Name: 8Layers PCIE Adapter Circuit Board
Material: TU-872 SLK
Layers: 8L
Thickness: 1.6mm
Surface treatment: ENIG+Gold Finger
Min Trace/Width: 4/4mil
Application: Industrial Control, Medical Equipment
Name: 2Layers Taconic RF-30 PCB
Material: Taconic RF-30
Layers: 2L
Thickness: 1.52mm
Surface treatment: OSP
Min Trace/Width: 10/10mil
Taconic RF-30 dielectric constant: 3.0
Application: Power Divider
Name: RT5880 PCB
Material: RT-Duroid-5880
Layers: 2L
Thickness: 0.508mm
Surface treatment: Soft Gold
Min Trace/Width: 10/10mil
RT-Duroid-5880 dielectric constant: 2.2
Application: Cavity PCB for power divider
Name: 18Layers Network Switch PCB
Material: MEGTRON4S+KB6167F
Layers: 18L
Thickness: 2.0mm
Surface treatment: ENIG
Min Trace/Width: 3/4mil
Features: Back drilling
Application: Network Switch
Name: 8Layers Optical Module PCB
Material: MEGTRON7_R-5785
Layers: 8L
Thickness: 1.0mm
Surface treatment: ENEPIG
Min Trace/Width: 4/4mil
Impedance Tolerance: ±7%
Features: 2+4+2 HDI
Application: 800G Optical Module
Name: 10Layers 2-Order HDI Graphics Card PCB
Material: IT-968
Layers: 10L
Thickness: 1.2mm
Surface treatment: OSP
Min Trace/Width: 2.5/2.5mil
Application: Industrial computer graphics card
Name: 2 Layers Ro4730G3 PCB
Material: Ro4730G3 LoPro
Layers: 2L
Thickness: 0.762mm
Surface treatment: OSP
Min Trace/Width: 4/4mil
Ro4730G3 dielectric constant: 2.98
Frequency: 5G
Name: 16Layers 1st Order HDI Server PCB
Material: TU-833
Layers: 16L
Thickness: 3.0mm
Surface treatment: ENIG+OSP
Min Trace/Width: 3.5/3.5mil
Features: Back drilling
Application: PCIe 5.0 Servers
Name: 2Layers Taconic TLY-5 PCB
Material: Taconic TLY-5
Layers: 2L
Thickness: 0.787mm
Surface treatment: ENEPIG
Min Trace/Width: 10/10mil
Taconic TLY-5 dielectric constant: 2.2
Application: Band Pass Filter
Name: 12Layers Anylayer HDI Transmission Intercom PCB
Material: NP-175F
Layers: 12L
Thickness: 1.0mm
Surface treatment: ENIG+OSP
Min Trace/Width: 2/2.5mil
Application: intercom system
Name: 18Layers Back Drilling PCB
Material: MEGTRON6_R-5775
Layers: 18L
Thickness: 2.4mm
Surface treatment: ENEPIG
Min Trace/Width: 2.5/3.5mil
Construction: 3+12+3 HDI PCB
Application: Communications equipment
Name: LGA IC Substrate Board
Material: HL832NXA
Layers: 4L
Thickness: 0.30±0.05mm
Surface treatment: ENEPIG
Min Trace/Width: 50/50um
Construction: 1+2+1 HDI
Application: SiP package lc Substrate PCB Board
Name: 6Layers FCCSP
Material: MCL-E-705G
Layers: 6L
Thickness: 0.55±0.05mm
Surface treatment: ENEPIG
Min Trace/Width: 40/40um
Construction: 2+2+2 HDI
Application: Performance memory, RFICs, and DSPs
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