. Semiconductor-based power electronics will play a major role by boosting performance, minimizing power losses and optimizing thermal management.
Electric Motors
Getting better efficiency from electric motors is more important than ever, and power electronics are playing a vital role. Electric motors are used in a broad range of industrial, commercial and residential applications including fans, pumps, compressors, elevators and refrigerators. Due to the large usage of electric motors, increasing the efficiency of motor-drive systems could result in a significant reduction in global electricity consumption. Motor drives are becoming more efficient as power electronic devices like power switches (IGBTs and MOSFETs), gate drivers and bias supplies are being incorporated. Semiconductors also play a major role in electric motors by boosting performance, minimizing power losses and optimizing thermal management.
eTrucks, eBusses, Forklifts
Driven by environmental and fuel economy concerns, the transition to electric vehicle power goes beyond passenger cars to utility vehicles, trucks, buses and industrial/material handling vehicles like forklifts. The growth in these heavy-duty electric vehicles brings challenges for many areas, including motor controllers, converters, battery management systems and new power electronics systems. Heavy equipment requires more battery packs, more powerful motors and an array of sophisticated power conversion systems. Whether it be an electric bus, e-truck or semi-truck, or other utility vehicles, all require highly durable power electronics and reliable power semiconductor technology.
EV/HEV Converters, Inverters and Electric Powertrains
As additional electrical functionalities are integrated into new cars to increase the comfort and safety of drivers and passengers, electrification in the automotive market increases. A key area of focus is the electrification of the powertrain, from mild hybrid to the full electric vehicle. This trend to more electrification results in the need for more power.
Higher current voltage applications are required to drive all new electric functionalities within strict mechanical boundaries. As power from a battery is expensive, the challenge is to use the electric power as efficiently as possible. To achieve this, the primary inverter needs to minimize switching losses and maximize thermal efficiency. Auxiliary inverters are used to power vehicle electrification solutions. The range of the vehicle is directly related to the efficiency of these inverters.
Long term reliability in harsh environmental conditions and vibration resistance are essential for under-the-hood applications. Efficient thermal management provides long term reliability by minimizing thermally induced stresses. The efficient dissipation of heat generated by IGBT power modules used in electric vehicles is critical to system quality and reliability. Design concepts such as integrating the inverter, DC-DC converter and electronic control unit, along with reducing the number of IGBT power chips, help design engineers to lower the size and weight of key systems, like the powertrain, and significantly reduce costs.
Power Converters and Power Inverters
The emergence of new power architectures and new applications – including electric vehicles, consumer electronics and renewable energy – drives expanded use of converters to change alternating current (AC) to direct current (DC), DC to DC, as well as power inverters to convert DC to AC. In parallel, the demands for higher energy efficiency and performance in today’s high current and voltage applications means converters and inverters must be able to take the heat, without losing power. Semiconductors play a major role in power converters by boosting performance, minimizing power losses and optimizing thermal management.
Power Transistors
Demand for smaller, higher efficiency power conversion products is driving adoption of transistor devices. The recent focus for these devices is on efficiency with an emphasis on higher voltages in smaller sizes. As size gets smaller, challenges of managing heat, space and reliability increase. That’s where Advanced Electronics Solutions from QFPCB can make a big difference.
Propulsion Systems
Propulsion systems for rail, shipping or heavy equipment require high power capabilities. High current and high voltage, in combination with extreme environmental conditions, create challenges for optimizing power distribution. Operational continuity is essential for propulsion engines and electric power systems. Any defect, failure or system shutdown can have severe consequences on traction systems and result in a high financial impact. Therefore, high quality standards and enhanced reliability are the main focus during system development.
Satellite Power Management
In space, malfunction or failure as that may jeopardize an entire mission as power electronics cannot be repaired or replaced. Radiation and the absence of atmosphere and gravity make it necessary to use radiation-hardened components that dissipate heat by conduction and radiation only. Special provisions are required to prevent damage and provide reliable, long-term, unattended operation when it comes to designing how satellites are powered.
Addressing the unique challenges of satellite power supply design, curamik® ceramic substrates excel in demanding applications that require a long lifetime, high reliability and robustness. Si3N4 ceramic substrates, for example, carry higher currents and provide higher voltage isolation. They operate over a wide temperature range. In addition, the different metal layers are combined hermetically using the curamik bonding process.
The high heat conductivity, along with the high heat capacity and thermal spreading of the thick copper cladding, makes curamik substrates indispensable to power electronics, particularly for mission-critical applications like satellite power management.
Semiconductor Elements
Thermoelectric power generation (TEG) represents one of the cleanest methods of energy conversion available today, but it still has challenges. Thermoelectric generators, or Seebeck generators, are active heat pumps. They are compact, solid state devices that can be used to cool components below ambient temperature, a task not possible using conventional cooling or even heat pipes. Unlike heat engines, the solid state electrical components typically used to perform thermal to electric energy conversion have no moving parts. The thermal to electric energy conversion uses components that require no maintenance, have inherently high reliability and can be used to construct generators with long service-free lifetimes. These generators are often used for low power remote applications or where bulkier but more efficient heat engines would not be possible.
The biggest challenges with these semiconductor elements are their high power usage and high power dissipation. Ceramic substrates and busbars play a major role in Seebeck generators and Peltier elements by boosting performance, minimizing power losses and optimizing thermal management.
Smart Grid: Transmission & Distribution
Much like the Internet, the Smart Grid will consist of controls, computers, automation, and new technologies and equipment working together with the electrical grid to respond digitally to quickly changing electric demand. From smart meters to energy gateways, power electronics is an extremely important element in modern smart grid systems. In the modern electric power grid, power electronics is indispensable in high-voltage dc (HVDC) system, static VAR compensators (SVCs), flexible ac transmission system (FACTS)-based active and reactive power flow control, uninterruptible power system (UPS), fuel-cell-based energy system, etc.
Solar Inverters
A solar inverter or photovoltaic (PV) inverter, is a voltage converter that converts the variable direct current (DC) output of a photovoltaic (PV) solar panel into a utility frequency alternating current (AC) that can be fed into a commercial electrical grid or used by a local, off-grid electrical network. The inverter is the key component in any solar energy system. It is often the single most expensive item and is becoming more complex as new semiconductor technologies deliver fast switching frequencies and higher power densities. Inverter designers continue to innovate and bring down cost, while maintaining key attributes for a solar energy system (reliability, efficiency and features such as data monitoring), in order to drive more PV penetration. System designers need to maximize efficiency by reducing power losses inside the electronics that handle power conversion control.
Vehicle Electrification
Electrification in the automotive market is increasing as a way to reduce CO2 emissions while offering a wide array of vehicle functionalities. This trend to more electrification results in the need for more power. Higher current voltage applications are required to drive all new electric functionalities within strict mechanical boundaries. Additionally, long term reliability in harsh environmental conditions is essential for under-the-hood applications.
As vehicle electrification continues, designers need to ensure sufficient and efficient power to all high-current devices. Traditional 12V networks now operate in conjunction with 48V systems. Many cars will soon have 48-volt electrical systems. They will power stop-start motors, hybrid motors and turbochargers, allowing for smaller engines with better fuel economy and performance. Networks powering these will include a variety of power electronics, from MOSFETs to IGBT based power modules and embedded power electronic systems.
Variable Frequency Drives & Uninterrupted Power Supplies
Current demands for consistent, high quality and cost effective power increases demands for a variable-frequency drive (VFD) and uninterruptible power supply (UPS) systems. Both of these systems are susceptible to power quality issues from the line power that supplies them. Rogers’ ROLINX® busbars serve as power distribution “highways,” providing a customized liaison between the power source and capacitors, resistors, integrated circuits (ICs), integrated gate bipolar transistors (IGBTs) or complete modules. Laminated busbars offer numerous benefits, including reducing part count, virtually eliminating assembly errors, addressing component and personal safety issues and improving the overall system. Busbars can minimize inductance, which results in better switching performance and lower switching losses.
White Goods
White goods, also known as large, electrical, home appliances, are available in a wide variety of options. Whether it be washing machines, dishwashers, refrigerators or ranges, home appliances must be more energy efficient, quieter, easier to maintain and equipped with safety and diagnostic features. Continually evolving efficiency standards challenge designers to provide safe and reliable power, as well as high performance with lower power consumption and lower bill-of-material (BOM) costs.
Increasing demand for smart appliances adds modular communication features to many home appliances. These devices can connect to the utility grid and receive signals that adjust their operation for peak-load management and lower consumer costs. Therefore, kitchen appliances need an effective way to distribute power for a wider array of functions and minimize conduction losses.
Ultimately, Rogers Curamik® Metallized Ceramic Substrates represent a significant advancement in materials technology, especially for applications requiring high thermal and electrical performance. By choosing Curamik®, manufacturers can leverage advanced material properties to create innovative products while ensuring optimal performance and reliability. That’s where Advanced Electronics Solutions from QFPCB corporation can make a big difference.
