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NP-175FM High Tg laminates, developed by Nan Ya Plastics Corporation, offer a robust combination of thermal endurance, electrical performance, and manufacturing compatibility, making them an ideal choice for a wide range of high reliability applications.
In this article, we’ll discuss what really characterizes the NP-175FM laminate. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the high Tg circuit board, so please feel free to contact us.
What is The NP-175FM PCB Material?
At the core of NP-175FM is its high Tg of ≥170°C, making it fully lead free compatible and suitable for advanced soldering profiles. This high thermal threshold ensures the material performs reliably under reflow and operating conditions typical in today’s high density and high power applications.
The material is formulated Dicy free, which improves thermal stability and moisture resistance while eliminating common issues associated with traditional curing agents. Additionally, NP-175FM features a low coefficient of thermal expansion (C.T.E), especially in the Z-axis, helping to reduce the risk of delamination and via failure during thermal cycling.
Electrically, the NP-175FM offers a well balanced dielectric constant (DK 4.2 @1GHz) and low dissipation factor (DF 0.012 @1GHz), ensuring minimal heat generation during signal transmission, which are essential for maintaining signal integrity and low power loss in both digital and analog circuits. Its superior anti-CAF resistance enhances long term reliability in humid and high voltage environments.
For manufacturing, NP-175FM utilizes a multi-functional epoxy system with high luminance, creating strong contrast with copper for AOI processes. This results in better defect detection and improved inspection efficiency. It also meets the IPC-4101C/99 specification, ensuring quality and performance consistency.
NP-175FMR PCB Material Data Sheet
NP-175FMTL PCB Material Data Sheet
Features of The NP-175FM PCB Material
High Glass Transition Temperature (Tg 170°C)
The laminate provides a minimum Tg of 170°C, ensuring superior dimensional and mechanical stability under high thermal loads, making it ideal for use in lead free soldering and high temperature reflow processes.
Dielectric Constant (Dk)
With a dielectric constant (DK 4.2 @1GHz), the dielectric constant of the material is a measure of its ability to store electrical energy in a capacitor like manner. The laminate offer a stable Dk, this property measures a material’s ability to store some electrical energy in a given electric field.
Dissipation Factor (Df)
With a dissipation factor (DF 0.012 @1GHz) translates to reduced dielectric loss, ensuring minimal heat generation during signal transmission, which are essential for maintaining signal integrity and low power loss in both digital and analog circuits.
Lead-Free Compatibility
The laminate is fully compatible with lead free assembly processes, supporting modern RoHS compliant manufacturing standards and ensuring environmental sustainability.
Dicy-Free & Low C.T.E
Designed with a dicy free resin system, the laminate enhances long term reliability and thermal endurance, while reducing the risk of degradation under prolonged high temperature exposure. Additionally, it features a low Z-axis CTE, minimizing the risk of plated through hole (PTH) failures during thermal expansion.
Excellent Anti-CAF Performance
The PCB material also has excellent anti-CAF performance. The laminate’s chemistry and controlled glass treatment provide excellent resistance to CAF, reducing the risk of dendritic growths that can cause shorts in high humidity or high bias conditions.
High Luminance for AOI Inspection
The laminate features a high luminance multi-functional epoxy resin that provides clear contrast with copper surfaces, enhancing automated optical inspection (AOI) accuracy and improving manufacturing yield and quality control.
IPC-4101C/99 Certified
Meeting the IPC-4101C/99 specification, the laminate ensures industry standard compliance, giving manufacturers confidence in its performance, consistency, and reliability.
What are The Applications of NP-175FM PCB Material?
NP-175FM is suitable for a broad range of industries that demand high reliability and performance:
Server
For data centers, servers, and high performance computing systems, the laminate delivers the thermal endurance and signal integrity required for dense, high quality PCB designs.
Automotive Electronics
The laminate is widely used in automotive electronics, including engine control units (ECUs), infotainment systems, ADAS modules, and powertrain controllers, where it supports high thermal and mechanical demands.
Militaries
Avionics, radar systems, communications equipment, and guidance systems demand ultimate reliability under extreme thermal cycling, vibration, and harsh conditions. NP-175FM’s combination of high Tg, low Z-CTE, and excellent anti-CAF performance is crucial.
Telecommunications
From high speed routers and modems to base station components and 5G infrastructure, the laminate supports the electrical performance and manufacturability needed for modern communication systems.
Process Advantages and Cost Efficiency of NP-175FM PCB Material
Fabricators benefit from the excellent dimensional stability and through hole reliability of NP-175FM, which supports complex multilayer boards with tight tolerances. Its consistent behavior during drilling, plating, and lamination improves yields and process control.
Moreover, it is compatible with existing PCB manufacturing processes, eliminating the need for equipment upgrades or process modifications. This ease of integration, combined with its cost effective and widely available nature, makes it highly attractive for both prototyping and high volume production.
Finally, the laminate offers a cost effective solution without compromising on performance. Its readily available supply ensures smooth procurement, helping manufacturers maintain production schedules and reduce inventory stress.
Ultimately, NP-175FM High Tg laminates offer a compelling combination of performance, reliability, and manufacturing efficiency, making them an ideal choice for a wide range of applications. By choosing NP-175FM laminate, manufacturers can achieve superior performance, enhanced safety, and extended product lifetimes.
If you have any further questions, please feel free to leave a comment below or contact QFPCB by email ([email protected]).
