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The DS-7409HG is defined by a suite of superior properties that cater to the extreme demands of modern electronic packaging. Each characteristic is engineered to ensure peak performance and long-term durability under the most strenuous conditions.
In this article, we’ll discuss what really characterizes the DS-7409HG laminate. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the IC Substrate, so please feel free to contact us.
What is the DS-7409HG pcb material?
DS-7409HG laminate is a halogen free PCB laminate, widely used as the primary raw material in PCB fabrication. It is specifically designed for high performance applications that demand excellent thermal and mechanical stability. One of its standout features is its exceptionally high glass transition temperature (Tg) of 210°C, which ensures outstanding dimensional stability and minimal warpage under elevated temperatures.
The DS-7409HG laminate demonstrates a dielectric constant of 4.6 at 1 GHz. The frequency significantly influences this value, with the dielectric constant decreasing as the frequency increases. A dissipation factor of 0.01 at 1 GHz implies reduced dielectric loss, ensuring minimal heat generation during signal transmission. This is of critical importance for applications demanding efficient performance in thermally challenging environments.
The laminate formulation includes UV-absorbing agents that prevent UV light from penetrating and scattering within the substrate. This results in sharper, higher contrast images during AOI, improving defect detection accuracy for solder joints, component placement, and trace integrity. Among the leading solutions available today, DS-7409HG stands out as a premium halogen free laminate specifically designed for IC packaging in non-memory applications, including automotive electronics, functional package substrates (FPS), and digital consumer functions (DCF).
The DS-7409HG PCB material data sheet
The features of the DS-7409HG PCB material
Glass Transition Temperature (Tg)
DS-7409HG laminate features a high glass transition temperature of 210 degree celsius, this is very high. ensuring dimensional stability and resistance to thermal deformation during lead free soldering processes and under elevated operating conditions.
High Decomposition Temperature (Td)
With a high Decomposition Temperature (Td 380°C), DS-7409HG laminate exhibits outstanding resistance to thermal degradation. This provides a crucial safety margin during soldering and ensures long term reliability in high temperature operating environments.
Dielectric Constant (Dk)
With a dielectric constant (4.6 @1GHz), the Dielectric Constant (Dk) of DS-7409HG laminate is a measure of its ability to store electrical energy in a capacitor like manner. The material maintains a stable dielectric constant, which is essential for high quality pcb boards.
Dissipation Factor (Df)
With a dissipation factor (0.01 @1GHz), it has a low Df, which minimizes energy losses as signals travel through the PCB. A lower Df translates to less signal loss, which is reducing signal attenuation and enhancing efficiency.
Low Thermal Expansion
DS-7409HG offers low thermal expansion,minimizing strain on solder joints and interconnections. The CTE in the X/Y direction: 13 ppm/°C (similar to copper and silicon). Z-axis CTE below Tg: 25 ppm/°C，reducing stress on plated through holes (PTHs) and microvias. Z-axis CTE above Tg: 100 ppm/°C, significantly lower than standard FR-4 materials.
High Elastic Modulus
The inherent stiffness of the DS-7409HG reduces the risk of damage during manufacturing, handling, and assembly. With its high elastic modulus, the laminate resists deformation during fabrication and assembly. This property ensures structural integrity, even in high-density packaging with fine circuit features.
Halogen & Phosphorus Free
This laminate is fully halogen free, antimony free, and red phosphorus free, it contains no antimony or red phosphorus, both of which are associated with environmental and health hazards. These attributes make it compliant with global RoHS directives, enabling manufacturers to meet eco-friendly standards without compromising performance.
Superior Heat Resistance
DS-7409HG exhibits superior heat resistance, maintaining performance during prolonged exposure to elevated temperatures. Its stability reduces the risk of material degradation, ensuring long term reliability in mission critical environments such as automotive safety systems.
UV Blocking & AOI Compatible
The UV blocking property eliminates issues with light penetration during Automated Optical Inspection (AOI), ensuring accurate and reliable detection of defects. This significantly improves manufacturing yield and quality control. The material is protected from the detrimental effects of ultraviolet light, which can be a concern in certain manufacturing and end use environments.
What are the applications of the SI10US PCB material?
The unique property set of the DS-7409HG makes it the ideal substrate for the most demanding, high-reliability market segments.
IC Package – Non-Memory – Automotive
The automotive electronics market is one of the fastest-growing segments in the semiconductor industry, driven by trends such as electric vehicles (EVs), advanced driver assistance systems (ADAS), and connected car technologies.
IC Package – Non-Memory – FPS
Field-Programmable Gate Arrays (FPGAs) and Programmable Logic Devices (PLDs) are widely used in industrial automation, telecommunications, and aerospace systems due to their flexibility and reconfigurability.
IC Package – Non-Memory – DCF
DS-7409HG provides the right mix of mechanical strength, electrical stability, and processing ease, making it ideal for smartphones, tablets, and home electronics. These systems often operate in electrically noisy, thermally challenging environments, requiring PCB materials with excellent insulation, thermal stability, and EMI resistance.
Manufacturing advantages of the DS-7409HG PCB material
A high performance material is only valuable if it can be manufactured efficiently and reliably. The DS-7409HG excels in processability, ensuring a smooth transition from design to production.
Similar to FR-4 PCB Processing
DS-7409HG is compatible with standard FR-4 PCB processing techniques, which means no special tooling or new processes are required. This compatibility reduces transition costs for manufacturers while simplifying integration into existing production lines.
Middle CTE and Low Modulus
The material’s composition is optimized for drillability, leading to cleaner holes and extended drill bit life. The balanced properties contribute to uniform flow and excellent fill during the lamination process, even in complex, high density designs.
Great Mechanical Properties
The laminate’s high elastic modulus and mechanical robustness ensure durability throughout fabrication. Resistance to warpage, delamination, and mechanical damage increases yields in high volume production.
Cost-Effective and Readily Available
Despite its premium performance characteristics, the DS-7409HG is positioned as a cost effective solution. Its processability keeps manufacturing costs in check, and it is readily available from established material suppliers, ensuring a stable and reliable supply chain for high volume production programs. This makes the material not just a high performance option, but a smart and economical one for ambitious projects.
Ultimately, The future of electronics manufacturing depends on materials that can deliver high performance while meeting stringent environmental standards. DS-7409HG is a next-generation halogen free laminate that combines superior thermal endurance, stable electrical properties, robust mechanical strength, and sustainable compliance. By choosing DS-7409HG laminate, manufacturers can achieve superior performance, enhanced safety, and extended product lifetimes.
If you have any further questions, please feel free to leave a comment below or contact QFPCB by email ([email protected]).
