RF-30A is an organic-ceramic laminate with woven glass reinforcement. It combines ceramic filler and PTFE coating technology. RF-30A exceeds design requirements in electrical and mechanical properties. When paired with low-profile copper foil, it offers stable performance with low PIMD and insertion loss.
In this article, we’ll discuss what really characterizes the high frequency RF-30A laminate. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the high frequency print circuit board, so please feel free to contact us.
What is the high frequency RF-30A laminate?
RF-30A is an organic-ceramic laminate in AGC’s family of RF substrates. It is based on woven glass reinforcement. RF30A is a product of AGC’s expertise in both ceramic filler and PTFE coating technology. RF30A demonstrates electrical and mechanical properties that exceed designers’ requirements. This low-loss dielectric substrate, combined with low-profile copper foil, ensures stable electrical performance with superior passive intermodulation distortion (PIMD) levels and reduced insertion loss across a broad frequency range.
Additionally, its more stable mechanical properties, characterized by lower coefficients of thermal expansion (CTE), enhanced dimensional stability, and increased rigidity, minimize the impact of external factors on RF components. RF-30A’s excellent peel strength for 1⁄2 ounce and 1 ounce RT copper is a critical aspect when rework or repeated reflow process is required. An ultra low moisture absorption rate with stable loss tangent helps minimize phase shift along the different temperature or humidity environments. Less dimensional movement also contributes to stable phase or impedance properties over broadband frequency range.
RF-30A has been optimized with ceramic to have a low Z axis CTE for improved PTH reliability and ease of fabrication of multilayer circuits. These properties also contribute to more stable PIMD performance. RF30A is the optimal choice for low-cost, high-volume commercial microwave and radio frequency applications.
RF-30A high frequency laminate data sheet
Features of the high frequency RF-30A laminate
Excellent PIM Values in PCBs (Measured at Lower than -160 dBc*)
RF-30A delivers ultra-low PIM values, consistently measuring below -160 dBc*. This minimizes signal distortion in high-frequency environments, making it indispensable for telecom infrastructure and sensitive RF systems. This feature is critical for maintaining high-fidelity signal transmission in sensitive RF circuits.
Stable at High Frequencies and High Temperatures
The material maintains stable electrical properties across a broad frequency range, even in mmWave applications. It also resists thermal degradation, performing reliably in temperatures exceeding Tg (glass transition temperature) limits. RF-30A maintains consistent electrical performance even under high-frequency operation, making it ideal for advanced wireless communication systems and radar applications.
Low Moisture Absorption
With moisture absorption rates below 0.1%, RF-30A ensures consistent performance in humid or variable environments, reducing risks of delamination or electrical drift. Moisture can degrade the performance of PCBs over time. RF-30A’s low moisture absorption minimizes this risk, ensuring long-term reliability and stability.
Excellent Peel Strength
Offers excellent peel strength, contributing to the durability and longevity of circuits. The material demonstrates strong adhesion between layers, translating into excellent peel strength. This is particularly important for multi-layer PCBs where mechanical integrity is critical.
Low Z-Axis CTE
With a low coefficient of thermal expansion (CTE) in the Z-axis, RF-30A reduces the potential for delamination and other thermal stress-related issues, further enhancing its structural integrity.
*Measurement using manufactured PCB coupon with 20 watts per channel @ 800 and 1800 MHz.
PIMD is Passive Intermodulation Distortion in multi-frequency communication systems. In general, there are many factors that contribute to PIMD properties: circuit design, power density distribution, connectors, cables, soldering, PCB processing, base material properties, and the best and worst PIM performing components. Other factors include: impedance discontinuities or improper signal cross-talk in complex circuitry design. Generally PTFE based laminates with very low profile copper foil – whether reverse treatment foil or very low profile/no profile copper – lead to the best performance.
In microstrip transmission line applications many additional factors can also contribute to PIM levels.
RF-30A exhibits very stable PIM performance and is less affected by other factors, as shown in examples of microstrip transmission PIM results with and without PTH.
RF-30A exceeds PIM requirements in PCBs of -153 dBc (measured between 880 and 960 MHz, between 1710 and 1880 MHz and between 1920 and 2170 MHz at 20 W power) with CL1/CL1 cladding when processed with today’s state-of-the-art processes and process parameters.
Applications of the high frequency RF-30A laminate
RF-30A’s properties make it a versatile solution for advanced RF and microwave systems, The versatility of RF-30A makes it suitable for a wide range of sophisticated applications:
Antenna and Subcomponents
Ideal for 5G base stations, satellite communications, and radar systems, where low PIM and stable signal integrity are non-negotiable. In antenna systems, signal integrity is paramount. RF-30A’s low PIM and high-frequency stability make it ideal for antennas and associated subcomponents, ensuring clear and reliable signal transmission in wireless communication systems.
RF Passive Components
The laminate’s stable electrical properties and low loss characteristics are beneficial for RF passive components such as filters, couplers, and power dividers. These features help in maintaining the performance and efficiency of RF networks. Enables high-performance filters, couplers, and baluns with minimal insertion loss and consistent impedance control.
Power Amplifiers (PA)
Power amplifiers require materials that can manage high thermal loads and maintain performance under strenuous conditions. The thermal resilience and low moisture absorption of RF-30A make it a perfect candidate for PA modules, contributing to both durability and efficiency. Supports high-power RF designs with excellent thermal management, ensuring efficiency and longevity.
Advantages of the high frequency RF-30A laminate
Manufacturers benefit from RF-30A’s excellent processability, which contributes to cost efficiency and ease of integration into existing workflows:
Improved PTH Quality
The laminate’s low Z-axis CTE and thermal stability minimize microcracks in vias, improving reliability in multilayer PCBs. The laminate’s design facilitates high-quality plated through holes (PTH), which are crucial for interlayer connectivity in multi-layer PCBs. Improved PTH quality contributes to overall device reliability.
Stable Mechanical Properties
Consistent drillability and dimensional stability reduce tool wear and scrap rates, accelerating production timelines. Consistency in mechanical performance ensures that RF-30A can be processed reliably, even during high-volume production runs. This stability minimizes defects and enhances overall yield.
Excellent Price/Performance Ratio
RF-30A bridges the gap between high-end PTFE-based materials and conventional FR-4, offering RF-grade performance at a competitive cost. By combining high-end performance with cost-effective processing, RF-30A provides an outstanding price/performance ratio. This balance makes it an attractive option for both premium applications and cost-sensitive projects.
Compatibility with Modified FR4 Processes
RF-30A can be seamlessly integrated into modified FR4 processing lines, reducing the need for significant equipment changes or additional investments, lowering production costs while maintaining high performance.
Conclusion
RF-30A laminate represents a significant advancement in the field of high frequency PCB materials. Its exceptional PIM values, thermal and frequency stability, low moisture absorption, and robust mechanical properties not only deliver superior performance in demanding applications. Moreover, the manufacturing advantages offered by RF-30A, including improved PTH quality and stable mechanical properties, make it an attractive choice for manufacturers seeking to enhance product performance while maintaining cost-effectiveness.
