Building on the success of AD300D, AD255C and DiClad 880 product grades, the IM Series laminates introduce a newly developed IM cladding solution. This combination of ultra-low roughness IM foil with the controlled dielectric performance found in the selected laminates results in a family of ultra-low PIM laminate solutions that are unrivaled in PTFE laminates in today’s base station antenna market. The IM Series materials are specifically recommended for applications with highly demanding PIM requirements.
In this article, we’ll discuss what really characterizes the Rogers AD255C-IM, AD300D-IM and DiClad 880-IM Series™ high frequency laminates. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the high frequency print circuit board, so please feel free to contact us.
What is The Rogers IM Series™ Antenna Laminates?
IM Series™ high-frequency laminates represent an exceptional Passive Intermodulation (PIM) performance enhancement of our AD300D™, AD255C™ and DiClad® 880 antenna-grade laminates. These specialized materials from Rogers Corporation are meticulously engineered and manufactured to meet the stringent demands of modern base station antenna markets.
The IM Series materials are specifically recommended for applications with highly demanding PIM requirements. Building on the success of AD300D, AD255C and DiClad 880 product grades, the IM Series laminates introduce a newly developed IM cladding solution. This includes an ultra-smooth (Rq = 0.5 µm as measured by non-contact interferometry) electrodeposited copper foil cladding option that exhibits superior adhesion to the substrate materials.
This combination of ultra-low roughness IM foil with the controlled dielectric performance found in the selected laminates results in a family of ultra-low PIM laminate solutions that are unrivaled in PTFE laminates in today’s base station antenna market. The PIM performance of all substrates with the IM cladding has typical values of -166 dBc at 0.030” and -165 dBc at 0.060” using the Rogers internal test method of two 43 dBm swept tones at 1900 MHz. The PIM performance has also been evaluated at frequencies as low as 710 MHz with even better results.
Notably, the standard deviation of the PIM values using the IM1/IM1 cladding was found to be significantly improved vs the standard S1/S1 reverse treated electrodeposited copper foil cladding. s. Minimizing PIM usually involves evaluating the antennas in a cell site or other form of wireless base station. And low-PIM antennas start with printed circuit board laminates that can hold their own against PIM, by means of carefully selected materials, processing, and advanced test techniques. With good design practices and proper understanding, control, and monitoring of the PCB laminate properties, excellent system PIM can be achieved.
Figure 1 shows the improvement of the standard deviation and range of the IM cladding vs the S1 cladding. This improvement affords the antenna designer the opportunity to either increase the average PIM performance over current designs or maintain the current PIM levels while improving antenna production yields.
Figure 1. PIM performance of IM1/IM1 vs S1/S1 cladding on AD300 laminate.
Rogers IM Series™ Antenna Laminates Data Sheet
Features of The Rogers IM Series™ Antenna Laminates
Low PIM (-166 dBc at 0.030”)
Achieving a Passive Intermodulation (PIM) level of -166 dBc at 0.030”, these laminates minimize signal distortion, which is essential for maintaining the integrity and performance of high-frequency antenna systems. Enables the production of high-performance antennas that deliver exceptional reliability even in densely populated frequency bands.
Controlled Dielectric Constant (Dk) and Low Dissipation Factor (Df)
With a dielectric constant (Dk) ranging from 2.17 to 2.94 and a dissipation factor (Df) between 0.0009 and 0.0021 at 10 GHz, these materials offer precise control over signal propagation characteristics, ensuring minimal loss and optimal performance in RF applications.
Advanced PTFE Resin System
Utilizing a PTFE resin system, the IM Series™ enables controlled Dk and low Df, making it ideal for designing high-performance circuits with exacting specifications.The incorporation of a high quality PTFE resin system ensures controlled dielectric properties and low dissipation factors, which are crucial for enabling high-performance designs that require both stability and efficiency.
Uniform Mechanical Properties
Homogeneous material composition guarantees predictable behavior during machining, etching, and assembly, minimizing variability in production. Offers uniform mechanical properties, ensuring consistent performance across the entire laminate surface.
Woven Glass Reinforcement
For excellent dimensional stability, the laminates are reinforced with woven glass fibers. This reinforcement not only enhances mechanical strength but also provides uniform mechanical properties that are critical for consistent performance under varying conditions.
Very smooth copper foil with Rq = 0.5μm by non-contact interferometry method
Featuring very smooth copper foil with an Rq value of 0.5μm measured by non-contact interferometry, the IM Series™ minimizes signal losses and enhances overall signal quality. Supports precision manufacturing processes, contributing to higher quality end products.
Applications of The Rogers IM Series™ Antenna Laminates
The exceptional electrical and mechanical properties of the Rogers IM Series™ laminates make them an ideal choice for a wide range of high-frequency applications:
Cellular Infrastructure Base Station Antennas
Ideal for 5G/LTE networks, their low PIM and stable Dk/Df ensure efficient signal transmission in dense, interference-prone environments. In the demanding environment of cellular networks, low PIM and precise dielectric control ensure that base station antennas deliver robust, interference-free signal transmission.
WiMax Antenna Networks
With the growing deployment of WiMax and other broadband wireless technologies, these laminates support the development of efficient and reliable antenna networks that can handle high data rates and complex modulation schemes.
Carrier-Grade Wi-Fi / Licensed Assisted Access
The material’s ability to maintain performance under demanding conditions makes it a perfect match for advanced Wi-Fi systems and licensed assisted access solutions, where signal clarity and consistency are paramount. Optimized for high-power, low-latency applications, they enable robust performance in Wi-Fi 6/6E and LAA networks.
Communications Systems
Beyond antennas, these high-frequency laminates are used in a variety of communications systems, ensuring that both high-speed data transmission and network stability are maintained even in the most challenging environments. From satellite communications to defense radar, the materials excel in scenarios requiring reliability under extreme operational conditions.
Manufacturing Advantages of Rogers IM Series™ Antenna Laminates
The IM Series laminates are compatible with the processing approaches used for standard PTFE based printed circuit board substrates. In addition to their impressive performance characteristics, the Rogers IM Series™ laminates offer significant benefits during the manufacturing process:
Enables the successful production of high performance antenna designs
The combination of low PIM, smooth copper, and dimensional stability ensures consistent results in high-frequency antenna manufacturing, reducing rework and boosting yield. The materials’ inherent properties enable the successful production of high-performance antenna designs, ensuring that the end products meet the rigorous demands of modern communication systems.
Greater yield on larger panel sizes
The ability to process larger panel sizes translates to greater manufacturing yield, making production more cost-effective and scalable—a crucial advantage for high-volume applications. Optimized for large-format processing, these laminates minimize material waste and maximize throughput, lowering overall production costs.
Maintains mechanical form during handling
The reinforced structure resists warping or deformation during fabrication, assembly, and installation, preserving design integrity. Simplifies the production process, leading to faster turnaround times and increased productivity.
Rogers IM Series™ Antenna PCB Materials Standard Offerings
Ultimately, The Rogers IM Series™ high frequency laminates represent a perfect synergy of advanced material science and practical engineering. Their low PIM, controlled dielectric properties, excellent dimensional stability, and smooth copper finish make them ideally suited for high-performance applications such as cellular base stations, WiMax networks, and carrier-grade Wi-Fi systems. By choosing IM Series™, companies can leverage superior material properties to create innovative, high-performance products while enjoying the economic benefits of streamlined production processes.
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