In the fast-paced world of electronics, the demand for high-performance, reliable, and environmentally responsible materials is greater than ever.IT-170GRA2TC laminates are engineered to satisfy these demands by combining advanced resin chemistry with high-quality glass reinforcement.
In this article, we’ll discuss what really characterizes the IT-170GRA2TC laminates. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the high Tg circuit board, so please feel free to contact us.
What is the IT-170GRA2TC PCB Material?
The IT-170GRA2TC is a high Tg (175° C by DSC), halogen free epoxy and lower mid loss material with high thermal reliability, low CTE and CAF resistance. IT-170GRA2TC cooperation produces laminates with Lower Dk (3.8 @ 10GHz) and low Df (0.008 @ 10GHz), the laminates also have diverse ranges loss tangent, from standard loss to ultra-low loss. making them superior laminates for fabricating multi-layer boards. The laminates also exhibit stable mechanical properties over a wide range of dielectric constant and temperature, making them ideal for multi-layer constructions.
You should select products with high decomposition temperature when you use the material in environments with high operating temperatures. Choose a laminate with a CTE close to copper claddings’ CTE, interior thermal planes, and surface mounted devices to avoid expansion related problems. A laminate’s thermal conductivity defines its heat-conductive properties and directly influences the heat transfer properties of the PCB. The thermal conductive of the IT-170GRA2TC laminate you choose should be high enough to avoid heat accumulation on the surface-mounted devices.
In attempts to achieve the above policies, IT-170GRA2TC laminates are fabricated using lead-free processing techniques for optimal management of harmful substances. IT-170GRA2TC laminates are RoHS compliant. This green material is designed for low lost low loss material and used in server/storage/switch application.
IT-170GRA2TC PCB Material Data Sheet
Features of the IT-170GRA2TC PCB Material
High Glass Transition Temperature (Tg)
With a Tg exceeding 170°C, this material maintains structural integrity at elevated temperatures, ensuring reliability in high-heat environments. This Tg value helps to determine the limit of temperature operation.
Dielectric Constant (Lower Dk)
With a dielectric constant (3.8 @ 10 GHz), The Dielectric Constant (Dk) of the material is a measure of its ability to store electrical energy in a capacitor-like manner. IT-170GRA2TC laminates offer a stable Dk, this property measures a material’s ability to store some electrical energy in a given electric field.
Dissipation Factor (Lower Df)
With a dissipation factor (0.008 @ 10 GHz) translates to reduced dielectric loss, ensuring minimal heat generation during signal transmission, which is crucial for applications that require efficient performance in thermally challenging environments.
Halogen-Free Material
IT-170GRA2TC is formulated without halogenated flame retardants, aligning with global environmental and safety regulations. IT-170GRA2TC eliminates harmful halogens (e.g., chlorine, bromine), making it a safer choice for both production and end-use applications.
Good in anti-CAF performance
The IT-170GRA2TC PCB material also has excellent anti-CAF performance. The laminate’s chemistry and controlled glass treatment provide excellent resistance to CAF, reducing the risk of dendritic growths that can cause shorts in high-humidity or high-bias conditions.
High Thermal Reliability
Exceptional thermal stability ensures long-term performance in power-intensive environments, resisting degradation even under prolonged thermal stress. IT-170GRA2TC features great thermal reliability. Therefore, this laminate is ideal for use in varying temperature ranges.
What are the Applications of IT-170GRA2TC PCB Material?
IT-170GRA2TC’s combination of electrical performance and reliability makes it an ideal substrate for a variety of advanced electronic systems, including:
Telecom Infrastructure
For telecommunications backbone systems such as switches, routers, and fiber optic modules, reliable PCB materials are essential. IT-170GRA2TC delivers the low Dk/Df values and high thermal endurance needed for stable, high-speed data transmission.
Base Stations
High-frequency RF modules and power amplifiers require laminates with stable dielectric properties to maintain signal integrity across wide bandwidths. Withstands high-power RF signals and thermal stress in 5G and legacy communication systems.
Backplanes
Complex multi-layer backplane PCBs in data centers demand materials with tight impedance control and excellent thermal management. Delivers stable signal integrity for high-speed data transmission in networking hardware.
Servers (Storage & Switch & Routers)
In enterprise networking equipment such as routers and switches, signal integrity and thermal management are critical. Supports high-density interconnects and thermal management in data center environments. Motherboards, add-in cards, and storage controller boards operate at elevated temperatures and require halogen free, thermally robust laminates to ensure system uptime.
Manufacturing and Processing Advantages of IT-170GRA2TC PCB Material
IT-170GRA2TC laminates are a future-proof choice for next-generation electronics. Combining high thermal reliability, signal integrity, and environmental responsibility.
Maximum Operating Temperature: 130 °C
IT-170GRA2TC has a Relative Thermal Index (RTI) of 130°C, allowing it to perform reliably in high-temperature operating environments. This ensures long-term durability and safe operation in telecom and data center applications. Balances thermal endurance with compatibility for applications requiring moderate heat resistance.
Compatibility with High Tg Standard FR-4 Processes
Manufacturers can integrate IT-170GRA2TC into existing FR-4 production lines with minimal process adjustments. Standard lamination pressures, cure profiles, and drill parameters are compatible, facilitating rapid ramp-up and cost-effective scaling.
Environmentally Friendly Materials
Beyond its halogen-free formulation, IT-170GRA2TC utilizes lead-free glass fabric and non-halogenated curing agents. The material supports RoHS compliance, helping customers meet stringent environmental directives across global markets.
Conclusion
IT-170GRA2TC provides the foundation for reliable, high-efficiency electronic systems that can withstand the most demanding operational environments. For more information about ITEQ IT-170GRA2TC laminates or to discuss how this material can support your specific application,feel free reach out to us directly.
