Rogers curamik® product suite offers best-in-class metallized ceramic substrates that enable higher power efficiency. The low coefficient of thermal expansion of the ceramic substrate means they outperform substrates based on
Rogers CuClad 217, CuClad 233 and CuClad 250 series laminates are woven fiberglass/PTFE composite materials for use as printed circuit board substrates.The woven fiberglass reinforcement in CuClad products provides greater
TC600 is a woven fiberglass reinforced, ceramic-filled PTFE composite for printed circuit boards. It offers high thermal conductivity, reducing dielectric and insertion losses, and improving amplifier and antenna performance. Its
Rogers CLTE-XT PTFE laminate have a dielectric constant (Dk) of 2.94 at 10 GHz at the same frequency, CLTE-XT ensures minimal signal degradation and excellent efficiency. It's ultra-low loss tangent
CLTE-AT laminates use the common building blocks developed with CLTE-XT™ laminates, but with some changes to make the product more affordable. CLTE-AT laminates have “Best-in-Class” Insertion Loss (S21) and Loss
TMM® materials offer dielectric constants (Dk) spanning from 3.27 to 12.85 at 10G, Ideal for single material systems on a wide variety of applications.TMM® thermoset microwave materials, which are ceramic
These AD250C™, AD255C™, AD300D™ and AD350A™ Series antenna products are glass-reinforced, PTFE-based composites that offer controlled dielectric constants, low-loss performance, and superior passive intermodulation (PIM) characteristics.
RT duroid 6035HTC high-frequency circuit materials are advanced ceramic-filled PTFE composites specifically engineered for use in high-power RF and microwave applications. With a dielectric constant (Dk) of 3.5 at 10
RT duroid® 6202PR is a high frequency circuit material with low loss and a low dielectric constant. It exhibits exceptional thermal conductivity, with a Dk value of 2.90, nearly double
The RT duroid 6006 laminate features a dielectric constant of 6.15, while the RT duroid 6010LM laminate exhibits a dielectric constant of 10.2. RT duroid 6006 and 6010LM microwave laminates
RO4835INDTM LoPro® thermoset laminates have a stable Dk of 3.48 at 10 GHz, this material ensures consistent signal integrity across a wide frequency range, minimizing phase shifts and impedance mismatches.
RO4830™ thermoset laminates are particularly well-suited for cost-sensitive millimeter-wave applications, such as 76-81 GHz automotive radar sensors.RO4830 laminates exhibit a dielectric constant of 3.2 at 77 GHz, which is marginally
RO4725JXR™ and RO4730G3™ laminates possess the mechanical and electrical properties essential for antenna design. These materials exhibit a dielectric constant (Dk) of 2.55 and 3.0, respectively, and a loss tangent
RO4360G2™ laminates, characterized by a dielectric constant (Dk) of 6.15, exhibit low loss and are reinforced with glass fibers. Alongside a Dissipation Factor (Df) of just 0.0038 at 10 GHz,
Rogers RO3010 laminates are ceramic-filled PTFE composite suitable for applications up to 77 GHz. It exhibits a dielectric constant of 11.20 at room temperature, which remains stable up to 40
RO3035™ laminates are ceramic-filled PTFE-based circuit materials that exhibit consistent mechanical properties irrespective of the selected dielectric constant. The low loss tangent of 0.0015 at 10 GHz to enable low
RT/duroid® 6002 microwave material is the first low-loss, low dielectric constant laminate that material boasts a Dielectric Constant (Dk) of 2.94 ±0.04 at 10GHz, with a low loss tangent of
Rogers CLTE-MW™ laminates are ceramic-filled, woven glass-reinforced PTFE composites. With a low loss tangent of 0.0015 at 10 GHz, and the material boasts a Dielectric Constant (Dk) of 2.94 to
RO3203™, RO3206™ and RO3210™ High Frequency Circuit Materials are ceramic-filled laminates rein forced with woven fiberglass.The dielectric constant of RO3203 High Frequency Circuit Materials is 3.02. This along with a
Rogers RO4730™ LoPro™ laminate is a high-frequency material specifically designed for use in various applications, Typical applications is Base Station Antennas.The RO4735 have a dielectric constant (Dk) of 3.0 and
RO4835™ laminate has excellent thermo-mechanical properties,and electrical characteristics that antenna designers need. The laminates have a dielectric constant (Dk) of 3.48 and a loss tangent (Df) of 0.0037 measured at
ROGERS 4003C and ROGERS 4350B have excellent low dielectric loss characteristics. As a result, they provide a more cost-effective and processable high-frequency material selection than PTFE materials.
Rogers RO3003 is a ceramic filled PTFE composite material used in commercial microwave and RF applications. It offers excellent stability with a dielectric constant of 3.0±0.04 to 10 GHz. The
RT/duroid® 5870 and 5880 glass microfiber rein forced PTFE composites are designed for exacting strip line and micro strip circuit applications. the two products in this family are RT/duroid 5870
Surface-mounted technology for printed circuit boards, or SMT PCBs, is a process where components are placed directly on top of the boards instead of threading the parts through the board.
Understanding when and how to use protoboard is a critical skill for anyone who wants to design and test circuit boards without committing to the cost of printing.
If you’re interested in a career in technology or if you’re already in the field, PCB, specifically double sided PCB, is something that you’re going to be dealing with a
If you heard the term “halogen free PCB” and want to learn more, you’re in the right place. We share the backstory behind this type of printed circuit board.
large or small, elaborate or simple, regardless of their shape or size, you will discover that the printed circuit board (PCB) is the core of these devices, powering and controlling
Flexible PCBs are an integral part of today’s modern electronics. Unlike rigid PCBs, flexible PCBs can bend, are lightweight and can be used in very tight enclosures and therefore are
The multilayered circuit boards are the essence of technology and functional practicality, meeting boundless technological demand, compact, offering superior performance and unmatched versatility across different fields.
The manufacturing of electronic devices is a sequence of essential steps from design, fabrication and assembly of printed circuit boards (PCBs) and components, up to the final electronics assembly.
