QFPCB factory has rich experience in RFID data process engineering and a complete high-frequency material processing control system to ensure product design functions. And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the high-frequency PCB Material, so please feel free to contact us.
What is the RF-35HTC laminate?
RF-35HTC is a non-reinforced, low-loss, thermally conductive laminate that sets the standard in the industry. With an impressive thermal conductivity of 1.84 W/m·K, it is ideally suited for high-power applications such as amplifiers, couplers, dividers, and filters. RF-35HTC is a ceramic PTFE composite with a very low PTFE content, which contributes to its exceptional performance. Its remarkably low loss of 0.0007 at 10 GHz makes RF-35HTC an excellent choice for applications requiring both high thermal conductivity and minimal signal loss.
The high thermal conductivity of RF-35HTC is especially advantageous for efficiently dissipating localized heat from transistors, capacitors, conductors, and other components, as well as the dielectric material itself. In high-temperature environments, where exposure to oxygen and hydrocarbons (such as synthetic rubber) can lead to oxidation, many composites experience increased electrical and thermal losses beyond what is predicted by modeling. However, PTFE is particularly appealing in these conditions due to its resistance to thermal oxidation, making it an ideal material choice for applications that must withstand extreme temperatures.
The uniform distribution of ceramic in the dielectric ensures consistent dielectric properties in the X, Y, and Z directions. The low CTE (Coefficient of Thermal Expansion) in the X and Y axes ensures stable filter performance across temperature variations. Meanwhile, the low Z-axis expansion guarantees the stable operation of narrowband and broadband couplers over temperature, maintaining consistent signal-to-ground-plane dielectric thickness (and stable impedance) across temperature changes. The low PTFE content in RF-35HTC also enhances its suitability for PCB fabrication, as it facilitates plating and drilling processes. Additionally, the high ceramic content improves dimensional stability. AGC has specifically avoided using alumina, which can be abrasive to mechanical drilling and routing, further optimizing the material for precise manufacturing.
Features of RF-35HTC laminate for PCB
High Thermal Conductivity:
•Thermal Conductivity (1.84 W/m·K): The high thermal conductivity of RF-35HTC ensures efficient heat dissipation, making it ideal for high-power applications where thermal management is critical. This property helps in maintaining optimal operating temperatures, thereby enhancing the reliability and performance of the devices.
Extremely Low Loss:
•Dielectric Loss Tangent (Df): RF-35HTC exhibits an extremely low dielectric loss tangent of 0.0007 at 10 GHz. This low Df minimizes signal attenuation and ensures high signal integrity, making it highly attractive for high-frequency and high-power applications.
Stable Dielectric Properties:
•Dielectric Constant (Dk): The dielectric constant of RF-35HTC is stable across a wide range of frequencies, ensuring consistent electrical performance. This stability is crucial for maintaining the reliability and efficiency of high-power devices.
Dimensional Stability:
•Thermal Expansion: RF-35HTC has a low coefficient of thermal expansion (CTE), which ensures that the laminate maintains its dimensions over a wide temperature range. This dimensional stability is essential for precise alignment and registration in multilayer applications.
Chemical Resistance:
•Resistance to Chemicals: The material is resistant to a wide range of chemicals, including solvents and fluxes commonly used in PCB manufacturing processes. This resistance helps maintain the dimensional integrity of the laminate during fabrication.
Mechanical Robustness:
•Durability: Despite being non-reinforced, RF-35HTC provides good mechanical strength and durability. This ensures that the laminate can withstand mechanical stresses and maintain its structural integrity during fabrication and operation.
Thermal Performance Comparison of RF-35HTC in High-Power Microstrip Transmission Lines
Power handling experiments were conducted on microstrip transmission lines, both with and without various capacitors placed at the center, to assess the dielectric’s ability to dissipate thermal energy. The heat profiles of the microstrip, including the presence of hot spots, were captured using a thermal camera as the transmitted power was increased to 200 watts. AGC’s RF-35HTC dielectric material was compared against AGC’s RF-35TC, RF-35TC-A, and two competing materials. In all cases, the RF-35HTC outperformed the others in its capacity to efficiently spread thermal energy,as below shown (Tin melting point).
Benefits of RF-35HTC laminate for PCB
RF-35HTC is made from a ceramic-filled PTFE composite. Unlike many other materials, RF-35HTC contains a very low amount of PTFE, which contributes to its exceptional performance characteristics.
Best in Class Thermal Conductivity
The RF-35HTC laminate is a high-performance material widely used in the electronics and telecommunications industries, particularly for printed circuit boards (PCBs) in high-frequency applications. When we discuss the “best in class thermal conductivity” for this laminate, we are referring to its superior ability to efficiently transfer heat away from the components it supports, which is critical for maintaining optimal performance and preventing overheating in RF (radio frequency) devices.
Low Loss Tangent
The ceramic-filled PTFE composite exhibits a very low dielectric loss tangent (Df), which significantly reduces signal attenuation and ensures high signal integrity. This is crucial for maintaining the performance of high-frequency circuits and minimizing energy loss. RF-35HTC laminate is composed of a ceramic-filled PTFE composite, providing a unique combination of low dielectric loss, minimal signal distortion, and high thermal stability. These properties make it an ideal choice for advanced microwave and high-frequency circuits.
No Glass Reinforcement
RF-35HTC is made from a ceramic-filled PTFE composite. Unlike many other laminates, RF-35HTC contains a very low amount of PTFE, which is crucial for its performance characteristics. Unlike reinforced laminates, RF-35HTC does not contain any glass fibers or fabrics. This absence of glass reinforcement provides several benefits, including improved flexibility, reduced weight, and enhanced thermal and electrical performance.
Resists Thermal Oxidation
The RF-35HTC laminate has the remarkable ability to effectively resist thermal oxidation. This property implies that it can withstand the adverse effects of high temperatures and oxidative processes without undergoing significant degradation or deterioration in its physical and chemical characteristics. It demonstrates a considerable level of durability and stability when exposed to thermal oxidative conditions, which is a crucial feature in various applications where heat and oxidation pose potential challenges to the integrity and performance of the laminate material.
High Dimensional Stability
The RF-35HTC laminate exhibits an exceptionally high level of dimensional stability. This means that it maintains its precise shape and size with remarkable consistency, even when subjected to varying environmental conditions, mechanical stresses, or temperature fluctuations. The laminate’s inherent properties allow it to resist any significant deformations or alterations in its dimensions, ensuring its reliability and accuracy in applications where precise measurements and consistent geometries are of paramount importance.
Applications of RF-35HTC laminate for PCB
RF-35HTC is a high-performance laminate material primarily utilized in satellite and aerospace engineering, especially in the fabrication of printed circuit boards (PCBs) and high-frequency electronics. The laminate’s design and properties make it suitable for the harsh environments that satellites endure during launch, operation, and in outer space.
High power applications such as filters, Couplers, Dividers &Power amplifiers
RF-35HTC laminate is widely used in the design and manufacture of passive components, such as dividers, filters, and couplers, particularly in high-frequency applications such as satellite communications, automotive radar, and 5G wireless systems. The dielectric properties of the material play a crucial role in influencing the propagation of electromagnetic waves, determining the efficiency of energy transfer, and controlling the impedance characteristics of the devices.
Antennas
RF-35HTC laminate which is known for its superior performance and high-quality composition, is commonly used for the highly sensitive and precise Global Positioning System Antennas. This particular laminate provides excellent signal transmission and reception capabilities, ensuring the accurate and reliable functioning of the antennas in various environments and applications.
Satellites
RF-35HTC laminate is a high-performance material that plays a crucial role in satellite electronics, offering exceptional thermal conductivity, low dielectric loss, and stability under extreme conditions. Its use in satellite systems enhances the performance and longevity of communication, radar, and imaging systems, ensuring that satellites can operate reliably in the harsh environment of space.
RF-35HTC is a high-performance, thermally conductive laminate that combines exceptional thermal conductivity with extremely low dielectric loss. These properties make it an excellent choice for high-frequency circuits, high-speed digital systems, and other demanding electronic applications. If you need pcb design suggestion and consultation, you are welcome to contact us.
