Isola TerraGreen® 400G2 ultra-high speed laminates are engineered to meet these challenges, providing a sustainable and high performance solution for next generation electronic systems.
In this article, we’ll discuss what really characterizes the Isola TerraGreen® 400G2 laminate. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the ultra-high speed circuit board, so please feel free to contact us.
What is The Isola TerraGreen® 400G2 PCB Material?
TerraGreen® 400G2 laminate materials are our most advanced ultra-high speed, halogen free extremely low loss design solution. Like its high reliability counterpart, TerraGreen® 400G2 features a glass transition temperature (Tg) of 200°C, ensuring outstanding dimensional stability and mechanical integrity during multiple high-temperature reflow cycles and in high heat operating environments.
The laminate is our Halogen Free material solution for next generation 5G infrastructure, data center systems, high end computing, wired & wireless communications and AI applications. Our novel resin system, ultra smooth HVLP3(VLP1) copper foil and 2nd generation Ultra Low Dk glass has been engineered for very high data rates of >100 Gb/s with excellent cost for loss performance.
The TerraGreen® 400G2 resin system has proven superior CAF performance on tight pitch testing. CAF performance is enhanced by the resin systems excellent interlaminar and bond line adhesion strength. It is lead free compatible and sequential lamination capable and can be processed utilizing standard PCB equipment and processing steps. TerraGreen® 400G2 meets UL 94V-0. It’s superior thermal endurance, excellent electrical characteristics, and proven process compatibility make it a highly versatile and future proof choice across automotive, communications, aerospace, defense, and computing industries.
Isola TerraGreen® 400G2 PCB Material Data Sheet
The Features of Isola TerraGreen® 400G2 PCB Material
High Glass Transition Temperature (Tg 200°C)
Like its high reliability counterpart, the features a glass transition temperature (Tg) of 200°C, ensuring outstanding dimensional stability and mechanical integrity during multiple high temperature reflow cycles and in high heat operating environments.
Dielectric Constant (Dk)
With a dielectric constant (DK 3.10 @ 10GHz), this laminate maintains excellent dielectric stability across frequency and temperature ranges, which is essential for maintaining impedance control and minimizing signal distortion in high frequency circuits.
Dissipation Factor (Df)
With a dissipation factor (DF 0.0015 @ 10GHz) translates to reduced dielectric loss, offering an ultra low dissipation factor. These properties are essential for minimizing signal loss, crosstalk, and jitter in high bandwidth channels.
High-Density Interconnect (HDI) Ready
The material is fully optimized for HDI technology, supporting fine line routing, microvias, and complex stack-ups required for miniaturized, high performance devices. Fully supports HDI fabrication techniques, enabling the creation of highly miniaturized and densely packed circuitry.
CAF Resistant
TerraGreen® 400G2 exhibits superior resistance to Conductive Anodic Filamentation (CAF), preventing the formation of conductive paths between conductors and ensuring long term electrical insulation reliability, especially in humid conditions.
Halogen Free and RoHS Compliant
True to its “Green” name, TerraGreen® 400G2 is halogen free and fully compliant with RoHS directives, making it an environmentally responsible choice that reduces the emission of toxic gases during combustion.
Exceptional Solder Float Resistance
The material can withstand 6x reflow cycles at 260°C and an impressive 6x solder float tests at 288°C, demonstrating its exceptional thermal resilience and suitability for complex, multi-step assembly processes.
High Thermal and High Temperature Reliability
Engineered for long term performance, TerraGreen® 400G2 delivers high thermal reliability and maintains stability under high temperature operating conditions. engineered to sustain performance under extreme thermal conditions.
Low Moisture Absorption
With low moisture absorption, TerraGreen® 400G2 minimizes the risk of delamination and performance degradation in humid environments, further enhancing product reliability. preventing reliability degradation in humid environments.
The Applications of Isola TerraGreen® 400G2 Laminate System
The versatility of TerraGreen® 400G2 makes it suitable for a wide range of industries and advanced technologies:
Automotive & Transportation
Advanced driver assistance systems (ADAS), electric vehicle (EV) power electronics, high speed in vehicle networking, and engine control units demanding high temperature endurance and signal speed.
Networking & Communications
Next generation routers, switches, servers, 400G optical modules, 5G/6G infrastructure, and base stations requiring ultra-low loss and stable Dk/Df. ensuring signal integrity in 5G infrastructure, data centers, and high speed routers.
Aerospace & Defense
Avionics, radar systems, satellite communications, and mission critical electronics where extreme reliability, thermal performance, and signal integrity under stress are paramount. providing thermal stability and durability under mission critical conditions. Relied upon in radar, avionics, and communication systems for its combination of high speed, high reliability, and environmental compliance.
Computing, Storage & Peripherals
High performance computing (HPC) boards, AI accelerators, enterprise servers, high speed data storage solutions, and advanced peripherals pushing the boundaries of data transfer rates. enabling performance in servers, storage systems, and high density computing platforms.
Manufacturing Advantages of TerraGreen® 400G2 High Speed Laminates
Beyond its raw performance specs, TerraGreen® 400G2 delivers significant benefits on the factory floor and throughout the product lifecycle:
FR-4 Process Compatible
Despite its advanced capabilities, TerraGreen® 400G2 is designed to be compatible with standard FR-4 manufacturing processes, allowing for seamless integration into existing fabrication lines, reducing adoption barriers and costs.
Excellent Fill and Flow
The excellent fill and flow properties ensure void free lamination in complex, multi-layer boards, critical for HDI and high reliability applications. ensuring defect free multilayer construction.
Multiple Lamination Cycles
Capable of withstanding multiple lamination cycles, TerraGreen® 400G2 is ideal for building sophisticated, high layer count PCBs. Supports complex multilayer stack-ups requiring sequential lamination, providing design flexibility without compromising material integrity.
Cost-Effective and Readily Available
While delivering performance on par with exotic materials, TerraGreen® 400G2 offers a cost effective solution for high reliability applications. Its ready availability from Isola and global distributors supports both prototyping and high volume production, making it a practical and scalable choice.
Ultimately, Isola TerraGreen® 400G2 ultra-high speed laminates represent the pinnacle of performance and sustainability in PCB materials. By choosing Isola TerraGreen® 400G2 laminate, manufacturers can achieve superior performance, enhanced safety, and extended product lifetimes.
If you have any further questions, please feel free to leave a comment below or contact QFPCB by email ([email protected]).
