One company known to offer top quality copper clad laminates is Elite Material Co. Ltd. As you may already know, EM-891K copper clad laminates function as the base material for a printed circuit board. With a highly skilled Research & Development team,Elite has developed several H/F products,from Low Loss,Very Low Loss, Ultra Low Loss down to Extreme Low Loss categorie. These materials are designed for very complex PCB’s, for example, Anylayer, MSAP, IC substrate, high layer count, high speed digital and radio frequency (RF) products just to name a few.
In this article, we’ll discuss what really characterizes the high speed low loss EM-891K.The relevant information is available for pcb design engineers to refer to in the selection of materials, QFPCB offers the best services when it comes to the EM-891K Laminate. so please feel free to contact us.
What is the high speed low loss EM-891K material ?
EM-891K is high Tg ultra low loss pcb material which is made of high performance epoxy resin and regular woven E-glass fabric, designed with low dielectric constant and low dissipation factor for high speed low loss and high frequency multilayer circuit board applications.
EM-891K material is suitable for environmental protection lead free process and also compatible with FR-4 processes. This green material is designed to achieve thermal robust, low signal attenuation and eliminate the use of potential hazardous halogenated resin.Unlike conventional low loss material using brominated resin as flame retardant. EM-891K achieves flammability class of UL 94V-0 by incorporating phosphorus and nitrogen compounds in the materials.
The features of the high speed low loss EM-891K data sheet
Applications:
High-speed Ethernet, Network and Telecom.
Performance and Processing Advantages:
Designed for high thermal reliability with excellent CAF resistance.
Outstanding multiple lamination capability.
Fabrication friendly resin can be combined with mid-loss resins for “hybrid” designs.
Halogenated and RoHS Compliant.
Industry Approvals:
Applicable IPC Slash Sheets: IPC-4101 /102; IPC-4103 /230, /530.
UL File: E150504.
What are the similarities between the high speed low loss EM-891K and the high speed low loss EM-891?
As previously mentioned, both the high Tg ultra low loss EM-891K and EM-891 are closely interconnected. They exhibit identical thermal and mechanical properties, encompassing a low coefficient of thermal expansion, high glass transition temperature, minimal dissipation factor among other attributes.
Furthermore, their water absorption and applications are the same, which includes high-speed Ethernet, network and telecom etc.
What are the differences between the high speed low loss EM-891K and the high speed low loss EM-891?
The thermal conductivity of the EM-891K material is 0.47 W/m.K, which differs from that of another variant of EM-891, exhibiting a slightly larger thermal conductivity of 0.5 W/m.K. This distinction contributes to enhanced thermal performance and indicates that the material exhibits minimal chemical decomposition.
For the EM-891K PCB material,we found that permittivity (R/C:55/70%) at 1GHz and the DK value is 3.2/3.0 per SPC method,and that permittivity at 10GHz and the DK value is 3.1/3.0 per SPC method. For the high speed low loss EM-891 material, that permittivity (R/C:55/70%) at 1GHz and the DK value is 3.8/3.3 per SPC method, and that permittivity at 10GHz and the DK value is 3.6/3.2 (SPC method) respectively,so the DK values of both material are different here.
Furthermore,For the Back drilling PCB material, that loss tangent (R/C:55/70%) at 10GHz and the DF value is 0.0024/0.0025 per SPC method,And for the high speed low loss EM-891 material,that loss tangent (R/C:55/70%) at 10GHz and the DF value is 0.0043/0.0037 (SPC method) respectively, also the DF values of both material are different in the data sheet.
This encompasses virtually all the pertinent information regarding the high speed low loss EM-891K Laminate and this PCB material features great properties that enhance the functionality of pcb boards.
If you have any further questions, please feel free to leave a comment below or contact QFPCB by email ([email protected]).
