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IT-998GSETC is a cutting-edge laminate engineered for the most demanding high-speed digital applications,it is tailored to meet the requirements of 800G networking, advanced computing, and data center environments.
In this article, we’ll discuss what really characterizes the IT-998GSETC laminates. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the high Tg circuit board, so please feel free to contact us.
What is the IT-998GSETC PCB Material?
The IT-998GSETC laminate is an advanced material characterized by low coefficient of thermal expansion (CTE), high glass transition temperature (Tg, reaching 200 °C as determined by dynamic mechanical analysis – DMA), halogen-free composition, low dielectric constant (Dk), and ultra-low loss properties. This material has been specifically engineered for cutting-edge high-speed applications. For instance, it is suitable for achieving data rates of 112 Gbps per channel using Pulse Amplitude Modulation 4 (PAM-4) signaling.
The laminate is specifically engineered to meet these demands. With an ultra-low dielectric constant (Dk < 3.21 @ 10 GHz) and ultra-low dissipation factor (Df < 0.0014 @ 10 GHz), this material delivers exceptional electrical performance for next-generation 800G switch platforms and other high-frequency applications. The product demonstrates highly stable dielectric properties and performs optimally at Nyquist frequencies of 26.56 GHz and 28 GHz, which are essential for data rates of 112 Gbps and above. It is designed to meet the requirements of enterprise applications, covering data rates ranging from over 800 Gbps to multi-channel terabit rates.
The IT-998GSETC incorporates low-DK glass, which effectively addresses issues related to skew. The prepreg structures are designed with spread glass, and the laminates feature multi-ply spread glass configurations. This design approach serves to mitigate the fiber weave effect. Additionally, the IT-998GSETC showcases high thermal reliability and excellent resistance to Conductive Anodic Filament (CAF) formation.
IT-998GSETC PCB Material Data Sheet
Features of the IT-998GSETC PCB Material
High Glass Transition Temperature (Tg)
With a Tg 200°C, this material maintains structural integrity at elevated temperatures, ensuring reliability in high-heat environments. This Tg value helps to determine the limit of temperature operation.
Ultra-Low Dielectric Constant (Dk)
IT-998GSETC offers an exceptionally low Dk value of less than 3.21 at 10 GHz, helping to minimize signal delay and improve propagation efficiency—critical for maintaining signal integrity in 800G switches, backplanes, and high speed telecom modules.
Ultra-Low Dissipation Factor (Df)
With an ultra-low Df of less than 0.0014 at 10 GHz, IT-998GSETC significantly reduces energy loss and improves signal clarity—making it ideal for applications requiring minimal insertion loss, reduced cross-talk, and enhanced bandwidth performance.
Stable Dk/Df Across Different Environmental Conditions
One of the standout features of IT-998GSETC is its ability to maintain consistent Dk and Df values across varying temperatures and humidity levels, ensuring reliable performance in real-world operating conditions—especially important for outdoor telecom equipment and industrial-grade hardware.
800G Switch Solution
This material is optimized for use in next-generation 800G Ethernet switching platforms, where ultra-low loss transmission, stable impedance control, and high layer count integration are essential for achieving high data throughput and reliability.
Ability to Use Very Low Profile (VLP) Copper for Reduced Insertion Loss
IT-998GSETC is fully compatible with very low profile (VLP) copper foils, allowing designers to further reduce insertion loss and improve surface smoothness—a key requirement for high-speed digital and RF designs.
Halogen-Free Material
This laminate is formulated without halogenated flame retardants, aligning with global environmental and safety regulations. IT-998GSETC eliminates harmful halogens (e.g., chlorine, bromine), making it a safer choice for both production and end-use applications.
High Thermal Reliability
Exceptional thermal stability ensures long-term performance in power-intensive environments, resisting degradation even under prolonged thermal stress. IT-998GSETC features great thermal reliability. Therefore, this laminate is ideal for use in varying temperature ranges.
Good in anti-CAF performance
The laminate also has excellent anti-CAF performance. The laminate’s chemistry and controlled glass treatment provide excellent resistance to CAF, reducing the risk of dendritic growths that can cause shorts in high-humidity or high-bias conditions.
What are the Applications of IT-998GSETC PCB Material?
IT-998GSETC’s combination of electrical performance and reliability makes it an ideal substrate for a variety of advanced electronic systems, including:
112Gbps+ Per Channel Applications
For next-generation high-speed systems requiring data rates beyond 112Gbps per channel, IT-998GSETC offers the low-loss characteristics, stable Dk/Df, and compatibility with VLP copper necessary to maintain signal integrity and minimize jitter.
High-performance computing (HPC) and supercomputing rely heavily on ultra-fast interconnects. IT-998GSETC supports backbone communication systems, offering low latency and high data throughput required by advanced computing architectures.
Backplanes and Daughter Cards
Backplanes used in telecom, data center, and industrial equipment must handle complex routing, high current loads, and long-term reliability. IT-998GSETC’s mechanical strength, thermal robustness, and electrical performance make it an ideal substrate for high-layer-count backplane and daughter card designs.
Telecom and Base Station Applications
With the continued expansion of 5G and beyond networks, there is increasing demand for materials that offer stable high-frequency performance and thermal robustness. IT-998GSETC supports baseband units, RF front-ends, and antenna modules, offering improved signal integrity and long-term durability.
Servers, Storage & Switches
Data centers and cloud computing systems require PCBs that can operate continuously under high thermal and electrical loads. IT-998GSETC’s ultra-low loss characteristics, stable Dk/Df, and compatibility with VLP copper make it an excellent choice for server motherboards, memory modules, network switches, and storage devices, especially those supporting 800G connectivity.
Hybrid Designs
The material is highly suitable for hybrid PCB stackups, where it can be combined with standard FR-4 or other high-performance materials—enabling cost-effective and performance-optimized solutions for complex telecom and digital designs.
Manufacturing and Processing Advantages of IT-998GSETC PCB Material
In addition to its superior performance, IT-998GSETC offers robust processing flexibility, ensuring manufacturability in complex and high-density PCB designs:
Highly Suitable for Hybrid Constructions
IT-998GSETC is highly compatible with hybrid PCB stackups, where it can be combined with standard FR-4 or other high-performance materials—enabling cost-effective and performance-optimized solutions for complex telecom and digital designs.
Ability to Make High Layer Count Boards
The material supports the fabrication of complex, high-layer-count boards, enabling advanced integration while maintaining signal isolation, thermal management, and dimensional accuracy—ideal for switching platforms and telecom routers.
Advanced High-Tg Resin Technology
The proprietary resin system used in IT-998GSETC provides enhanced thermal resistance, dimensional stability, and long-term reliability, making it superior to standard FR-4 and other mid-range materials in high-performance applications.
Environmentally Friendly Materials
Beyond its halogen-free formulation, IT-998GSETC utilizes lead free glass fabric and non-halogenated curing agents. The material supports RoHS compliance, helping customers meet stringent environmental directives across global markets.
Compatibility with High Tg Standard FR-4 Processes
Manufacturers can integrate IT-998GSETC into existing FR-4 production lines with minimal process adjustments. Standard lamination pressures, cure profiles, and drill parameters are compatible, facilitating rapid ramp-up and cost-effective scaling.
IT-998GSETC laminates represent a powerful combination of eco-friendliness, electrical performance, and process flexibility, making them a top choice for telecom infrastructure, 5G base stations, high-speed servers, and next-generation 800G switch solutions. For more information about ITEQ IT-998GSETC laminates or to discuss how this material can support your specific application, feel free to contact reach out to us directly.
If you have any further questions, please feel free to leave a comment below or contact QFPCB by email ([email protected]).
