The Taconic EZ-IO-F material integrates cutting-edge technology with advanced substances, designed to provide unparalleled PCB quality for a diverse range of applications. Choosing Taconic EZ-IO-F means that your design will not only stand out in the present but also withstand the test of time, ready to embrace future technological challenges.
In this article, we’ll discuss what really characterizes the Taconic EZ-IO-F laminate. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the high frequency print circuit board, so please feel free to contact us.
What is the Taconic EZ-IO-F laminate?
EZ-IO-F is a thermally stable composite that leverages nanotechnology, spread weave fabric, and PTFE to deliver superior performance. The incorporation of nanoparticle silica ensures drilling quality comparable to that of FR4 materials, while the low fiberglass content (~10 wt%) contributes to its advanced properties.
The unique spread weave construction of EZ-IO-F provides a uniform dielectric constant and impedance, as evidenced by skew testing. This makes it ideal for the next generation of digital circuitry, supporting digital transmission speeds starting at 25 Gbps and reaching up to 112 Gbps.
Moreover, EZ-IO-F is perfectly suited for microwave applications operating at increasingly higher frequencies. It meets the demand for combining both digital and microwave circuitries onto a single printed wiring board (PWB). Designed to challenge even the best FR4 materials in complex, multi-layered digital applications (30-40 layers), EZ-IO-F represents a significant advancement in PCB material technology. Its exceptional characteristics make it an optimal choice for fabricators facing the most demanding projects.
It is manufactured on industry leading no profile copper. The newer ULP copper outperforms rolled copper and is the new benchmark for high performance laminates. Significant reductions in insertion loss can be achieved with ULP copper vs. HVLP or rolled copper.
By integrating these advanced features, EZ-IO-F not only supports but also enhances the performance of cutting-edge electronic systems, ensuring reliability and efficiency in high-speed and high-frequency environments.
Taconic EZ-IO-F laminate data sheet
Benefits of the Taconic EZ-IO-F laminate
- Extremely Low Skew
- Nanotechnology Based PTFE Laminate
- Drill Quality of FR4 (1000+ Hits/Bit)
- Registration of FR4
- Extremely Low Fiberglass Content (~10%)
- <0.18% Dielectric Constant Variation within a lot
- Standard with ULP or Rolled Copper
- Temperature Stable DK
- Capable of 40+ Layer Large Format PWBs
- CAF Resistant
Application
- Semiconductor Testing at 25 gbps and Higher
- Test and Measurement
- Optical Data Transport and Backplane Routers
- Hybrid FR4 PWBs Combining Microwave and Digital Signals
- Space and Defense
What are the skew testing on the Taconic EZ-IO-F laminate?
Skew testing suggests a maximum skew of 0.3 picoseconds/inch and an average skew of <0.1 ps/inch with no artwork rotation. Artwork rotation of 15° shows a maximum skew of ~0.05 ps/inch and an average skew close to zero. Interestingly enough, skew is flat over frequency when tested from 1-20 GHz.
Manufacturing of the Taconic EZ-IO-F laminate
The laminate achieves its peak performance when combined with AGC’s FR-28-0040-50S (DF = 0.0018 at 10 GHz) non-reinforced prepreg, resulting in a stripline channel with approximately 5% fiberglass content. This combination is designed to optimize performance while maintaining material integrity and consistency.
That fastRise™ prepregs stand out as the lowest loss prepregs commercially available that can be laminated at FR4-like temperatures of 420 °F. The low insertion loss characteristic of the EZ-IO-F/fastRise™ pairing rivals that of pure PTFE laminate fused through bonding, a process known for its high cost and significant material movement issues.
Notably, fastRise™ is particularly well-suited for applications operating at frequencies up to 77 GHz. It competes favorably with any fusion-bonded laminate but without the associated costs and technical challenges. This makes the EZ-IO-F/fastRise™ combination an exceptional choice for fabricators seeking high-performance materials that offer superior electrical properties alongside ease of use and cost-effectiveness.
EZ-IO-F can be obtained with the lowest profile resistor foils. The nanoparticle’s design and lack of surface porosity enable the etching of very fine lines (2-4 mil lines and spaces).
In summary, by leveraging the advanced features of both EZ-IO-F and fastRise™ prepregs, designers can achieve unparalleled performance in high-frequency applications, ensuring reliability and efficiency without the drawbacks of more complex and expensive processes.
Where Can You Get The Taconic EZ-IO-F PCB Laminate?
When designing or manufacturing a PCB using the Taconic laminate, it is crucial to partner with a manufacturer that can reliably source this specific material. For unparalleled service and expertise in sourcing Taconic EZ-IO-F laminates and materials, look no further than QFPCB. This company excels in handling all your material sourcing needs as well as providing top-tier fabrication and assembly services.
However, QFPCB is not your only option. Other leading PCB manufacturers with a proven track record in PCB fabrication can also effectively source Taconic laminates. The key is to choose a partner who not only understands the unique advantages of the EZ-IO-F material but also has the capability to integrate it seamlessly into their production processes to meet your design specifications.
By selecting a reputable manufacturer, you ensure that your project benefits from high-quality materials and expert craftsmanship, ultimately delivering a superior PCB that meets the demands of advanced applications. Whether you opt for QFPCB or another top-tier manufacturer, prioritizing reliable sourcing and fabrication expertise will set your project up for success.
The Taconic EZ-IO-F PCB leverages nanotechnology, PTFE, and spread weave to deliver thermal stability, nanoparticle silica-enhanced drill quality, low fiberglass content, and consistent electrical properties (impedance/dielectric constant), enabling hybrid high frequency microwave/digital circuitry on a single board while outperforming traditional FR4 laminates in complex 30+ layer digital applications.
If you have any further questions, please feel free to leave a comment below or contact QFPCB by email ([email protected]).
