In the case of the IT-988GLSETC laminate, having a high Tg means that it can maintain its mechanical and electrical properties under elevated temperatures, which is essential for applications where the PCB may be exposed to heat, such as in power electronics or high-performance computing systems.
In this article, we’ll discuss what really characterizes the IT-988GLSETC laminates. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the high Tg circuit board, so please feel free to contact us.

What is the IT-988GLSETC PCB Material?
The IT-988GLSETC is an advanced low CTE, high Tg (Glass Transition Temperature, reaching 180°C as measured by TMA) and ultra low loss material. This material is engineered to possess unique electrical properties. Regarding its dielectric constant (Dk), it has a relatively lower value, specifically less than 3.34 at 10GHz. This low Dk characteristic is crucial as it helps in reducing signal attenuation and crosstalk in high frequency applications.
In addition, the dissipation factor (Df) of the IT-988GLSETC is ultra low, being less than 0.0026 at 10GHz. The ultra low Df ensures that the energy loss in the material during signal transmission is minimized, which is highly beneficial for maintaining the integrity of high speed signals. Moreover, the Dk and Df of this material remain stable across different environmental conditions. Whether it is exposed to varying temperatures, humidity levels, or other environmental factors, the electrical properties of the IT-988GLSETC do not deviate significantly. This stability is of great importance as it allows for consistent performance in different operating environments.
This material is especially designed for high speed data rate applications. For instance, in the case of the 400G switch, where data needs to be transmitted at extremely high speeds, the low CTE, high Tg, and stable electrical properties of the IT-988GLSETC play a vital role. The low CTE helps in preventing dimensional changes due to temperature variations, ensuring that the components within the 400G switch maintain their precise alignment and functionality. The high Tg enables the material to withstand the heat generated during the operation of the switch without degrading its performance.
The IT-988GLSETC SI performance remains stable across a wide variety of environment conditions. Whether it is in a hot and humid industrial environment or a cold and dry laboratory setting, the material can maintain its signal integrity capabilities. This stability is further complemented by its high thermal and CAF reliability. The high thermal reliability means that the material can endure high temperatures during manufacturing processes, as well as during the normal operation of the end – products. The high CAF reliability ensures that the material is resistant to the formation of conductive anodic filaments, which can cause electrical short – circuits and other reliability issues in electronic components.
Furthermore, the IT-988GLSETC is compatible with modified FR-4 processes. This compatibility is a significant advantage as it allows manufacturers to leverage their existing FR-4 manufacturing infrastructure with some modifications. It reduces the need for significant investment in new manufacturing equipment and processes, making it more cost – effective for production.
IT-988GLSETC PCB Material Data Sheet

Features of the IT-988GLSETC PCB Material
High Glass Transition Temperature (Tg)
With a Tg 180°C, this material maintains structural integrity at elevated temperatures, ensuring reliability in high-heat environments. This Tg value helps to determine the limit of temperature operation.
Lower Dielectric Constant (Dk)
IT-988GLSETC laminate offers an extremely lower Dk value of 3.34 at 10 GHz, helping to minimize signal delay and improve propagation efficiency—critical for maintaining signal integrity in 100G/400G switches, telecom routers, and high-speed data center equipment.
Ultra-Low Dissipation Factor (Df)
With an ultra-low Df of 0.0026 at 10 GHz, IT-988GLSETC laminate significantly reduces energy loss and improves signal clarity—making it ideal for applications requiring minimal insertion loss, reduced cross-talk, and enhanced bandwidth performance.
100G/400G Switch Solution
This material is optimized for use in next-generation 100G and 400G Ethernet switching platforms, where low-loss transmission, stable impedance control, and high layer count integration are essential for achieving high data throughput and reliability.
Stable Dk/Df With Different Environment Condition
One of the standout features of IT-988GLSETC laminate is its ability to maintain consistent Dk and Df values across varying temperatures and humidity levels, ensuring reliable performance in real-world operating conditions—especially important for outdoor telecom equipment and industrial-grade hardware.
Halogen-Free Material
IT-988GLSETC laminate is formulated without halogenated flame retardants, aligning with global environmental and safety regulations. IT-988GLSETC eliminates harmful halogens (e.g., chlorine, bromine), making it a safer choice for both production and end-use applications.
High Thermal Reliability
Exceptional thermal stability ensures long-term performance in power-intensive environments, resisting degradation even under prolonged thermal stress. IT-988GLSETC features great thermal reliability. Therefore, this laminate is ideal for use in varying temperature ranges.
Good in anti-CAF performance
The IT-988GLSETC laminate also has excellent anti-CAF performance. The laminate’s chemistry and controlled glass treatment provide excellent resistance to CAF, reducing the risk of dendritic growths that can cause shorts in high-humidity or high-bias conditions.
What are the Applications of IT-988GLSETC PCB Material?
IT-988GLSETC’s combination of electrical performance and reliability makes it an ideal substrate for a variety of advanced electronic systems, including:
Telecom Infrastructure
For telecommunications backbone systems such as switches, routers, and fiber optic modules, reliable PCB materials are essential. IT-988GLSETC laminate delivers the lower Dk/Df values and high thermal endurance needed for stable, high-speed data transmission.
Base Stations
High-frequency RF modules and power amplifiers require laminates with stable dielectric properties to maintain signal integrity across wide bandwidths. Withstands high-power RF signals and thermal stress in 5G and legacy communication systems.
Backplanes
Ideal for dense, high-layer interconnects requiring tight impedance control. Complex multi-layer backplane PCBs in data centers demand materials with tight impedance control and excellent thermal management. Delivers stable signal integrity for high-speed data transmission in networking hardware.
Servers, Storage & Switches
Data centers and cloud computing systems require PCBs that can operate continuously under high thermal and electrical loads. IT-988GLSETC’s low-loss characteristics, stable Dk/Df, and compatibility with VLP copper make it an excellent choice for server motherboards, memory modules, network switches, and storage devices, especially those supporting 100G/400G connectivity.
Manufacturing and Processing Advantages of IT-988GLSETC PCB Material
Beyond its performance capabilities, IT-988GLSETC offers excellent processability for complex PCB designs:
Advanced High-Tg Resin Technology
The proprietary resin system used in IT-988GLSETC provides enhanced thermal resistance, dimensional stability, and long-term reliability, making it superior to standard FR-4 and other mid-range materials in high-performance applications.
Environmentally Friendly Materials
Beyond its halogen-free formulation, IT-988GLSETC utilizes lead-free glass fabric and non-halogenated curing agents. The material supports RoHS compliance, helping customers meet stringent environmental directives across global markets.
Compatibility with High Tg Standard FR-4 Processes
Manufacturers can integrate IT-988GLSETC into existing FR-4 production lines with minimal process adjustments. Standard lamination pressures, cure profiles, and drill parameters are compatible, facilitating rapid ramp-up and cost-effective scaling.
Conclusion
IT-988GLSETC delivers on all fronts, making it a top-tier solution for designers and manufacturers of high-speed communication and computing hardware. For more information about ITEQ IT-988GLSETC laminates or to discuss how this material can support your specific application, feel free to contact reach out to us directly.