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In the rapidly evolving world of electronics manufacturing, the performance and reliability of printed circuit boards are increasingly dependent on the quality and characteristics of the base materials used. Among the advanced laminates available today, CCL-HL832NX Series BT material stands out as a high performance solution designed specifically for applications that demand superior thermal resistance, dimensional stability, and consistent electrical properties.
In this article, we’ll discuss what really characterizes the CCL-HL832NX type A Series laminates. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the IC Substrate, so please feel free to contact us.
Halogen-Free CCL-HL832NX type A Series BT Material
This is a halogen free build up material for printed wiring boards. MGC’s halogen free material achieves the UL 94V-0 flame retardancy level not only without using brominated flame retardants or antimony compounds but also without using phosphorus based flame retardants. Instead, it utilizes inorganic fillers. It offers the advantages of improved CO2 laser drillability for small holes and reduced coefficient of thermal expansion.
Features
BT material for semiconductor packaging.
Excellent soldering heat resistance, high rigidity, low coefficient of thermal expansion, suitable for lead free reflow soldering.
Applications
Widely used as a benchmark halogen free material for semiconductor packaging in the following applications:
CSP, BGA, Flip Chip Package, SiP, Module, etc.
Low CTE Halogen-Free BT Material
Features
Features low coefficient of thermal expansion (CTE) and low shrinkage rate, effectively reducing warpage issues in semiconductor packages.
Low water absorption, maintains excellent heat resistance after moisture absorption.
Prepreg offers excellent dimensional stability, suitable for coreless substrate fabrication.
Thinnest product: CCL 30µm, Prepreg 15µm.
HL832NS type LC uses Low CTE glass, offering even lower CTE and higher modulus of elasticity.
Applications
Widely used as a benchmark low CTE halogen free material in the following applications:
CSP, BGA, Flip Chip Package, coreless, SiP, Module, etc.
Product Applications
Application Processor, Baseband, PMIC, DRAM, Flash Memory, PA, RF Module, Automotive ECU, Various Sensors (MEMS, Optical, Fingerprint), etc.
Features
Features low coefficient of thermal expansion (CTE) and low shrinkage rate, effectively reducing warpage issues in semiconductor packages.
Prepreg offers excellent dimensional stability, suitable for coreless substrate fabrication.
Applications
Coreless, SiP, Module, CSP, BGA, Flip Chip Package, etc.
Product Applications
Application Processor, Mobile DRAM, RF Module, etc.
Features
Features low coefficient of thermal expansion (CTE) and low shrinkage rate, effectively reducing warpage issues in semiconductor packages.
High Tg.
High rigidity.
Prepreg offers excellent dimensional stability, suitable for coreless substrate fabrication.
Applications
Features low CTE, high Tg, and high rigidity, widely used in Flip Chip Package products.
Also suitable for automotive products requiring high heat resistance.
Flip Chip Package, coreless, CSP, BGA, SiP, Module, etc.
Product Applications
Application Processor, Baseband, GPU, DRAM, Flash Memory, Automotive ECU, Various Sensors (Fingerprint, CMOS), LED, etc.
Features
Advanced, state of the art material featuring low CTE, low shrinkage rate, and high Tg.
Effectively reduces warpage issues in semiconductor packages.
Applications
Features low CTE and high Tg, suitable for Flip Chip Packages.
Flip Chip Package, CSP, BGA, etc.
Product Applications
Application Processor, GPU, etc.
Features
Material developed for coreless products.
Features low CTE, low shrinkage, and stress relaxation during coreless substrate fabrication.
Effectively reduces warpage issues in coreless substrate packages.
Applications
Coreless, CSP, BGA, Flip Chip Package, etc.
Product Applications
Application Processor, mobile DRAM, etc.
Low Signal Loss, Low CTE Halogen-Free BT Material
Features
Material with low signal loss for high speed, high frequency transmission.
In addition to low dielectric constant (Dk) and low dissipation factor (Df) characteristics, it retains the inherent BT material properties of high heat resistance, low CTE, low shrinkage, and appropriate copper peel strength.
Substrates can be manufactured using existing BT material processing parameters without modification.
Excellent processability and low shrinkage rate make it particularly suitable for multilayer and coreless substrate production.
Offers low Dk and copper peel strength options suitable for low signal loss applications.
Applications
High speed, high frequency transmission Modules
CSP, BGA, Flip Chip Package, coreless, SiP, Module, etc.
Actual Product Applications
5G terminal device wireless communication modules, base stations (small cell antenna modules, power amplifiers), millimeter wave radar, optical modules and measurement instruments for data centers & supercomputers.
Besides the above IC Substrate materials, MGC’s CCL-HL820 and CCL-HL820WDI are also halogen free materials. If you have any further questions, please feel free to leave a comment below or contact QFPCB by email ([email protected]).
