Our factory has rich experience in RFID data process engineering and a complete high-frequency material processing control system to ensure product design functions. And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the Rogers RO3203 PCB Materials,so please feel free to contact us.
Rogers PCB is a type of high-frequency board that raw material is produced by Rogers company . It is different from the conventional PCB board—epoxy resin (FR4). It has no glass fiber in the middle and uses a ceramic base as the high-frequency material. Rogers has superior dielectric constant and temperature stability. Its dielectric constant thermal expansion coefficient is very consistent with copper foil, which can be used to improve the deficiencies of PTFE substrates. It is very suitable for high-speed electronic design commercial microwave, and radio frequency applications. Its low water absorption is ideal for high-humidity applications,providing customer in the high-frequency board industry with the highest quality materials and related resources, which fundamentally enhance product quality.
What is the Rogers RO3200™ series laminate?
RO3203™, RO3206™ and RO3210™ High Frequency Circuit Materials are ceramic-filled laminates rein forced with woven fiberglass. These materials are engineered to offer exceptional electrical performance and mechanical stability at competitive prices. The RO3200 Series High Frequency Materials were designed as an extension of the RO3000® Series High Frequency Circuit Materials with one distinguishing characteristic – improved mechanical stability.
The dielectric constant of RO3203 High Frequency Circuit Materials is 3.02. This along with a dissipation factor of 0.0016, extends the useful frequency range beyond 40 GHz. The dielectric constant for RO3206 laminate is 6.15 and 10.2 for RO3210 laminate. The dissipation factor for RO3206 and RO3210 laminates is 0.0027.
RO3200 series laminates combine the surface smoothness of a non-woven PTFE laminate, for finer line etching tolerances, with the rigidity of a woven-glass PTFE laminate. These materials can be fabricated into printed circuit boards using standard PTFE circuit board processing techniques as described in the application note “Fabrication Guidelines for RO3000® Series High Frequency Circuit Materials.”
Features of Rogers RO3200™ laminate for PCBs
Key Features of Rogers RO3200™ Laminate:
- Woven glass reinforcement improves rigidity for easier handling.
- Uniform electrical and mechanical performance is ideal for complex multilayer high frequency structures.
- Low dielectric loss for high frequency performance (RO3203) can be used in applications exceeding 20 GHz.
- Excellent mechanical properties over a wide range of dielectric constants are ideal for multilayer board designs.
- Low in-plane expansion coefficient (matched to copper) is suitable for use with epoxy glass multilayer board hybrid designs and reliable surface mounted assemblies.
- Excellent dimensional stability for high production yields.
- Economically priced for volume manufacturing.
- Surface smoothness allows for finer line etching tolerances.
Typical Applications:
- Automotive Collision Avoidance Systems
- Automotive Global Positioning Satellite Antennas
- Wireless Telecommunications Systems
- Microstrip Patch Antennas
- Direct Broadcast Satellites
- Datalink on Cable Systems
- Remote Meter Readers
- Power Backplanes
- LMDS and Wireless Broadband
- Base Station Infrastructure
Benefits of Rogers RO3200™ series laminate for PCBs
RO3203 is a high-performance material commonly used in microwave and RF (Radio Frequency) applications that require low dielectric loss. The term “low dielectric loss” refers to the ability of the material to minimize signal attenuation or energy dissipation as signals travel through it. This characteristic is particularly important for high-frequency applications, where even small losses can significantly degrade signal integrity.
RO3203 is a type of ceramic-filled PTFE material designed to operate effectively in frequencies above 20 GHz, which is considered a high-frequency range. The material’s low dielectric loss ensures that it maintains consistent electrical performance even in very high-frequency circuits. Its exceptional properties make it suitable for a range of demanding applications, including:
Microwave and millimeter-wave circuits：RO3203 is widely used in devices operating at microwave and millimeter-wave frequencies, including satellite communications, radar systems, and high-speed communication links.
Antenna designs：Due to its low dielectric loss, RO3203 is ideal for high-performance antennas, where signal efficiency and integrity are critical, especially in applications like 5G networks, aerospace, and defense systems.
High-frequency PCB：In high-frequency PCB designs, RO3203 is used to reduce signal degradation, minimize reflections, and enhance overall system performance. It is a popular choice in high-speed digital and RF/microwave circuits due to its stability and reliability.
Test and measurement equipment：RO3203 is also used in specialized test equipment, such as signal generators and analyzers, where accurate high-frequency performance is required to test and validate communication systems or components.
5G and advanced wireless technologies：As the demand for higher data rates and more reliable wireless communication grows, materials like RO3203 play a crucial role in the development of components for next-generation wireless technologies.
In conclusion, RO3203 is an ideal material for applications requiring high-frequency performance above 20 GHz, providing minimal signal loss, excellent electrical properties, and robust performance across a wide range of challenging RF and microwave applications.
Quality of Rogers RO3200™ series laminate for PCBs
Rogers RO3200™ is a series of high-performance laminate materials commonly used in the fabrication of printed circuit boards (PCBs), particularly in applications requiring high-frequency or high-speed performance. The laminate is well-regarded in the PCB industry for its excellent electrical properties, thermal stability, and reliability. RO3200 series laminates are manufactured under an ISO 9002 certified quality system. They are RoHS compliant and suitable for UL 94V-0 certified applications.
Key Features of Rogers RO3200™ Laminate:
High Glass Transition Temperature (Tg)
The RO3200™ laminates have a high glass transition temperature, typically in the range of 280-300°C, which allows them to maintain their structural integrity under high-temperature conditions during the PCB manufacturing process and operation.These laminates demonstrate excellent thermal stability, which helps prevent the material from degrading over time, ensuring long-term reliability in thermal cycling environments.
Good Mechanical Properties
The laminate is designed to be mechanically robust, offering good strength-to-weight ratio, which is essential for the physical integrity of the PCB, especially in harsh environments or when the board undergoes mechanical stress.The laminate material resists physical deformation under prolonged exposure to heat and stress, a crucial characteristic for high-performance electronics.
Low Moisture Absorption
One of the key advantages of Rogers RO3200™ series laminates is their resistance to moisture absorption. This ensures stable performance in environments with fluctuating humidity levels, as moisture can negatively impact electrical properties and cause signal degradation.
Excellent Signal Integrity
The combination of low dielectric constant, low dissipation factor, and stable electrical properties over a wide frequency range ensures that the RO3200™ laminate provides high signal integrity, which is particularly important in high-speed digital circuits and RF applications.The dielectric constant of the RO3200™ material remains stable even under a wide range of operating temperatures, making it ideal for precision applications.
Processing and Compatibility
Easy to Process, Rogers RO3200™ laminates are compatible with standard PCB fabrication processes, including drilling, plating, and lamination. This makes it easier to integrate into existing manufacturing lines for advanced PCB designs. Compatible with Other Materials, The laminate can be paired with various copper foils and prepregs, allowing for flexibility in PCB design and manufacturing.
The Rogers RO3200™ laminate offers a combination of high-performance electrical, thermal, and mechanical properties, making it a preferred choice for advanced PCB applications. In order to support R&D for universities and institutions,The Rogers PCB is for sale at a competitive price, even with small quantity orders. If you need design suggestions and consultation, you are welcome to contact QFPCB.
