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The proper dielectric properties of IT-8615G contribute to better radiation patterns and improved signal strength, which are vital for reliable wireless communication. mmWave applications also benefit greatly from IT-8615G. mmWave frequencies are used for high-capacity, short-range wireless communication, and the material’s properties ensure efficient transmission and reception of these millimeter-wave signals.
In this article, we’ll discuss what really characterizes the IT-8615G laminates. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the Halogen free RF microwave PCB board, so please feel free to contact us.
What is the IT-8615G PCB Material?
IT-8615G is an advanced Ultra Low Loss (ULL) & High Tg (205°C by TMA) material specifically engineered to meet the stringent requirements of demanding Radio Frequency (RF) applications. In the ever-evolving landscape of RF technology, where precision and performance are of utmost importance, this material stands out as a key solution.
The material has a Dielectric Constant (Dk) of 6.15, which is precisely tailored for specific RF applications. This particular Dk value allows for efficient signal propagation and accurate impedance matching. It is designed for a wide range of applications, with a primary focus on the 5G Base Stations. In the 5G ecosystem, where high-speed data transfer and low latency are critical, IT-8615G helps in optimizing the performance of the base stations, enabling seamless communication between devices.
With a dissipation factor (0.0038 @ 10 GHz) translates to reduced dielectric loss, this material also offers an extremely low Df, significantly reducing energy loss and improving signal integrity.The Ultra Low Loss characteristic of IT-8615G ensures minimal signal degradation during transmission.This is crucial for applications where maintaining the integrity of the RF signal over long distances or through complex systems is essential. The High Tg of 205°C by TMA indicates its excellent thermal stability. It can withstand high temperatures without significant changes in its physical and electrical properties, making it suitable for environments where heat generation is a common occurrence, such as in high-power RF equipment. Antennas, another important application area, rely on the material to enhance their performance. Additionally, it finds use in other RF applications, such as in RF modules and circuit boards where its unique combination of properties can enhance overall system performance.
When compared to fiber reinforced hydrocarbon materials, the product offers distinct advantages in terms of dissipation factor and insertion loss. Dissipation factor measures the amount of energy that is lost as heat when an RF signal passes through a material. A lower dissipation factor in IT-8615G means less energy loss, resulting in more efficient signal transmission. Insertion loss, on the other hand, refers to the reduction in signal strength as it passes through a component or material. The superior performance of IT-8615G in this regard ensures that the RF signals maintain their strength and quality during propagation.
Alternatively, the product can be used with other ITEQ materials for hybrid constructions. This flexibility in material combination enables the customization of RF components and systems to meet specific design requirements, whether it’s for improving performance, reducing size, or enhancing durability.
IT-8615G PCB Material Data Sheet
Features of the IT-8615G PCB Material
High Glass Transition Temperature (Tg)
With a Tg exceeding 200°C, this material maintains structural integrity at elevated temperatures, ensuring reliability in high-heat environments. This Tg value helps to determine the limit of temperature operation.
High Dielectric Constant (Dk)
With a dielectric constant (6.14 @ 10 GHz), Designed for high-frequency applications, IT-8615G features a high Dk value, which helps minimize signal delay and distortion—crucial for maintaining performance in RF circuits, mmWave modules, and antenna arrays. The high Dk value is especially beneficial in applications requiring precise signal routing and improved impedance control.
Ultra-Low Dissipation Factor (Df)
With a dissipation factor (0.0038 @ 10 GHz) translates to reduced dielectric loss, This material also offers an extremely low Df, significantly reducing energy loss and improving signal integrity. This makes IT-8615G ideal for use in power amplifiers, microwave links, and high-speed data transmission systems.
Very stable Dk/Df with temperature
The material’s dielectric properties remain stable across a wide temperature range, essential for applications operating in harsh environments. One of the standout features of IT-8615G is its ability to maintain consistent Dk and Df values across a wide temperature range, ensuring reliable performance in harsh outdoor and automotive environments.
Halogen-Free RF Microwave Product
The material is a halogen-free laminate, meets environmental compliance standards while maintaining excellent flame retardancy and thermal performance. This makes it an eco-friendly option without compromising on performance or flame retardancy—ideal for companies focused on sustainability and regulatory compliance.
Compatible with Very Low Profile (VLP) Copper Foils
IT-8615G is fully compatible with very low profile (VLP) copper foils, allowing designers to further reduce insertion loss and improve surface smoothness—a key requirement for millimeter-wave and high-speed RF designs.Supports reduced insertion loss in high-speed transmission lines, making it ideal for miniaturized and high-density designs.
What are the Applications of IT-8615G PCB Material?
The material’s combination of electrical performance and reliability makes it an ideal substrate for a variety of advanced electronic systems, including:
5G Base Stations & mmWave Applications
With the global rollout of 5G networks, especially in the mmWave frequency bands, there is increasing demand for materials with high Dk and low Df and high thermal stability. IT-8615G supports massive MIMO antennas, beamforming modules, and base station RF front-ends. Ensures high data transmission rates and low latency for next-gen wireless infrastructure.
Antenna Applications
From base station antennas to point-to-point microwave links, IT-8615G delivers the dielectric stability and mechanical robustness required for high-performance antenna systems. Its stable Dk/Df and compatibility with VLP copper ensure optimal radiation efficiency and minimal signal degradation.
Manufacturing and Processing Advantages of IT-8615G PCB Material
Beyond its technical performance, IT-8615G excels in manufacturability:
Excellent Dimensional Stability
IT-8615G exhibits superior dimensional stability during lamination and thermal cycling, ensuring precise alignment and trace integrity in high-frequency and multilayer board designs.
Highly suitable for hybrids, ability to make high layer count boards
IT-8615G is highly compatible with hybrid PCB stackups, where it can be combined with standard FR-4 or other high-performance materials—enabling cost-effective and performance-optimized solutions for complex RF and digital designs. The material supports the fabrication of complex, high-layer-count boards, enabling advanced RF system integration while maintaining signal isolation, thermal management, and dimensional accuracy.
Full Prepreg offering, compatible with modified FR-4 processes
ITEQ provides a full range of prepreg options for IT-8615G, allowing for seamless integration into multilayer constructions and hybrid stackups. Despite its enhanced performance, The material is designed to be compatible with modified standard FR-4 fabrication processes, reducing the need for major process changes and enabling smoother adoption into existing production lines.
In terms of manufacturing and construction, the product can be paired with a Prepreg offering to build high reliability multilayer boards. The combination of IT-8615G and the appropriate Prepreg allows for the creation of boards that can withstand the rigors of complex RF circuitry.These multilayer boards are essential for integrating multiple RF functions into a single compact unit. For design engineers and PCB fabricators looking to future-proof their RF and microwave products, IT-8615G offers a compelling combination of innovation and manufacturability.
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