Name: 6Layers FCCSP
Material: MCL-E-705G
Layers: 6L
Thickness: 0.55±0.05mm
Surface treatment: ENEPIG
Min Trace/Width: 40/40um
Construction: 2+2+2 HDI
Application: Performance memory, RFICs, and DSPs
Name: LGA IC Substrate Board
Material: HL832NXA
Layers: 4L
Thickness: 0.30±0.05mm
Surface treatment: ENEPIG
Min Trace/Width: 50/50um
Construction: 1+2+1 HDI
Application: SiP package lc Substrate PCB Board
Products & Services
PCB Technology
Contacts
Technical Support & Quote
Get A Quote
