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NY2170 High Tg laminates stand out as a premier choice for applications pushing thermal, electrical, and reliability boundaries. This laminate delivers high reliability without compromising on cost or availability.
In this article, we’ll discuss what really characterizes the NY2170 laminate. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the high Tg circuit board, so please feel free to contact us.
What is The NY2170 PCB Material?
NY2170 is engineered with a glass transition temperature (Tg) of 170°C, providing robust thermal performance under lead-free assembly processes. The dielectric constant (DK）is 4.5 @ 1GHz and dissipation factor (DF）is 0.016 @ 1GHz, ensuring minimal heat generation during signal transmission, which are essential for maintaining signal integrity and low power loss in both digital and analog circuits.
What sets NY2170 apart is its excellent peel strength, ensuring stable adhesion between copper and dielectric even in aggressive thermal cycling or humid conditions. The material also exhibits a low Z-axis coefficient of thermal expansion (CTE), minimizing mechanical stress and delamination risks in multilayer constructions.
Another key advantage is NY2170’s superior anti-CAF performance, which enhances reliability over time, particularly in high-density interconnect (HDI) designs. Its UV blocking capability also ensures compatibility with AOI systems, simplifying inspection processes and reducing false positives. In addition, lower water absorption contributes to better insulation resistance and dimensional stability. The laminate is well-suited for use in automotive, server, telecom, and military electronics.
NY2170 PCB Material Data Sheet
Features of The NY2170 PCB Material
High Glass Transition Temperature (Tg 170°C)
The NY2170 offers a glass transition temperature (Tg) of 170°C, ensuring that the material maintains dimensional and mechanical stability under high-temperature conditions. This makes it ideal for use in lead-free soldering and high-temperature assembly processes.
Dielectric Constant (Dk)
With a dielectric constant (DK 4.5 @ 1 GHz), the dielectric constant of the material is a measure of its ability to store electrical energy in a capacitor-like manner. The laminate offer a stable Dk, this property measures a material’s ability to store some electrical energy in a given electric field.
Dissipation Factor (Df)
With a dissipation factor (DF 0.016 @ 1 GHz) translates to reduced dielectric loss, ensuring minimal heat generation during signal transmission, which are essential for maintaining signal integrity and low power loss in both digital and analog circuits.
Lead-Free Compatibility
Designed to meet the requirements of RoHS and lead-free manufacturing standards, the NY2170 supports modern reflow soldering techniques that require elevated temperatures, without compromising performance or reliability.
Excellent Peel Strength
The laminate provides strong copper adhesion, resulting in excellent peel strength. This ensures long-term reliability and durability of the PCB, especially in harsh environments where thermal and mechanical stress is common.
Low Z-Axis CTE
The laminate features a low coefficient of thermal expansion in the Z-axis, which minimizes the risk of plated through-hole (PTH) failures during thermal stress, enhancing the long-term reliability of multilayer PCBs.
Excellent Anti-CAF Performance
The PCB material also has excellent anti-CAF performance. The laminate’s chemistry and controlled glass treatment provide excellent resistance to CAF, reducing the risk of dendritic growths that can cause shorts in high-humidity or high-bias conditions.
UV Blocking and AOI Compatible
The laminate supports UV blocking properties, making it compatible with Automated Optical Inspection (AOI) systems. This enhances manufacturing precision and efficiency, especially during high-volume production.
Lower Water Absorption
With low water absorption, the laminate maintains stable electrical and mechanical performance even in high-humidity environments, reducing the risk of performance degradation and failure.
What are The Applications of NY2170 PCB Material?
Due to its robust characteristics, NY2170 finds applications across multiple high-reliability sectors:
Automotive Electronics
The laminate is widely used in automotive electronics, including engine control units (ECUs), infotainment systems, ADAS modules, and powertrain controllers, where it supports high thermal and mechanical demands.
Server & Data Center
For data centers, servers, and high-performance computing systems, the laminate delivers the thermal endurance and signal integrity required for dense, high quality PCB design.
Telecommunications Equipment
In 5G base stations, optical communication modules, and network infrastructure, the NY2170 supports high-frequency signal transmission and long-term operational stability, making it ideal for next-generation communication systems.
Militaries & Aerospace Applications
Avionics, radar systems, communications equipment, and guidance systems demand ultimate reliability under extreme thermal cycling, vibration, and harsh conditions. NY2170’s combination of high Tg, low Z-CTE, and excellent anti-CAF performance is crucial.
Process Advantages and Cost Efficiency of NY2170 PCB Material
In addition to its technical strengths, NY2170 laminates are designed with manufacturing efficiency in mind. They provide excellent dimensional stability, ensuring precision in multi-layer registration and pattern fidelity throughout the fabrication process.
More importantly, it is fully compatible with existing manufacturing processes, requiring no specialized adjustments or equipment. This translates into lower production risks and faster time-to-market for OEMs and PCB fabricators.
Finally, it offers a cost-effective solution without compromising on performance. Its readily available supply ensures smooth procurement, helping manufacturers maintain production schedules and reduce inventory stress.
NY2170 High Tg laminates offer an ideal combination of thermal stability, electrical performance, and process compatibility, making them a preferred choice in demanding applications. By choosing NY2170 laminate, manufacturers can achieve superior performance, enhanced safety, and extended product lifetimes.
If you have any further questions, please feel free to leave a comment below or contact QFPCB by email ([email protected]).
