N4000-13 series is an enhanced epoxy resin system engineered to provide both outstanding thermal and high signal speed/low signal loss properties for use in high speed storage networks and wireless communication infrastructure.
In this article, we’ll discuss what really characterizes the Nelco N4000-13 laminate. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the high speed circuit board, so please feel free to contact us.
What is The N4000-13 High-Speed Multifunctional Epoxy Laminate?
One of the standout characteristics of N4000-13 is its high glass transition temperature (Tg > 210°C), which ensures thermal reliability in demanding applications. The material also features a low dielectric constant (DK 3.6 @ 10GHz) and low dissipation factor (Df 0.009 @ 10GHz), supporting consistent signal integrity at high frequencies.
Beyond electrical performance, this laminate provides excellent thickness control for tight tolerance, which is essential for precise stack-up designs. The laminate is also engineered with low Z-axis coefficient of thermal expansion (Z-CTE) and proven CAF resistance, ensuring long term reliability even under challenging thermal and environmental conditions. Additionally, it is lead free assembly compatible up to 245°C, making it suitable for modern manufacturing processes.
Another advantage is that N4000-13 is available in a wide range of constructions, offering design flexibility to meet different application requirements. This versatility positions it as a multifunctional solution for various advanced PWB designs. The N4000-13 high speed multifunctional epoxy laminate series represents a robust solution for designers and manufacturers pushing the boundaries of performance in digital and RF applications.
N4000-13 High-Speed Multifunctional Epoxy Laminate Data Sheet
The Features of N4000-13 High-Speed Multifunctional Epoxy Laminate
High Glass Transition Temperature (Tg > 210°C)
The N4000-13 material offers excellent thermal resilience, making it suitable for high temperature assembly processes and ensuring long term reliability in demanding environments.
Dielectric Constant (Dk)
With a dielectric constant (DK 3.6 @ 10GHz), this low Dk value is particularly suitable for general purpose digital and analog circuits, where moderate signal speeds and stable impedance characteristics are required.
Dissipation Factor (Df)
With a dissipation factor (DF 0.009 @ 10GHz) translates to reduced dielectric loss, offering a low dissipation factor. supporting high speed signal integrity in data intensive applications such as networking and storage.
Excellent Thickness Control for Tight Tolerance
N4000-13 offers precise thickness control, enabling tight impedance tolerances and consistent layer to layer performance in complex multilayer boards. Precision thickness control ensures impedance consistency, which is essential for high speed designs where signal reflection and loss must be minimized.
Support for Advanced Technology PWB Designs
Engineered for advanced printed wiring board (PWB) designs, N4000-13 accommodates fine lines, high layer counts, and dense interconnects required by next generation systems.
Low Z-Axis CTE and Proven CAF Resistance
The pcb material exhibits low coefficient of thermal expansion (CTE), reducing the risk of plated through hole cracking. Its conductive anodic filamentation (CAF) resistance enhances reliability in humid and high voltage conditions.
Lead-Free Assembly Compatibility up to 245°C
Compliant with RoHS directives, the N4000-13 series supports lead free soldering processes without compromising performance. Fully compatible with lead free reflow processes up to 245°C, the laminate supports RoHS compliance and high temperature assembly requirements.
The Applications of N4000-13 High-Speed Multifunctional Epoxy Laminate
The performance attributes of N4000-13 make it highly suitable for advanced electronic systems where speed, reliability, and durability are paramount. Key applications include:
High-Speed Storage Networks
Ideal for enterprise storage systems and high speed data transfer interfaces, where signal integrity and thermal stability are critical. The need for rapid data access and transfer in enterprise storage systems makes the laminate an excellent substrate choice.
Backplanes
Used in telecom and datacom backplanes, this laminate supports high speed data transmission with low signal loss and excellent thermal management. Ensures stable performance in large, multilayer interconnect systems.
Internet Switches and Routing Systems
Used in core and edge routers, switches, and data center equipment, this laminate ensures reliable high bandwidth performance. Network infrastructure equipment benefits from the stable electrical characteristics of N4000-13, ensuring minimal signal degradation at high frequencies.
Wireless Communication Infrastructure
Supports 5G base station, microwave link, and RF backhaul systems, delivering stable electrical performance under demanding conditions. Base stations and 5G infrastructure components require materials that can handle high power and frequency levels a strength of the N4000-13 series.
Manufacturing Advantages of N4000-13 High-Speed Multifunctional Epoxy Laminate
In addition to excellent material properties, N4000-13 High speed multifunctional epoxy laminates are known for their ease of processing. Manufacturers benefit from:
Processes Similar to Traditional High Tg FR-4 Materials
Manufacturers can work with it using existing processes and equipment tailored for high-Tg FR-4 materials, minimizing the learning curve and potential errors. It is fabricated using processes similar to standard high Tg FR-4, enabling seamless integration into existing production lines without major process changes.
CAF Resistant Materials After High Temperature Reflow
Even after multiple reflow cycles, N4000-13 retains its resistance to conductive anodic filamentation, ensuring long term board reliability. Maintains CAF resistance even after multiple high temperature reflow cycles, ensuring long term insulation reliability.
Support for Advanced PWB Designs
Whether designing for higher layer counts, finer lines, or mixed signal applications, It offers the electrical and mechanical properties needed for success. Its robust performance supports HDI, fine pitch, and high layer count designs, making it suitable for cutting edge electronics.
Ultimately, Engineers seeking a reliable, high performance, and manufacturable solution will find N4000-13 to be a trusted choice for advanced electronic designs. By choosing N4000-13 Epoxy laminate, manufacturers can achieve superior performance, enhanced safety, and extended product lifetimes.
If you have any further questions, please feel free to leave a comment below or contact QFPCB by email ([email protected]).
