Name: 18Layers Back Drilling PCB
Material: MEGTRON6_R-5775
Layers: 18L
Thickness: 2.4mm
Surface treatment: ENEPIG
Min Trace/Width: 2.5/3.5mil
Construction: 3+12+3 HDI PCB
Application: Communications equipment
Name: 16Layers 1st Order HDI Server PCB
Material: TU-833
Layers: 16L
Thickness: 3.0mm
Surface treatment: ENIG+OSP
Min Trace/Width: 3.5/3.5mil
Features: Back drilling
Application: PCIe 5.0 Servers
Name: 12Layers Anylayer HDI Transmission Intercom PCB
Material: NP-175F
Layers: 12L
Thickness: 1.0mm
Surface treatment: ENIG+OSP
Min Trace/Width: 2/2.5mil
Application: intercom system
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