Name: 10-Layer HDI Rigid-flex PCB
Material: NPG-170N+PI
Layers: 10L(1+1+6+1+1)
Thickness: 1.0mm
Surface Finish: ENIG
Min Trace/Width: 2.5/2.5mil
Application: Smart Wear
Name: Industrial audio equipment flexible PCB
Material: FASB0520
Layers: 2L
Thickness: 0.12mm
Surface Finish: Gold fingers
Min Trace/Width: 2.5/2.5mil
Application: Industrial audio equipment
Name: Smart Wear Rigid-flex Circuit Board
Material: IT-180A+PI
Layers: 12L
Thickness: 1.0mm
Surface Finish: ENEPIG
Min Trace/Width: 3/3mil
Application: Smart Wear
Name: 8-Layer HDI R-FPC PCB
Material: TU-872 SLK+PI
Layers: 8L(1+1+4+1+1)
Thickness: 1.2mm
Surface Finish: ENIG+OSP
Min Trace/Width: 2.5/3mil
Application: Communications
Name: 6-Layer HDI Rigid-flex PCB
Material: FR408+PI
Layers: 6L(1+1+2+1+1)
Thickness: 0.6mm
Surface Finish: ENIG
Min Trace/Width: 4/4mil
Application: Automotive electronics
Name: 8-Layer R-5725 Rigid-flex PCB
Material: MEGTRON4S_R-5725S
Layers: 8L
Thickness: 1.1mm
Surface Finish: ENIG
Min Trace/Width: 3/3mil
Application: Medical
Name: 18L Burn-In Board PCB
Material: Arlon 85N
Layers: 18L
Thickness: 3.6mm
Surface Finish: ENIG
Pitch: 0.4mm
DUT Flatness: ＜100μm
Panel Size: 632*573mm
Application: HTOL
Name: 22L Burn-In Board PCB
Material: VT-901
Layers: 22L
Thickness: 2.5mm
Surface Finish: ENIG+Gold finger
Pitch: 0.35mm
DUT Flatness: ＜100μm
Application: HTOL
Name: 32L PIMC Probe Card
Material: ISOLA 370HR
Layers: 32L
Thickness: 4.2mm
Surface Finish: ENIG
Min Trace/Space: 3/3mil
Min hole: 0.25mm
Application: PMIC Test Board
Name: 28L Mems Probe Card
Material: TU883
Layers: 28L
Thickness: 6.5mm
Surface Finish: ENIG
Min Trace/Space: 2.5/2.5mil
Min hole: 0.2mm
Application: ATE
Name: 26L ATE Load Board
Material: MEGTRON6_R-5775
Layers: 26L
Thickness: 3.5mm
Surface Finish: ENEPIG
Min Trace/Space —— 60/60 um
Min hole: 0.2mm
Application: ATE
Name: 42L 93K Load Board
Material: Isola FR408HR
Layers: 42L
Thickness: 5.2mm
Surface Finish: Hard Gold
Min hole: 0.2mm
Application: 93k FULL
Name: HTCC Ceramic PCB
Material: 99.6% Al2O3
Layers: 4L
Thickness: 5.0mm
Working Temperature: -40-300℃
Substrate Thickness: 3um
Application: Signal Converter System
Name: LTCC Ceramic PCB
Material: 99.6% Al2O3
Layers: 4L
Thickness: 1.0mm
Conductor: 0.1umTiW+3.0um Ni
Copper: 1oz
Application: Vehicle Electronics
Name: AMB Ceramic PCB
Material: AlN
Layers: 2L
Thickness: 1.6mm
Surface finish: OSP
Copper: 15oz
Application: Power Modules
Name: Automotive DBC Ceramic PCB
Material: 96% Al2O3
Layers: 2L
Thickness: 2.0mm
Surface finish: ENEPIG 2u’’
Copper: 304um
Application: Automotive Components
Name: DBC Ceramic PCB
Material: 96% Al2O3
Layers: 2L
Thickness: 1.5mm
Surface finish: ENEPIG 5u’’
Copper: 105um
Application: Microfluidic devices
Name: 2 Layer DPC PCB
Material: Aluminum Nitride
Layers: 2L
Thickness: 1.0mm
Surface finish: Immersion Gold
Min Trace/Width: 4/4mil,
Application: Stabilizer
Name: 77GHz Millimeter wave radar PCB
Material: RO4835 Lopro+FR408HR
Layers: 6L
Thickness: 1.6mm
Surface treatment: Immersion silver
Min Trace/Width: 4/4mil
RO4835 dielectric constant: 3.48
Application: Automotive millimeter-wave radar
Name: 10Layers SH260 Burn-In Board PCB
Material: SH260 Polyimide
Layers: 2-12L
Thickness: 1.6-3.0mm
Surface treatment: ENIG+Gold finger
Min Trace/Width: 4/4mil
Application: Burn-In Boards/Down Hole
Name: 12Layers RO4350B+TU872SLK
Material: RO4350B+TU872SLK
Layers: 12L
Thickness: 2.0mm
Surface treatment: Immersion Gold
Min Trace/Width: 3/3mil
Application: Spectrum Monitoring
Name: 12Layers Depth Routing PCB
Material: Rogers4003c+370HR
Layers: 12L
Thickness: 2.0mm
Surface treatment: ENIG
Min Trace/Width: 4/4mil
Features: Depth Routing+Countersink Hole
Application: Communications Equipment
Name: 4Layers 6oz Power PCB
Material: S1000-2M
Layers: 4L
Thickness: 2.5mm
Surface treatment: Immersion Sn
Min Trace/Width: 20/20mil
Application: High Power Supply
Name: 8Layers PCIE Adapter Circuit Board
Material: TU-872 SLK
Layers: 8L
Thickness: 1.6mm
Surface treatment: ENIG+Gold Finger
Min Trace/Width: 4/4mil
Application: Industrial Control, Medical Equipment
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