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For mmWave applications, which operate at extremely high frequencies and require materials with excellent electrical properties, the characteristics of IT-8350G shine. The material’s Dk value allows for accurate signal processing and transmission, facilitating the development of cutting-edge mmWave technologies.
In this article, we’ll discuss what really characterizes the IT-8350G laminates. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the Halogen free RF microwave PCB board, so please feel free to contact us.
What is the IT-8350G PCB Material?
The material is an advanced Ultra-Low Loss (ULL) & High Tg (185°C by TMA) material specifically engineered to meet the stringent requirements of demanding Radio Frequency (RF) applications. This material has been developed through extensive research and development efforts, leveraging the latest technological advancements in material science.
The Dielectric Constant (Dk) of IT-8350G is precisely 3.48. This carefully calibrated value makes it an ideal choice for a wide range of applications. In the realm of 5G Base Stations, where high-speed data transmission and reliable communication are of utmost importance, the 3.48 Dk of IT-8350G ensures efficient signal propagation. It helps in minimizing signal losses and interference, enabling seamless connectivity for users.
In the automotive industry, specifically in 76-81 GHz automotive radar applications, IT-8350G plays a vital role. Automotive radar systems rely on accurate detection and ranging, and the material’s properties ensure that the radar signals are transmitted and received effectively. This helps in enhancing the safety and performance of vehicles by enabling features such as collision avoidance and adaptive cruise control.
In terms of manufacturing flexibility, the product can be paired with a full Prepreg offering. This combination allows for the construction of high reliability multilayer boards. The Prepreg, when used in conjunction with IT-8350G, provides structural integrity and electrical insulation, ensuring the long-term stability and performance of the multilayer boards. These high reliability multilayer boards are essential for applications where durability and consistent performance are critical, such as in aerospace and defense electronics.
IT-8350G PCB Material Data Sheet
Features of the IT-8350G PCB Material
High Glass Transition Temperature (Tg)
With a Tg exceeding 180°C, this material maintains structural integrity at elevated temperatures, ensuring reliability in high-heat environments. This Tg value helps to determine the limit of temperature operation.
Low Dielectric Constant (Dk)
With a dielectric constant (3.48 @ 10 GHz), Designed for high-frequency applications, IT-8350G features a low Dk value, which helps minimize signal delay and distortion—crucial for maintaining performance in RF circuits, mmWave modules, and antenna arrays.
Ultra-Low Dissipation Factor (Df)
With a dissipation factor (0.0025 @ 10 GHz) translates to reduced dielectric loss, This material also offers an extremely low Df, significantly reducing energy loss and improving signal integrity. This makes IT-8350G ideal for use in power amplifiers, microwave links, and high-speed data transmission systems.
Very stable Dk/Df with temperature
The material’s dielectric properties remain stable across a wide temperature range, essential for applications operating in harsh environments. One of the standout features of IT-8350G is its ability to maintain consistent Dk and Df values across a wide temperature range, ensuring reliable performance in harsh outdoor and automotive environments.
Halogen-Free RF Microwave Product
It is a halogen-free laminate, meets environmental compliance standards while maintaining excellent flame retardancy and thermal performance. This makes it an eco-friendly option without compromising on performance or flame retardancy—ideal for companies focused on sustainability and regulatory compliance.
Compatible with Very Low Profile (VLP) Copper Foils
It is fully compatible with very low profile (VLP) copper foils, allowing designers to further reduce insertion loss and improve surface smoothness—a key requirement for millimeter-wave and high-speed RF designs. Supports reduced insertion loss in high-speed transmission lines, making it ideal for miniaturized and high-density designs.
What are the Applications of IT-8350G PCB Material?
It’s combination of electrical performance and reliability makes it an ideal substrate for a variety of advanced electronic systems, including:
76–81 GHz Automotive Radar
Modern vehicles rely heavily on 76–81 GHz radar systems for ADAS (Advanced Driver Assistance Systems) and autonomous driving functions. IT-8350G’s ultra-low Dk/Df, stable electrical properties, and compatibility with VLP copper make it a preferred material for automotive radar modules and sensor PCBs.
5G Base Stations & mmWave Applications
With the global rollout of 5G networks, especially in the mmWave frequency bands, there is increasing demand for materials with low Dk/Df and high thermal stability. IT-8350G supports massive MIMO antennas, beamforming modules, and base station RF front-ends. Ensures high data transmission rates and low latency for next-gen wireless infrastructure.
Power Amplifiers
For RF power amplifier designs where efficiency and signal purity are critical, IT-8350G provides minimal signal loss and superior thermal endurance, making it ideal for both commercial and industrial amplifier applications.
Antenna Applications
From base station antennas to point-to-point microwave links, IT-8350G delivers the dielectric stability and mechanical robustness required for high-performance antenna systems. Its stable Dk/Df and compatibility with VLP copper ensure optimal radiation efficiency and minimal signal degradation.
Manufacturing and Processing Advantages of IT-8350G PCB Material
Beyond its technical performance, IT-8350G excels in manufacturability:
Excellent Dimensional Stability
IT-8350G exhibits superior dimensional stability during lamination and thermal cycling, ensuring precise alignment and trace integrity in high-frequency and multilayer board designs.
Highly suitable for hybrids, ability to make high layer count boards
It is highly compatible with hybrid PCB stackups, where it can be combined with standard FR-4 or other high-performance materials—enabling cost-effective and performance-optimized solutions for complex RF and digital designs. The material supports the fabrication of complex, high-layer-count boards, enabling advanced RF system integration while maintaining signal isolation, thermal management, and dimensional accuracy.
Full Prepreg offering, compatible with modified FR-4 processes
ITEQ provides a full range of prepreg options for IT-8350G, allowing for seamless integration into multilayer constructions and hybrid stackups. Despite its enhanced performance, The material is designed to be compatible with modified standard FR-4 fabrication processes, reducing the need for major process changes and enabling smoother adoption into existing production lines.
The IT-8350G laminate bridges the gap between high-frequency performance, thermal resilience, and manufacturability. For design engineers and PCB fabricators looking to future-proof their RF and microwave products, IT-8350G offers a compelling combination of innovation and manufacturability.
If you have any further questions, please feel free to leave a comment below or contact QFPCB by email ([email protected]).
