In the case of the IT-968TC laminate, having a high Tg means that it can maintain its mechanical and electrical properties under elevated temperatures, which is essential for applications where the PCB may be exposed to heat, such as in power electronics or high-performance computing systems.
In this article, we’ll discuss what really characterizes the IT-968TC laminates. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the high Tg circuit board, so please feel free to contact us.
What is the IT-968TC PCB Material?
The IT-968TC laminate is an advanced low CTE, high Tg (190°C by TMA) and ultra low loss material. This remarkable material has been engineered with precision to meet a wide range of demanding requirements in the electronics industry. With a lower Dk of 3.66 @ 10GHz and Ultra low Df of 0.0050 @ 10GHz, it offers low dielectric loss. In high-frequency applications, dielectric loss can cause signal degradation and attenuation. The low dielectric loss of the IT-968TC laminate helps maintain signal integrity and reduce signal attenuation. This is crucial for applications such as 5G communication systems, where high-speed data transmission over long distances is required. This material is designed not only for standard multilayer PWBs, but also for high speed data rate application, like the switch (100G), wireless application.
The IT-968TC laminate is an advanced low CTE material. CTE is a crucial parameter in materials used for printed circuit boards as it determines how the material expands and contracts with temperature changes. A low CTE in the IT-968TC ensures that the PCB maintains its dimensional stability even when exposed to varying temperatures. This is especially important in modern electronics where precision and reliability are of utmost importance.
IT-968TC laminate also exhibit high thermal and CAF reliability. High thermal reliability means that the material can withstand repeated thermal cycling and high temperature exposure without significant degradation of its properties. In electronic devices, components often generate heat during operation, and the PCB material needs to be able to handle this heat without experiencing thermal fatigue or other thermal-related failures. The IT-968TC’s high thermal reliability ensures that it can maintain its mechanical and electrical properties over the long term, even in applications with high heat loads.
IT-968TC PCB Material Data Sheet
Features of the IT-968TC PCB Material
High Glass Transition Temperature (Tg)
With a Tg 190°C, this material maintains structural integrity at elevated temperatures, ensuring reliability in high-heat environments. This Tg value helps to determine the limit of temperature operation.
Lower Dielectric Constant (Dk)
IT-968TC laminate offers an extremely low Dk value of 3.66 at 10 GHz, helping to minimize signal delay and improve propagation efficiency—critical for maintaining signal integrity in 100G/400G switches, telecom routers, and high-speed data center equipment.
Ultra-Low Dissipation Factor (Df)
With an ultra-low Df of 0.0050 at 10 GHz, IT-968TC laminate significantly reduces energy loss and improves signal clarity—making it ideal for applications requiring minimal insertion loss, reduced cross-talk, and enhanced bandwidth performance.
100G/400G Switch Solution
This material is optimized for use in next-generation 100G and 400G Ethernet switching platforms, where low-loss transmission, stable impedance control, and high layer count integration are essential for achieving high data throughput and reliability.
Stable Dk/Df Across Different Environmental Conditions
One of the standout features of IT-968TC laminate is its ability to maintain consistent Dk and Df values across varying temperatures and humidity levels, ensuring reliable performance in real-world operating conditions—especially important for outdoor telecom equipment and industrial-grade hardware.
High Thermal Reliability
Exceptional thermal stability ensures long-term performance in power-intensive environments, resisting degradation even under prolonged thermal stress. IT-968TC features great thermal reliability. Therefore, this laminate is ideal for use in varying temperature ranges.
Good in anti-CAF performance
The IT-968TC laminate also has excellent anti-CAF performance. The laminate’s chemistry and controlled glass treatment provide excellent resistance to CAF, reducing the risk of dendritic growths that can cause shorts in high-humidity or high-bias conditions.
What are the Applications of IT-968TC PCB Material?
IT-968TC’s combination of electrical performance and reliability makes it an ideal substrate for a variety of advanced electronic systems, including:
Base Stations
High-frequency RF modules and power amplifiers require laminates with stable dielectric properties to maintain signal integrity across wide bandwidths. Withstands high-power RF signals and thermal stress in 5G and legacy communication systems.
Telecom Infrastructure
For telecommunications backbone systems such as switches, routers, and fiber optic modules, reliable PCB materials are essential. IT-968TC laminate delivers the low Dk/Df values and high thermal endurance needed for stable, high-speed data transmission.
Backplanes
Complex multi-layer backplane PCBs in data centers demand materials with tight impedance control and excellent thermal management. Delivers stable signal integrity for high-speed data transmission in networking hardware.
Servers, Storage & Switches
Data centers and cloud computing systems require PCBs that can operate continuously under high thermal and electrical loads. IT-968TC’s low-loss characteristics, stable Dk/Df, and compatibility with VLP copper make it an excellent choice for server motherboards, memory modules, network switches, and storage devices, especially those supporting 100G/400G connectivity.
Manufacturing and Processing Advantages of IT-968TC PCB Material
IT-968TC laminates are a future-proof choice for next-generation electronics. Combining high thermal reliability, signal integrity, and environmental responsibility.
Advanced High-Tg Resin Technology
The proprietary resin system used in IT-968TC provides enhanced thermal resistance, dimensional stability, and long-term reliability, making it superior to standard FR-4 and other mid-range materials in high-performance applications.
Maximum Operating Temperature: 130 °C
IT-968TC has a Relative Thermal Index (RTI) of 130°C, allowing it to perform reliably in high temperature operating environments. This ensures long-term durability and safe operation in telecom and data center applications.Balances thermal endurance with compatibility for applications requiring moderate heat resistance.
Compatibility with High Tg Standard FR-4 Processes
Manufacturers can integrate IT-968TC into existing FR-4 production lines with minimal process adjustments.Standard lamination pressures, cure profiles, and drill parameters are compatible, facilitating rapid ramp-up and cost-effective scaling.
Conclusion
The IT-968TC laminate signal integrity performance is stable with a variety of environment conditions. Whether it is exposed to different temperatures, humidity levels, or electromagnetic fields, the material can maintain its signal integrity performance. For more information about ITEQ IT-968TC laminates or to discuss how this material can support your specific application, feel free to contact reach out to us directly.
