2 Layer DPC PCB

DPC is a newest development in the field of Ceramic Substrate PCBs, by magnetron sputtering technology to deposit a metal layer (Ti/Cu target) on the surface of the ceramic substrate which result in copper thickness’ ranging from 10um to 130um, and then photolithography to form circuit patterns, electroplating is used to fill in the gaps and thicken the metal circuit layer, and the solderability and oxidation resistance of the substrate is improved through surface treatment, finally remove the dry film, and etch the seed layer to complete the substrate.

QFPCB is a Chinese ceramic substrate manufacturer with capabilities in R&D, fabrication and assembly of ceramic PCBs. Materials include alumina, aluminum nitride、LTCC、HTCC、DBC、DPC、AMB、TFC. The company utilizes low temperature co-fired ceramics (LTCC) to develop multilayer circuits with high component density. Our specialize in miniaturized multilayer ceramic boards for wireless communication modules. Air cavity PCBs, ceramic antennas and packaging are also fabricated.

Our production capabilities support fine line printing down to 100um line/space. our ceramic solutions are used in smartphones, wireless modules, aerospace avionics and high-speed rail. Borui circuit has in-house facilities for R&D, processing, testing and measurement of ceramic substrates. Products are compliant with RoHS, REACH and other environmental directives.Key applications include communication equipment, car electronics, LED lighting and industrial controls.

DPC Ceramic PCB Manufacture Process

Key technology of DPC substrate

Bonding strength between metal circuit layer and ceramic substrate

Due to the large difference in thermal expansion coefficient between the metal and the ceramic, in order to reduce the interface stress, it is necessary to add a transition layer between the copper layer and the ceramic to improve the interface bonding strength. Since the bonding force between the transition layer and ceramics is mainly based on diffusion adhesion and chemical bonds, metals with high activity and good diffusivity such as Ti, Cr and Ni are often selected as the transition layer (and also as the electroplating seed layer).

Electroplating and Filling

Electroplating and hole filling is also a key technology for the preparation of DPC ceramic substrates. At present, pulse power supply is mostly used for electroplating and filling of DPC substrates. Its technical advantages include: easy to fill through holes, reduce coating defects in holes; surface coating structure is dense and uniform in thickness; high current density can be used for electroplating to improve deposition efficiency.

DPC Ceramic PCB Advantages

The DPC process combines the thermal conductivity and excellent circuit performance of ceramic substrates. It is suitable for electronic devices requiring high power, high frequency and high reliability, and provides an important material choice for the electronic packaging industry. DPC ceramic PCB mainly has the following advantages.

Excellent thermal conductivity

The DPC substrate uses ceramics as the base material, which has good thermal conductivity, can effectively conduct and dissipate the heat generated by high-power electronic devices, and improve the reliability and performance of the device.

Superior high-frequency characteristics

DPC substrates have low dielectric constant and dielectric loss, and can achieve low signal transmission loss in high-frequency and microwave frequency bands, making them suitable for high-frequency and radio-frequency applications.

High-density packaging capability

DPC substrates have high circuit density and thin line width/fine line spacing capabilities, which can achieve more compact circuit layout and higher circuit density, which is conducive to miniaturization and integrated design.

Excellent mechanical properties

DPC substrates have high mechanical strength and hardness, can resist environmental stresses such as vibration, impact and thermal expansion, and improve the reliability and durability of devices.

Good dimensional stability

DPC substrates have a low thermal expansion coefficient in high temperature environments, can maintain good dimensional stability, and reduce the risk of mismatch and cracks caused by thermal stress.

Excellent welding performance

The copper film on the surface of the DPC substrate has good welding performance, which can realize reliable circuit connection and welding.

High reliability and durability

The material and structural design of the DPC substrate make it have high reliability and durability, which can meet the requirements of harsh working environment and long-term use.

DPC Ceramic PCB Application

DPC ceramic substrate has technical advantages such as high graphic precision, vertical interconnection, and low production cost, and can be widely used in high-power LED lighting, automotive headlights and other high-power LED fields, semiconductor lasers, power electronic power devices, microwave, optical communications , VCSEL, RF devices and other application fields, the market space is very large.

High Power Electronics

DPC substrates have excellent thermal conductivity in high-power electronic devices and can be used in the manufacture of power amplifiers, inverters, frequency converters, electric vehicle chargers, etc.

Radio Frequency (RF) and Microwave Devices

DPC substrate has low dielectric loss and excellent high-frequency performance, and is suitable for manufacturing radio frequency power amplifiers, microwave antennas, radio frequency filters, communication equipment, etc.

LED Lighting

The excellent thermal conductivity of the DPC substrate can help dissipate heat, improve the efficiency and life of LED lighting, and is often used to manufacture high-brightness LED modules, LED packaging substrates, etc.

Vehicle Electronics

DPC substrates are widely used in the field of automotive electronics, and can be used to manufacture power electronic modules, battery management systems, and vehicle communication equipment for electric vehicles.

High Temperature Electronic devices

DPC substrates have good high temperature stability and corrosion resistance, and are suitable for manufacturing electronic devices that work in high temperature environments, such as aerospace equipment, gas turbine control systems, etc.