Burn-in boards are used by burn-in testers.
The final stage of the semiconductor manufacturing process includes burn-in testing. The goal of such testing is to discover initial defects in advance by applying temperature and voltage loads to completed semiconductors. A pedestal called a burn-in board is used to hold semiconductors during such testing.
Since this board is used to apply electric signals to the semiconductors, it consists of a lattice of IC test sockets on a PCB and circuits made up of passive components such as resistors, coils, and capacitors as well as active components such as transistors and diodes. Several of these boards are loaded into a burn-in tester, which carries out the test while applying a temperature load.
Since the testing cannot be carried out properly if there is an issue with the burn-in board itself, each board must be tested.
This article introduces a reliable, high-speed test system designed to ensure the quality of burn-in boards.
Issues with burn-in board testing
Currently, workers carry out these tests by inserting a connection test head into one IC socket at a time. Since the test heads are not fixed in place, the state of contact varies with the worker’s movements, and the testing process tends to be characterized by poor yield due to issues like needing to repeat tests a number of times.
Workers must do their utmost not to change their movements during testing. The effects of such movements, as well as the workload, increase as the test time for each IC socket lengthens. In summary, testing is characterized by the following issues:
- Poor yields and time-consuming tests
- Omitted tests and missed defects due to careless mistakes
- Variability in test results due to dependence on individual workers
- Higher workloads due to long working hours
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What are Burn in Boards?
Burn in boards are specially designed to carry out electrical stress tests at very high temperatures. This test process is crucial to components to ascertain the reliability of the components. The PCB burn-in process is often carried out at 125 degrees Celsius with the application of electrical excitation to the samples.
The burn in boards are used in the burn-in process. These boards facilitate the burn-in process. The samples are loaded in the board-in boards and then the operators insert them into the burn-in. Also, the burn-in oven provides the samples with voltages and as well maintains the temperature of the oven at 125 degrees Celsius. The electrical bias may be dynamic or static.
Burn in boards serve as a jig in the burn-in process. Also, the Burn-in Board is integrated as part of the ASIC reliability testing process. In this process, the components go through stress to help detect any failure. Furthermore, burn in Boards comprises sockets that in housing the tested ASICs. Also, these sockets are primarily designed to restrict the hot temperatures during ASIC test process.
A burn in board helps in evaluating the functionality and performance of semiconductor devices. Also, this board can be manufactured using various materials. However, the end application of the burn in board determines the type of material.
What Does the Burn in Test Entail?
Burn-in tests are specially performed to evaluate the reliability and functionality of the ASIC device. Also, these tests are usually performed at 1250C. During this process, the operator applies electrical signals and power to ASICs. Furthermore, the operator then inserts the burn in boards in the burn-in oven. The oven provides the samples with the enough voltages. The samples need to pass through screening to be certain they went through the oven testing.
The burn in test is the last stage of the semiconductor manufacturing. Also, the main purpose of this testing is to detect initial defects by applying voltage loads and temperature to semiconductors. In such testing, a burn in board helps to hold semiconductors.
Also, this board comprises a lattice of IC test sockets on a circuit board and circuits that comprise passive components such as coils, capacitors and resistors. Also, it comprises active components. The oven temperature must be ideal for the burn in board.
Burn in Board Materials
A burn in board makes use of high performance materials. It uses a special version of FR4 to test up to 125 degrees Celsius. However, a polyimide is usually integrated if the temperature is as high as 250 degrees Celsius. A high grade polyimide is the right option for extremely high temperatures up to 300 degrees Celsius. These special board materials are ideal for manufacturing burn in board.
Burn in Board Design
Some PCB design guidelines are a bit common among all PCB designers. However, there are some additional factors you need to consider while designing a Burn in Board. Also, one of the most important factors you need to consider is how to choose the best possible quality and functionality for the test socket and the Burn in Board. Furthermore, you want a high performance Burn in board and you don’t want a defective one before the device under test.
Therefore, it is very crucial that all active/passive connectors and components comply with high-temperature requirements. Furthermore, all components and materials need to meet the requirements for high-temperature and aging. Burn in board manufacturing process requires careful attention. Therefore, manufacturer must adhere to some guidelines. There are different burn in board styles. The end application of the burn in board determines the style to go for.
Types of Burn in Test Process
There are three types of burn in test process. These include the static burn in, dynamic burn in and test during burn in.
Static burn in
This type of bur in test process involves the application of extreme currents or voltage to every device without the operation of the device.
Dynamic burn in
In this type of burn in, the operator exposes the device to extreme temperature and voltage.
Test during burn in
Test during burn in systems help in applying and monitoring test vectors to a device. This method makes sure the devices are well powered up. Also, the application of input tests is intentional.
Issues Associated with Burn in Board Testing
Workers are currently performing tests by putting a connection test head in an IC socket at a time. The state of contact usually varies with the movements of workers since you are not fixing the test heads in place. However, the testing process usually results in poor yield because of issues like having to repeating tests several times.
During testing, workers need adhere to strict guidelines and must be careful not to change their movements while testing. These movements have their effects. The effects of these movements increase as the time for the test for every IC socket increases. There are several issues that associated with testing. These issues include:
- Variability in the results of the test as a result of dependence on individual workers
- Time-consuming tests and poor yield
- Greater workloads as a result of long working hours
- Missed defects and omitted tests as a result of careless mistakes
Conclusion
The burn in test is the last stage of the semiconductor manufacturing. Also, the main purpose of this testing is to detect initial defects by applying voltage loads and temperature to semiconductors. In such testing, a burn in board helps to hold semiconductors. When choosing a burn in board manufacturer, it is crucial you consider some factors like experience, certifications, and expertise.
