pcb material

PCB Materials

Shengyi Synamic8G laminate have a glass transition temperature of 200 degrees Celsius, it is a high Tg value, which significantly influences its thermal performance. The dielectric constant of Synamic8G is
Synamic 6 laminate demonstrates a Tg value of 185°C as measured by the DSC method, and a glass transition temperature (Tg) of 205°C determined via the DMA method.Synamic 6 laminate
The Shengyi ST110G laminate is fully halogen-free and exhibits a glass transition temperature (Tg) of 175 °C under Dynamic Mechanical Analysis (DMA). One of the standout features of ST110G laminate
The S7136H laminate is characterized by a high Glass Transition Temperature (Tg) of over 280°C.With a dielectric constant of 3.42 at 10GHz, the S7136H laminate maintains outstanding dielectric stability across
The NP-175FM provides a minimum Tg of 170°C, making it fully lead-free compatible and suitable for advanced soldering profiles. The NP-175FM offers a well-balanced dielectric constant (DK 4.2 @1GHz) and
Review Panasonic MEGTRON 4 R-5725 Dk, Df and thermal data, plus stackup, impedance, HDI and material-selection guidance for high-speed PCBs.
Review Rogers RO4360G2 Dk, Df, Tg, CTE, thermal data and processing for compact power amplifiers, small cells and multilayer RF PCB designs.
Compare Rogers RO4003C and RO4350B Dk, Df, UL rating, thicknesses and PCB stackup tradeoffs with practical QFPCB engineering guidance.
Review Isola Astra MT77 Dk, Df, Tg, CTE, copper and fabrication data, with QFPCB impedance and stackup guidance for RF, mmWave and hybrid PCBs.
Review Shengyi S1000H Tg, Td, CTE, Dk and Df data, plus QFPCB guidance for multilayer stackups, impedance, CAF risk and PCB quotation files.
Review Rogers RT/duroid 6002 Dk, Df, TCDk, CTE, thickness and copper options for radar, antennas and temperature-stable microwave PCB designs.
Review Rogers RO3010 Dk, Df, TCDk, CTE, thickness and copper options for compact RF filters, antennas and impedance-controlled PCB stackups.
Review Rogers RO3035 Dk, Df, TCDk, CTE, thickness and copper options for 5G, mmWave, antennas, power amplifiers and RF PCB stackups.
Review Rogers RO4830 Dk, loss, TCDk, CTE, thickness and processing for 76–81GHz automotive radar antenna and hybrid multilayer PCBs.
Review Rogers RO3003 Dk, Df, TCDk, CTE and thickness data, with QFPCB guidance for RF, mmWave, hybrid stackups and impedance-controlled PCBs.
Compare Rogers RO4725JXR and RO4730G3 Dk, Df, PIM, CTE, thermal data and processing for cellular base-station antenna PCB designs.
Review Shengyi SH260 polyimide laminate properties, Tg, Td, CTE, prepreg options, process risks and QFPCB guidance for high-temperature PCBs.
Compare Rogers RO3203, RO3206 and RO3210 Dk, Df, CTE and thickness options for antennas, radar and hybrid high-frequency PCB stackups.
Review Shengyi S1600 CTI, Tg, Td, Dk/Df and processing limits, with QFPCB guidance for power supplies, appliances and high-CTI PCB designs today.
Compare MEGTRON 7 R-5785(N), GN and GE Dk, Df and thermal data, with QFPCB guidance for low-loss multilayer and controlled-impedance PCB projects.
Review Panasonic MEGTRON 6 R-5775 Dk, Df, Tg and constructions, with QFPCB guidance for high-speed multilayer, HDI and impedance stackup designs.
Review Isola 185HR Tg, Td, Dk, Df and CTE data, with QFPCB guidance for multilayer, HDI, sequential-lamination and controlled-impedance PCBs.
Review ITEQ IT-180A Tg, CTE, Dk/Df, CAF and thermal data, with QFPCB engineering guidance for multilayer, HDI, heavy-copper and impedance stackups.
Review EMC EM-370(D) and EM-37B(D) datasheet values, Dk, Df, Tg, CTE, test conditions and QFPCB stackup guidance for high-speed and HDI PCBs.

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