Rogers CuClad 217 CuClad 233 And CuClad 250 Series Laminates That Is A Premier Choice For Microwave Printed Circuit Board Substrates Applications

Rogers CuClad 217, CuClad 233 and CuClad 250 series laminates are woven fiberglass/PTFE composite materials for use as printed circuit board substrates.The woven fiberglass reinforcement in CuClad products provides greater dimensional stability than non-woven fiber glass reinforced PTFE based laminates of similar dielectric constants.

In this article, we’ll discuss what really characterizes the high frequency Rogers CuClad 217, CuClad 233 and CuClad 250 Series Laminates. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the high frequency print circuit board, so please feel free to contact us.

CuClad pcb 1
2L CuClad pcb

What is The Rogers CuClad® Series Laminates?

Rogers CuClad 217, CuClad 233 and CuClad 250 series laminates are woven fiberglass/PTFE composite materials for use as printed circuit board substrates. Using precision control of the fiberglass/PTFE ratio, CuClad laminates offer a range of choices from the lowest dielectric constant and loss tangent to a more highly reinforced laminate with better dimensional stability.

The woven fiberglass reinforcement in CuClad products provides greater dimensional stability than non-woven fiber glass reinforced PTFE based laminates of similar dielectric constants. The consistency and control of the PTFE coated fiberglass cloth allows Rogers to offer a greater variety of dielectric constants and produces a laminate with better dielectric constant uniformity than comparable non-woven fiberglass reinforced laminates. These properties make CuClad an attractive choice for filters, couplers and low noise amplifiers.

CuClad laminates are crossplied (alternating layers of coated fiberglass plies are oriented 90° to each other). This provides true electrical and mechanical isotropy in the XY plane, a feature unique to CuClad laminates. No other woven or nonwoven fiberglass reinforced PTFE based laminates make this claim. Designers have found this degree of isotropy critical in some phased array antenna applications.

CuClad 217 (Er=2.17, 2.20) uses a low fiberglass/PTFE ratio to provide the lowest dielectric constant and dissipation factor available in fiberglass reinforced PTFE based laminates. Together, these properties offer faster signal propagation and higher signal/noise ratios.

CuClad 233 (Er=2.33) uses a medium fiberglass/PTFE ratio to balance lower dielectric constant and improved dissipation factor without sacrificing mechanical properties.

CuClad 250 (Er=2.40–2.60) uses a higher fiberglass/PTFE ratio to provide mechanical properties approaching those of conventional substrates. Better dimensional stability and lower thermal expansion in all directions are other significant benefits. For critical performance applications, CuClad products may be specified with an “LX” testing grade; this designates that each sheet will be tested individually, and a test report will be issued with the order. “LX” designated products are higher priced, as a portion of each sheet is utilized in destructive testing.

Rogers CuClad® Series Laminates Data Sheet

Features of The Rogers CuClad® Series Laminates

Cross-Plied Woven Fiberglass,Alternating Plies Are Oriented 90° to Each Other

CuClad® laminates utilize a cross-plied woven fiberglass structure, where alternating plies are oriented 90° to each other. This design enhances mechanical stability, reduces dimensional variation under thermal stress, and ensures uniform dielectric properties across the X-Y plane—a critical factor for high frequency signal integrity.

High PTFE-to-Glass Ratio

The series boasts a high polytetrafluoroethylene (PTFE) to glass ratio, which is critical for maintaining excellent performance under demanding conditions. The increased PTFE content helps lower the overall dielectric loss, ensuring signal integrity even at high frequencies.

Superior Dielectric Constant Uniformity

Compared to non-woven fiberglass-reinforced alternatives, CuClad® laminates offer exceptional DK consistency. This uniformity minimizes phase distortions and impedance mismatches in high-speed designs, making them ideal for precision applications like phased-array antennas.

Excellent Thermal Conductivity

With excellent thermal conductivity, CuClad® Series Laminates efficiently dissipate heat, preventing overheating and ensuring stable operation. The material’s efficient heat dissipation capabilities help manage thermal loads in high power systems, reducing the risk of performance degradation or component failure.

Low Water Absorption

With minimal moisture uptake (<0.03%), the low water absorption makes these laminates ideal for environments where moisture resistance is crucial, enhancing durability and longevity.

Applications of The Rogers CuClad® Series Laminates

Rogers CuClad 217, CuClad 233 and CuClad 250 series laminates are engineered to meet the rigorous demands of advanced systems:

Military Electronics (Radars, ECM, ESM)

Essential for military electronics such as radars, electronic countermeasures (ECM), and electronic support measures (ESM), where reliability and performance under harsh conditions are critical. Reliability under extreme conditions supports jamming and surveillance systems. Facilitating high speed signal processing and secure communications.

Microwave Components (LNAs, filters, couplers, etc.)

Ideal for microwave components including low-noise amplifiers (LNAs), filters, couplers, and other high-frequency devices, providing efficient and reliable performance. Minimized signal loss enhances sensitivity. Tight impedance control enables precise frequency response. Enhancing the performance of microwave circuits by maintaining high signal integrity and minimizing interference.

Manufacturing Advantages of Rogers CuClad® Series Laminates

Rogers CuClad 217, CuClad 233 and CuClad 250 series laminates, the unique characteristics of CuClad® also translate into significant manufacturing benefits:

Electrical and Mechanical Isotropy in the X-Y Plane

One of the processing advantages of Rogers CuClad® Series laminates is their excellent electrical and mechanical isotropy in the X-Y plane. This means that the material exhibits uniform properties regardless of the direction, simplifying the design and fabrication process for circuit boards.

Extremely Low Loss at High Frequencies

The combination of high PTFE content and a well-engineered fiberglass weave results in extremely low dielectric loss. This feature is particularly critical for high-frequency applications where any signal degradation can be detrimental.

Well Suited for Er Sensitive Circuits

For circuits that demand tight control over the effective dielectric constant (Er), Rogers CuClad® laminates provide a stable platform. Their consistent dielectric properties ensure that ER sensitive circuits maintain optimal performance, reducing the risk of unwanted variations and signal losses.

Rogers CuClad® Series PCB Material Standard Thickness

0.010″ (0.25mm) ±0.0010″
0.020″ (0.51mm) ±0.0020″
0.031″ (0.79mm) ±0.0020″
0.062″ (1.57mm) ±0.0020″
*Additional non-standard thicknesses available from 0.005″- 0.250″ in varying increments.

Rogers CuClad® Series PCB Material Standard Size

18″ X 12″ (457 x 305mm)
18″ X 24″ (457 x 610mm)
*Additional panel sizes available.

Rogers CuClad® Series PCB Material Standard Copper Clad

Electrodeposited Copper Foil
1/2oz. (18μm) HH/HH
1oz. (35μm) H1/H1
*Additional claddings, such as heavy metal, resistive foil and unclad, are available.

Ultimately, Rogers CuClad 217, CuClad 233 and CuClad 250 series laminates bridge the gap between high-frequency performance and manufacturability. Moreover, the manufacturing advantages offered by CuClad®, including electrical and mechanical isotropy, extremely low loss, and suitability for Er sensitive circuits, make it an invaluable asset for manufacturers seeking to enhance product performance while maintaining cost effectiveness.

If you have any further questions, please feel free to leave a comment below or contact QFPCB by email ([email protected]).

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