Rogers is a leading global materials technology company that develops advanced circuit board laminate materials used in high frequency, high performance printed circuit boards. Some of the key things to know about Rogers materials.
QFPCB factory specializes in providing turnkey service of customized PCB & PCBA solutions to meet the diverse needs of our clients. Our factory is committed to providing one-stop PCB & SMT assemble solutions to drive technological advancement and innovation.
QFPCB factory always stocks most the thickness and specifications of RO4003C, RO3003C, RO4350B, RT5880, RT5870,and RO4450F prepregs, which can meet your immediate response PCB needs. We have rich experience in RFID data process engineering and a complete high frequency material processing control system to ensure product design functions. And QFPCB offers the best services when it comes to the Rogers high frequency PCB materials, so you can also call QFPCB to discuss.
What is the Rogers 4003C and Rogers 4350B PCB materials?
Rogers 4003C and Rogers 4350B PCB materials are a type of high-frequency boards that raw material is produced by Rogers company. They are different from the conventional PCB board—epoxy resin (FR4). It has no glass fiber in the middle and uses a ceramic base as the high frequency material. Rogers has superior dielectric constant and temperature stability. Its dielectric constant thermal expansion coefficient is very consistent with copper foil, which can be used to improve the deficiencies of PTFE substrates. It is very suitable for high speed electronic design commercial microwave, and radio frequency applications. Its low water absorption is ideal for high humidity applications, providing customers in the high frequency board industry with the highest quality materials and related resources, which fundamentally enhance product quality.
ROGERS 4003C and ROGERS 4350B have excellent low dielectric loss characteristics. As a result, they provide a more cost-effective and processable high frequency material selection than PTFE materials. They are widely used in antennas of the cellular base station and power amplifiers, microwave point-to-point connection, automotive radars and sensors, radio frequency identification (RFID), direct broadcast satellite high frequency head, and other fields. In addition, the thermal expansion coefficient of the X and Y-axis is similar to that of copper. The expansion coefficient of the Z-axis is much lower than FR4 (46ppm/°C) and has a higher Tg value (>280°C), thus ensuring good thermal stability. The dimensional stability and high reliability of the entire product in PCB processing and assembly will bring more benefits to the design of multilayer circuits.
FEATURES AND BENEFITS: Non-PTFE.
- Fabricates like FR4.
- Processable by a larger number of fabricators.
- UL flammability rating (RO4350B).
- No special through-hole treatments or handling required.
- Lower processing and assembly costs.
- High glass transition temperature (280°C).
- Will not warp during reflow assembly.
- Ensures plated through hole reliability.
Typical Applications:
- LNB’s for Direct Broadcast Satellites
- Microstrip Patch Antennas
- PCS and Cellular Base Station Antennas and Power Amplifiers
- Spread Spectrum Communication Systems
- RF Identification Tags
Excellent high frequency performance due to low dielectric tolerance and loss.
- Ideal for applications with higher operating frequency requirements.
Stable electrical properties versus frequency.
- Repeatable designs.
- Ideal for multilayer and mixed dielectric constructions (hybrid).
Low thermal coefficient of dielectric constant.
- Ideal for applications sensitive to temperature change. Low Z-axis expansion.
- Ensures reliable plated through hole quality. Low in-plane expansion coefficient.
- Excellent reliability of surface mounted assemblies.
- Suitable for use with epoxy glass multilayer board hybrid designs.
Excellent dimensional stability.
- High production yields. Volume manufacturing process.
- Economical laminate pricing.
Chart 1: RO4000 Series Materials Dielectric Constant vs. Temperature
Chart 2: RO4000 Series Materials Dielectric Constant vs. Frequency
Chart 3: Microstrip Insertion Loss
Notes of the Rogers 4003C and Rogers 4350B PCB materials
1) RO4350B 4 mil laminates have a process Dk of 3.33 ± 0.05 and are in conformance with IPC-4103A/240.
2) The design Dk is an average number from several different tested lots of material and on the most common thickness/s.
3) RO4350B LoPro® laminates do not share the same UL designation as standard RO4350B laminates. A separate UL qualifi cation may be necessary.Typical values are a representation of an average value for the population of the property. For specifi cation values contact Rogers Corporation.
RO4000 LoPro laminate uses a modifi ed version of the RO4000 resin system to bond reverse treated foil. Values shown above are RO4000 laminates without the addition of the LoPro resin. For double-sided boards, the LoPro foil results in a thickness increase of approximately 0.0007” (18um) and the Dk is approximately 2.4. The Dk decreases by about 0.1 as the core thickness decreases from 0.020” to 0.004.
In order to support R&D for universities and institutions,The Rogers PCB is for sale at a competitive price, even with small quantity orders. If you have any further questions, please feel free to leave a comment below or contact QFPCB by email ([email protected]).
