Owing to their industry-leading low dielectric constant and dissipation factor, these materials are well-suited for high-speed data transmission in servers and routers that employ high-layer-count, large-size PCB designs.
In this article, we’ll discuss what really characterizes the high speed MEGTRON 7 R-5785(N) laminate. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the high speed print circuit board, so please feel free to contact us.
What is the high speed MEGTRON 7 R-5785(N) laminate?
Panasonic MEGTRON 7 R-5785(N) laminate is a high-speed, low-loss material characterized by excellent thermal performance. Its low dielectric constant (Dk) and dissipation factor (Df) are indicative of its specific design for high frequency PCB applications.
The electrical properties of Panasonic MEGTRON 7 R-5785(N) laminate are comparable to those of PTFE-based laminates. The low dissipation factor and dielectric constant contribute to reduced transmission loss. Moreover, this PCB laminate exhibits enhanced processability, providing designers with significant advantages in system performance for telecommunication applications.
Additionally, owing to its industry-leading low dielectric constant and dissipation factor, this material is well-suited for high-speed data transmission in servers and routers utilizing high-layer-count, large-size PCB designs. This PCB laminate also demonstrates superior mechanical and thermal properties, enabling reliable performance under extreme temperature conditions. Panasonic MEGTRON 7 R-5785(N) laminate exhibits exceptional heat resistance, making it an ideal choice for low-loss multilayer PCBs. This advanced material facilitates higher-capacity data transmission, thereby contributing significantly to the development of 5G mobile communication systems.
The high speed MEGTRON 7 R-5785(N) laminate data sheet
Features of the high speed MEGTRON 7 R-5785(N) laminate
High Glass Transition Temperature (Tg 200°C)
With a Tg exceeding 200 °C, MEGTRON 7 R-5785(N) maintains dimensional stability and mechanical integrity through multiple lead free reflow cycles, ensuring layer to layer alignment and preventing warpage in multilayer builds. The material retains structural integrity at elevated temperatures, making it ideal for high-power applications and environments prone to thermal stress.
Ultra-Low Loss Dielectric Constant (Dk 3.31)
With stable Dk values across a broad frequency range, MEGTRON 7 R-5785(N) minimizes signal distortion, ensuring precise impedance control for high-speed digital and RF circuits. enabling accurate impedance control for high frequency signal lines and minimizing phase distortion in RF applications.
Low Dissipation Factor (Df < 0.002)
Featuring a dissipation factor below 0.002 at 10 GHz, this laminate minimizes insertion loss, which is crucial for preserving signal amplitude over long trace lengths and in passive networks. Ultra-low signal loss ensures high speed data integrity and energy efficiency, critical for 5G, AI, and high frequency systems.
High Peel Strength
Robust copper adhesion enhances reliability in multilayer PCBs, reducing delamination risks during thermal cycling or mechanical stress. Offers excellent adhesion between layers, contributing to the durability and reliability of multilayer PCBs.
High Decomposition Temperature
With a decomposition is 400 °C, MEGTRON 7 R-5785(N) withstands harsh thermal excursions without resin breakdown, maintaining dielectric integrity even under elevated power densities. Exceptional thermal stability prevents material degradation during high-temperature assembly processes like lead-free soldering.
Low Coefficient of Thermal Expansion
Tight CTE matching with copper minimizes warpage and via cracking, ensuring long-term reliability in multilayer designs. Minimal expansion or contraction with temperature changes reduces the risk of delamination and improves long-term reliability.
Applications of the high speed MEGTRON 7 R-5785(N) laminate
MEGTRON 7 R-5785(N) laminates are trusted in industries where speed, precision, and reliability are non-negotiable:
ICT Infrastructure Equipment
Routers, switches, and optical transceivers demand signal loss minimization and thermal resilience, both hallmarks of this laminate. Ideal for use in communication infrastructure where reliability and performance are paramount.
Supercomputers
Supports ultra-high-speed interconnects and dense PCB layouts, enabling faster processing and reduced latency. Supports the development of high-speed computing systems requiring low-loss and high-reliability materials.
Measuring Instruments
Instruments for RF characterization and test require substrates that preserve signal fidelity across broad frequency ranges. Ensures accuracy in high-frequency test equipment, oscilloscopes, and signal analyzers. Ensures precise and stable performance in measuring instruments used in research and industrial applications.
Antennas (Base Stations, Automotive Millimeter-Wave Radar)
From base station arrays in telecom networks to automotive millimeter wave radar modules, MEGTRON 7 R-5785(N) ensures predictable radiation characteristics and low insertion loss.Provides robust performance in critical antenna applications, including base stations and automotive millimeter-wave radar systems.
Aerospace
Designed to perform reliably in aerospace equipment, where extreme conditions and stringent requirements demand the highest quality materials. Withstands extreme temperatures and harsh environments in avionics, radar systems, and satellite communications.
Manufacturing Advantages of MEGTRON 7 R-5785(N) laminate
The distinctive characteristics of MEGTRON 7 R-5785(N) laminates also bring significant benefits during the manufacturing process:
Low Transmission Loss
Enables thinner designs and longer trace lengths without compromising signal quality, reducing layer counts and costs. Minimizing signal attenuation translates to fewer design iterations and tighter yield margins in RF and high speed digital assemblies.
Excellent Heat Resistance
Compatibility with lead free reflow profiles and resistance to multiple thermal cycles simplify process qualification for original equipment manufacturers (OEMs). Withstands multiple reflow cycles and high-temperature assembly, minimizing defects in complex PCB fabrication.
UL 94V-0 Flammability Rating
Meets stringent safety standards for fire resistance, critical for aerospace, automotive, and industrial applications. Self extinguishing behavior supports compliance with global safety standards, including UL, IEC, and military flame resistance requirements.
Ease of Multilayer PCB Fabrication
Optimized dielectric formulation and filler distribution yield clean drilling and routing, precise registration, and uniform lamination—streamlining throughput in high layer count boards. Excellent dimensional stability and compatibility with standard FR-4 processes simplify lamination, drilling, and plating—accelerating time-to-market.
Conclusion
MEGTRON 7 R-5785(N) laminates deliver a powerful combination of electrical performance, thermal endurance, and mechanical robustness. For more information or inquiries about MEGTRON 7 R-5785(N) laminates, feel free to reach out. We hope this overview has provided valuable insights into the capabilities and potential applications of these innovative materials.
