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IT-958GTC laminate exhibits excellent electrical performance characteristics. It is designed to provide low signal loss and low insertion loss, making it ideal for high-frequency applications. In aerospace applications, where extreme temperature variations are common, this high Tg material can also be relied upon to function properly.
In this article, we’ll discuss what really characterizes the IT-958GTC laminates. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the high Tg circuit board, so please feel free to contact us.
What is the IT-958GTC PCB Material?
IT-958GTC laminate is a halogen free, High Tg (175°C by DSC), advanced multifunctional epoxy and low loss material. This innovative material has been developed through extensive research and development efforts in the field of materials science. The halogen-free property of IT-958GTC laminate is of great significance. Halogens, such as chlorine and bromine, can have negative environmental impacts during the manufacturing process and at the end-of-life stage of products. By eliminating halogens, IT-958GTC laminate not only meets the growing environmental regulations but also contributes to a more sustainable manufacturing ecosystem.
This laminate offers a low dielectric constant (Dk) of 3.7 at 10GHz. it has a low dissipation factor (Df) of 0.0070 at 10GHz, indicating minimal energy loss during signal transmission. The dielectric constant is a crucial parameter in determining how a material responds to an electric field. The dissipation factor represents the ratio of the energy dissipated as heat to the total energy stored in the material when an alternating electric field is applied. A low Dk value like this is highly beneficial in modern electronics. In high-frequency circuits, such as those found in 5G communication systems and high-speed data centers, signals need to be transmitted accurately and efficiently. This low Dk helps in minimizing signal distortion and maintaining signal integrity.
This laminate is designed not only for standard multilayer PWBs, but also high speed 3S (Server/Storage/Switch) application. In standard multilayer printed wiring boards, the laminate provides enhanced reliability and performance. It can withstand the manufacturing processes involved in creating multilayer structures, such as lamination and drilling, without compromising its properties.
IT-958GTC PCB Material Data Sheet
Features of the IT-958GTC PCB Material
High Glass Transition Temperature (Tg)
With a Tg exceeding 175°C, this material maintains structural integrity at elevated temperatures, ensuring reliability in high heat environments. This high Tg value helps to determine the limit of temperature operation.
Dielectric Constant (Lower Dk)
With a dielectric constant (3.7 @ 10 GHz), The Dielectric Constant (Dk) of the material is a measure of its ability to store electrical energy in a capacitor-like manner. IT-958GTC laminates offer a stable Dk, this property measures a material’s ability to store some electrical energy in a given electric field.
Dissipation Factor (Low Df)
With a dissipation factor (0.007 @ 10 GHz) translates to reduced dielectric loss, ensuring minimal heat generation during signal transmission, which is crucial for applications that require efficient performance in thermally challenging environments.
Halogen-Free Material
The laminate is formulated without halogenated flame retardants, aligning with global environmental and safety regulations. IT-958GTC eliminates harmful halogens (e.g., chlorine, bromine), making it a safer choice for both production and end-use applications.
Advanced High-Tg Resin Technology
The proprietary resin system used in IT-958GTC laminate provides enhanced thermal resistance, dimensional stability, and long-term reliability, allowing it to outperform standard FR-4 and other mid-range materials in high-performance applications.
Stable Dk/Df Across Different Environments
One of the key strengths of IT-958GTC laminate is its ability to maintain consistent Dk and Df values across varying temperatures and humidity levels, ensuring reliable performance in real-world operating conditions.
Excellent Electrical Performance
This material delivers superior electrical properties, including low insertion loss, stable impedance control, and consistent high-speed signal transmission, making it ideal for telecom, 5G base stations, and data center applications.
What are the Applications of IT-958GTC PCB Material?
Thanks to its low-loss dielectric performance and robust thermal properties, IT-958GTC laminate is highly suited for the following applications:
For telecommunications backbone systems such as switches, routers, and fiber optic modules, reliable PCB materials are essential. IT-958GTC laminate delivers the low Dk/Df values and high thermal endurance needed for stable, high-speed data transmission.
Backplanes
Complex multi-layer backplane PCBs in data centers demand materials with tight impedance control and excellent thermal management. Delivers stable signal integrity for high speed data transmission in networking hardware.
Base Stations
High-frequency RF modules and power amplifiers require laminates with stable dielectric properties to maintain signal integrity across wide bandwidths. Withstands high-power RF signals and thermal stress in 5G and legacy communication systems.
Servers, Storage & Switches
Data centers and cloud computing systems require PCBs that can operate continuously under high thermal and electrical loads. IT-958GTC’s low-loss characteristics, stable Dk/Df, and compatibility with VLP copper make it an excellent choice for server motherboards, memory modules, network switches, and storage devices.
Manufacturing and Processing Advantages of IT-958GTC PCB Material
IT-958GTC laminates are a future-proof choice for next-generation electronics. Combining high thermal reliability, signal integrity, and environmental responsibility.
Maximum Operating Temperature: 130 °C
IT-958GTC has a Relative Thermal Index (RTI) of 130°C, allowing it to perform reliably in high-temperature operating environments. This ensures long-term durability and safe operation in telecom and data center applications. Balances thermal endurance with compatibility for applications requiring moderate heat resistance.
Compatibility with High Tg Standard FR-4 Processes
Manufacturers can integrate IT-958GTC into existing FR-4 production lines with minimal process adjustments. Standard lamination pressures, cure profiles, and drill parameters are compatible, facilitating rapid ramp-up and cost-effective scaling.
Environmentally Friendly Materials
Beyond its halogen free formulation, IT-958GTC utilizes lead-free glass fabric and non-halogenated curing agents. The material supports RoHS compliance, helping customers meet stringent environmental directives across global markets.
IT-958GTC laminates bring together low dielectric loss, thermal robustness, and manufacturing flexibility to meet the demands of high-frequency, high-density electronic systems. If you have any further questions, please feel free to leave a comment below or contact QFPCB by email ([email protected]).
