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Pyralux® AC is an advanced all polyimide flexible laminate system designed to deliver consistent performance under extreme conditions. It is a single sided, flexible laminate consisting of a layer of polyimide film bonded on one side with a unique, proprietary acrylic adhesive. What sets Pyralux® AC apart is its superior combination of thermal, mechanical, and electrical properties, making it ideal for high reliability and high density circuits.
In this article, we’ll discuss what really characterizes the Pyralux® AC Flexible laminate. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the FPC or rigid-flex circuit boards, so please feel free to contact us.
What is The Pyralux® AC Flexible Laminate?
DuPont ” Pyralux®” AC flexible circuit materials are single sided copper clad laminates with all polyimide composite of polyimide film on copper foil. Pyralux® AC products are ideal for use in single-sided applications such as: display drivers, multilayer digital cameras or rigidflex camcorder circuits that require thin, light and high density circuitry along with chip on flex attachment. Techniques commonly used in the manufacture of flexible circuits can be used to process Pyralux® AC products. Standard Pyralux® AC products are listed in Table 1. The polyimide base substrate is available in thicknesses of 12 um (0.5 mil), 20 um (0.8 mil) and 25 um (1 mil). Rolled-annealed (RA) copper foil weight is available in 18 um (1/2 oz/ft’. Electro deposited (ED) copper foil weight is available in 12 um (1/3 oz/ft’) and 18 um (1/2 oz/ft. μm).
In general a surface treatment of the polyimide surface will improve the adhesion with bonding films. Bond strength results will vary depending on circuit processing and material selection. Additional treatment is required for those applications requiring prepregs. Please specify DuPont” Pyralux® AC Plus flexible circuit material for use with pre-pregs. Pyralux® AC Plus is specifically treated for additional bond strength.
The Pyralux® AC Flexible Laminate Data Sheet
The Features of Pyralux® AC Flexible Laminate
Dielectric Constant (Dk)
With a dielectric constant (3.7 @1MHz), the Dielectric Constant (Dk) of PYRALUX® AC laminate is a measure of its ability to store electrical energy in a capacitor like manner. The material maintains a stable dielectric constant, which is essential for high quality pcb boards.
Dissipation Factor (Df)
With a dissipation factor (0.0014 @1MHz), it have a low Df, which minimizes energy losses as signals travel through the PCB. A lower Df translates to less signal loss, which is paramount for maintaining signal strength in high speed applications.
Excellent Dimensional Stability
Pyralux® AC exhibits exceptional dimensional stability, meaning it resists shrinking, stretching, or warping when subjected to the thermal and mechanical stresses of lamination, etching, and soldering. This stability ensures that the intricate circuit patterns on both sides of the laminate remain in perfect alignment, which is absolutely critical for the success of multilayer and rigid flex designs.
High Modulus and Mechanical Strength
Modulus refers to a material’s stiffness or resistance to deformation. It have a high modulus, which provides excellent mechanical support for thin, high density circuits. This makes it ideal for applications requiring rigid-flex designs, where the flexible material must transition smoothly between rigid and flexible sections.
Excellent Thermal Resistance
The manufacturing of flexible circuits involves exposure to high temperatures, particularly during soldering. The polyimide and acrylic adhesive system in Pyralux® AC are formulated to withstand these rigors, offering excellent thermal resistance that prevents decomposition or degradation. More importantly, it demonstrates excellent long term thermal aging characteristics. This means that over the projected lifespan of a device, the material will not embrittle, crack, or significantly lose its mechanical and electrical properties, even when consistently operating at elevated temperatures.
Low CTE
The Coefficient of Thermal Expansion (CTE) measures how much a material expands or contracts with temperature changes. A low CTE is essential to prevent stress on copper traces and vias during thermal cycling. Pyralux® AC features a low CTE, particularly in the in plane direction, which minimizes the risk of via cracking and trace fatigue.
UL 94 Recognition: V-0
Safety is paramount. DuPont™ Pyralux® AC materials are recognized under the UL 94 standard with a V-0 flammability rating. This is the highest recognition for flame retardancy for a material of this thickness, indicating that it will stop burning within 10 seconds after the ignition flame is removed, with no dripping of burning particles that could spread the fire. This certification is often a mandatory requirement for consumer electronics, automotive systems, and many other applications, providing a critical safety margin.
Low Moisture Absorption
Moisture absorption can significantly degrade the electrical performance of a laminate, leading to signal loss, impedance variation, and delamination during soldering. Pyralux® AC features very low moisture absorption, typically less than 1.0%, even in high-humidity environments.
What are The Applications of Pyralux® AC Flexible Laminate?
The versatility and reliability of PYRALUX® AC make it suitable for a wide range of high tech applications across multiple industries.
Display Drivers
In flat panel displays, OLEDs, and LCDs, this laminate is used in flexible display drivers that connect the display panel to the main board. Its low CTE and excellent dimensional stability ensure precise alignment of fine pitch traces, while its flexibility allows for compact, space saving designs.
Multilayer Digital Cameras
Modern digital cameras require thin, lightweight, and high density circuitry to support advanced imaging sensors, autofocus systems, and image stabilization. Pyralux® AC enables the fabrication of multilayer flexible circuits that can be folded or bent to fit into tight spaces, reducing the need for connectors and improving system reliability.
Rigid-Flex Camcorder Circuits (Thin, Light, High Density & Chip-on-Flex)
Camcorders and video recording devices often use rigid flex circuits to combine the rigidity of traditional PCBs with the flexibility of FPCs. It is ideal for these applications, offering excellent thermal resistance and mechanical strength while supporting chip on flex (COF) attachment.
COF technology allows semiconductor chips to be directly mounted onto the flexible substrate, reducing package size and improving electrical performance. Pyralux® AC’s low moisture absorption and high modulus make it an excellent substrate for COF, ensuring reliable bonding and long term durability.
Why Choose Pyralux® AC for Advanced Flexible Circuit Applications？
In summary, Pyralux® AC Flexible Circuit Materials offer a powerful combination of thermal stability, dimensional accuracy, and environmental compliance, making them ideal for high density, high reliability flexible and rigid-flex circuits.
Whether used in display drivers, digital cameras, camcorders, medical devices, or automotive systems, Pyralux® AC delivers consistent performance, excellent manufacturability, and long term reliability.
With UL 94V-0 rating, low CTE, RoHS compliance, and Pb free compatibility, this laminate meets the highest standards for safety and sustainability. By choosing PYRALUX® AC laminate, manufacturers can achieve superior performance, enhanced safety, and extended product lifetimes.
If you have any further questions, please feel free to leave a comment below or contact QFPCB by email ([email protected]).
