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In this article, we’ll discuss what really characterizes the high frequency Rogers RO3035™ laminate. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the high frequency print circuit board, so please feel free to contact us.
What is the Rogers RO3035™ laminate?
RO3035™ high frequency circuit materials, which are ceramic-filled PTFE composites, are specifically designed for commercial microwave and RF applications. This product family provides exceptional electrical and mechanical stability while maintaining competitive pricing.
RO3035™ laminates are ceramic-filled PTFE-based circuit materials that exhibit consistent mechanical properties irrespective of the selected dielectric constant. This consistency enables designers to develop multilayer board designs using different dielectric constant materials for individual layers without encountering issues related to warpage or reliability.
The dielectric constant versus temperature of RO3035™ material is very stable. These materials exhibit a coefficient of thermal expansion (CTE) in the X and Y axis of 17 ppm/ °C.This coefficient of thermal expansion (CTE) is matched to that of copper, ensuring excellent dimensional stability and minimizing bow and twist tendencies. The matched CTE also prevents delamination in thick metal cladding. Additionally, the Z-axis CTE of 24 ppm/°C provides exceptional plated through hole reliability, even in severe thermal environments.
Rogers RO3035™ laminate Data Sheet
Features of the Rogers RO3035™ laminate
Low Dielectric Loss for High-Frequency Performance
Rogers RO3035™ is engineered for high frequency applications, providing a low dielectric loss that ensures minimal signal attenuation. This is particularly critical in applications that operate at GHz frequencies, such as RF and microwave circuits. With its excellent dielectric properties, it enables optimal performance in signal transmission, making it ideal for use in high speed communications and precision electronics.
Suitable for Applications Up to 30-40 GHz
The laminate is designed to operate efficiently in applications up to 30-40 GHz, which is a testament to its robust electrical performance across a wide range of frequencies. This makes it suitable for applications such as radar systems, high frequency communications, and satellite systems, where stable and reliable operation at high frequencies is essential.
Excellent Mechanical Properties Versus Temperature
Rogers RO3035™ offers superior mechanical properties that remain stable across a wide temperature range. This ensures that the laminate performs consistently, even under extreme temperature variations, which is critical for applications requiring reliable stripline and multilayer board constructions. Its temperature stability makes it an excellent choice for power amplifier designs, where thermal management is a key factor.
Uniform Mechanical Properties Across a Range of Dielectric Constants
Ideal for multilayer board designs with a range of dielectric constants. Suitable for use with epoxy glass multilayer board hybrid designs. One of the key advantages of RO3035™ is its ability to offer uniform mechanical properties across various dielectric constants. This enables designers to achieve consistent performance and predictability, regardless of the specific dielectric constant needed for a particular application. This feature is crucial in multilayer and stripline designs, where layer-to-layer uniformity is critical for circuit reliability and performance.
Stable Dielectric Constant Versus Temperature and Frequency
Ideal for band pass filters, microstrip patch antennas, and voltage controlled oscillators. The laminate’s dielectric constant remains stable across both temperature and frequency variations, ensuring consistent electrical performance. This feature is vital for high frequency applications that demand minimal variation in impedance and signal integrity over a wide operating temperature range.
Low In-Plane Expansion Coefficient (Matched to Copper)
RO3035™ has a low in plane coefficient of thermal expansion (CTE) that is closely matched to copper, making it an ideal material for high frequency circuits. The material’s low CTE reduces the risk of delamination and ensures stable long-term performance, even under thermal cycling conditions, which is especially important for designs involving high speed signal transmission. Allows for more reliable surface mounted assemblies. Ideal for applications sensitive to temperature change and excellent dimensional stability.
High Thermal Conductivity for Lower Operating Temperatures and Increased Reliability
Rogers RO3035™ features high thermal conductivity, which helps to lower the operating temperature of the circuit boards. This enhances the overall reliability of the boards, especially in power amplifier applications, where excessive heat can lead to performance degradation and failure. By efficiently dissipating heat, RO3035™ ensures that circuits remain within optimal temperature ranges for prolonged operational lifetimes.
Applications of the Rogers RO3035™ laminate
The versatility of Rogers RO3035™ makes it suitable for a wide range of applications. Below are some of the most common fields where RO3035™ is used:
Automotive Radar Applications
In automotive systems, radar technology is crucial for safety and driver assistance systems such as adaptive cruise control and collision avoidance. The low dielectric loss of RO3035™ ensures that radar signals maintain their strength and clarity, enabling the detection of obstacles and vehicles at long distances.
Global Positioning Satellite (GPS) Antennas
GPS systems require high frequency, low-loss materials to ensure accurate positioning data. Rogers RO3035’s excellent electrical properties make it an ideal choice for GPS antennas, which need to operate effectively in a range of environmental conditions without signal degradation.
Cellular Telecommunications Systems – Power Amplifiers and Antennas
The cellular communications industry relies on materials like RO3035™ to support the high frequency circuits in power amplifiers and antennas. These systems require precise signal transmission and low-loss materials to optimize coverage, minimize interference, and enhance performance.
Patch Antenna for Wireless Communications
RO3035™ is commonly used in the construction of patch antennas, which are integral to wireless communication systems. Its low dielectric constant allows for efficient signal transmission, ensuring that wireless devices maintain strong and stable connections.
Direct Broadcast Satellites (DBS)
For satellite communications, particularly in direct broadcast systems, RO3035™ provides the necessary performance for high frequency circuits that need to transmit data over long distances with minimal loss. Its thermal stability also ensures that it can handle the extreme environmental conditions encountered in space applications.
Datalink on Cable Systems
Data transmission through cables in communications networks benefits from the low-loss characteristics of RO3035™. This material helps reduce signal degradation, ensuring high speed and high quality data transmission over long cable runs.
Remote Meter Readers
In the utility industry, remote meter reading systems are increasingly relying on wireless communications, and Rogers RO3035™ provides the necessary signal integrity for these systems. Its low dielectric loss and stability ensure reliable communication between the meters and central data collection points.
Power Backplanes
RO3035™ is also utilized in power backplane designs, where its mechanical strength and thermal stability are critical. The material ensures that the backplane can handle high currents and dissipate heat efficiently while maintaining signal integrity for complex power distribution systems.
Property Charts Comparison With The Rogers RO3003 and RO3035 Laminates
Manufacturing advantages of Rogers RO3035™ laminate
The unique properties of Rogers RO3035™ offer several advantages that enhance manufacturability and processing efficiency.
Enhanced Drilling and Routing Performance
The material’s consistency allows for more precise drilling and routing operations, resulting in fewer defects and improved yield rates. Minimizes material waste during production processes, contributing to cost savings and more sustainable manufacturing practices.
Improved Adhesion and Bonding
Ensures strong adhesion between layers in multilayer boards, enhancing overall structural integrity and reliability. Simplifies assembly processes by providing better bonding characteristics, reducing the complexity and time required for board construction.
Compatibility with Standard PCB Manufacturing Processes
Designed to be compatible with standard printed circuit board manufacturing processes, facilitating easier integration into existing workflows without requiring significant changes. Reduces the need for specialized equipment or procedures, helping to keep production costs down while maintaining high quality output.
Rogers RO3035™ PCB Material Standard Thickness
0.010” (0.25mm) +/- 0.0005”
0.020” (0.51mm) +/- 0.0010”
0.060” (1.52mm) +/- 0.0030”
And PCB material standard size is 12” X 18” (305 X 457mm),24” X 18” (610 X 457mm).
Rogers RO3035™ PCB Material Electrodeposited Copper Foil
½ oz. (18μm)
1 oz. (35μm)
Ultimately, Rogers RO3035™ is a high frequency laminate that offers outstanding performance and reliability for a wide range of applications in the telecommunications, automotive, aerospace, and electronics industries. Its superior mechanical, electrical, and thermal properties make it an ideal choice for high performance circuit boards. By choosing Rogers RO3035™, manufacturers can achieve superior performance, enhanced safety, and extended product lifetimes while benefiting from excellent price performance value.
If you have any further questions, please feel free to leave a comment below or contact QFPCB by email ([email protected]).
