In this article, we’ll discuss what really characterizes the high Tg Isola 370HR laminate. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the high Tg circuit board, so please feel free to contact us.
What is the Isola 370HR Material?
It is a high Tg PCB laminate, This laminate comprises the Fr-4 epoxy resin system. The PCB material has advanced features such as CAF resistance and UV blocking. Also, this laminate features great dielectric and thermal properties, and it is specifically designed for multilayer PCB applications.
This laminate comprises multifunctional epoxy resin with E-glass fabric reinforcement. Also, this epoxy resin system offers better thermal performance and low CTE value. At the same time, the processability of Fr-4 is maintained.
Furthermore, the mechanical and thermal performances of this laminate exceed that of traditional FR-4 materials. It is compatible with Automated Optical Inspection (AOI) systems. this material is the best for sequential lamination designs.
Isola 370HR Material Data Sheet
Properties of Isola 370HR Material
Very high glass transition temperature (Tg)
The Tg value of Isola 370HR is 180 degrees Celsius,the Dk is 4.04 and Df is 0.0210. Also, Isola 370HR features great thermal performance due to it’s high Tg value.
High Decomposition temperature (Td)
The decomposition temperature is 340 degrees Celsius at 5% weight loss. This helps to ensure high thermal performance. Also, this value indicates that the material can barely decompose chemically.
Glass fabric availability
This PCB laminate features standard E-glass. Also, the laminate features a square weave electronic glass reinforcement.
Exceptional thermal conductivity
The thermal conductivity is 0.4 W/m/K,and this measures the rate of heat transfer in a PCB material. The thermal conductivity of Isola 370HR PCB material contributes to it’s performance.
Low Z-axis CTE
The CTE value at z-axis is 45 ppm/ºC. With this property, that is a thermally stable material for PCB applications.
CAF resistant
This is another great property of Isola 370HR material, This PCB laminate is CAF resistant. Conductive anodic filament (CAF) causes failures in PCB’s, and the PCB material is resistant to CAF and prevents failure in circuit board. The risk of CAF occurs when a metallic filament is formed from an electrochemical migration process.
UV Blocking and AOI Fluorescence
High throughput and accuracy during PCB fabrication and assembly. The material system is also laser fluorescing and UV blocking for maximum compatibility with automated optical inspection systems (AOI), optical positioning systems and photoimagable soldermask imaging.
Lead-free assembly compatible
Materials meet lead-free assembly requirements and meet RoHS standards.
Copper Foils Used in Isola 370HR Material
There are two different types of copper foil used in the material. They include:
HTE Grade 3
HTE refers to High Elongation Electrodeposited copper, this type of copper foil is IPC-4562 Grade 3,and the exterior face of the foil is semi-matt. Also, it features anti tarnish treatment, this reduces oxidation and corrosion during storage, and the matt side gets Zn/Cr treatment. Therefore, this enhances adhesion to prepreg.
Reverse Treat Foil
This type of copper foil requires treating the electrodeposited copper surface, and the treatment used is a rough coating. Also, this treatment boosts the base foil adhesion to Isola 370HR dielectric. The reverse treat foil has a rough surface area ratio between the range of 1.0 and 1.2 here. However, this foil features dismal peel strength. Moreover it is prone to delamination.
Thermal Analysis Techniques of Isola 370HR Material
There are several techniques for analyzing the thermal performance of Isola 370HR material. These techniques include:
Thermal mechanical analysis
This analysis can measure the Tg of Isola 370HR, the thermal mechanical analysis determines to the PCB material to measure Tg. Isola 370HR features around a 500% increase in post-Tg rate. Also, the actual expansion rates depend on the Isola laminate epoxy resin content.
Dynamic mechanical analysis
This analysis measures dissipation of energy and modulus properties of Isola 370HR. Also, these measurements offer quantitative and qualitative details of this material. This analysis is crucial in evaluating the mechanical properties of viscoelastic polymeric materials. These are PCB materials that show frequency and temperature effects.
Dynamic mechanical analysis helps to establish the Tg of epoxy resin systems. Also, this analysis is ideal for evaluating the cure extent and mechanical characteristics of Isola materials.
Thermal gravimetric analysis
This measures temperature degradation of Isola 370HR. Also, this technique determines the change in weight against temperature. PCB degradation often occurs over a wide temperature range. Also, it occurs when there is an irreversible chemical bond breakdown in the polymer structure. Isola 370HR features greater degradation temperature. Therefore, this material is more thermally stable.
Differential scanning calorimetry
This thermal analysis technique establishes the Tg of Isola 370HR. Also, this analysis measures the flow of heat in and out of Isola 370HR. Changes in heat flow helps to detect the glass transition.
Conclusion
Isola 370HR PCB material is a reliable and high performance material for PCB fabrication. Also, this PCB material features great properties that enhance the functionality of pcb boards.
