PCB Design
Engineering support for layout review, stack-up planning, DFM checks and manufacturability suggestions.
Advanced PCB & PCBA Manufacturing for Complex Electronics
QFPCB supports high-reliability PCB fabrication and assembly for HDI, rigid-flex, high-frequency, ceramic, IC substrate, ATE and industrial electronics projects.
Send your Gerber files, BOM, stack-up or project requirements for engineering review, material suggestions and a clear quotation.
Gerber, BOM, stack-up or project requirements are enough to start a review.
HDI & Rigid-Flex PCB
Ceramic & High-Frequency PCB
PCB Assembly Support
ISO / IATF / UL Supported
Our PCB Services
From design review and prototype builds to PCB fabrication and assembly, QFPCB helps electronics teams move projects from files to reliable finished boards.
PCB Prototype
Prototype PCB support for engineering validation, quick design iteration and early risk control.
PCB Manufacturing
PCB fabrication for HDI, rigid-flex, high-frequency, ceramic, metal core and complex multilayer boards.
PCB Assembly
SMT, BGA and turnkey PCBA support from prototype assembly to low-volume and production orders.
PCB Products
Browse representative PCB product examples by category. Each case helps engineers and buyers quickly check material, stackup, process and application requirements before quotation.
IC Substrate PCB
LGA IC Substrate Board
Application: SiP package lc Substrate PCB Board- Material: HL832NXA
- Layers: 4L
- Thickness: 0.30±0.05mm
- Surface treatment: ENEPIG
- Min Trace/Width: 50/50um
- Construction: 1+2+1 HDI
IC Substrate PCB
6Layers FCCSP
Application: Performance memory, RFICs, and DSPs- Material: MCL-E-705G
- Layers: 6L
- Thickness: 0.55±0.05mm
- Surface treatment: ENEPIG
- Min Trace/Width: 40/40um
- Construction: 2+2+2 HDI
Ceramic PCB
HTCC Ceramic PCB
Application: Signal Converter System- Material: 99.6% Al2O3
- Layers: 4L
- Thickness: 5.0mm
- Working Temperature: -40-300℃
- Substrate Thickness: 3um
Ceramic PCB
LTCC Ceramic PCB
Application: Vehicle Electronics- Material: 99.6% Al2O3
- Layers: 4L
- Thickness: 1.0mm
- Conductor: 0.1umTiW+3.0um Ni
- Copper: 1oz
Ceramic PCB
AMB Ceramic PCB
Application: Power Modules- Material: AlN
- Layers: 2L
- Thickness: 1.6mm
- Surface finish: OSP
- Copper: 15oz
Ceramic PCB
Automotive DBC Ceramic PCB
Application: Automotive Components- Material: 96% Al2O3
- Layers: 2L
- Thickness: 2.0mm
- Surface finish: ENEPIG 2u’’
- Copper: 304um
ATE PCB Circuit Board
18L Burn-In Board PCB
Application: HTOL- Material: Arlon 85N
- Layers: 18L
- Thickness: 3.6mm
- Surface Finish: ENIG
- Pitch: 0.4mm
- DUT Flatness: ＜100μm
ATE PCB Circuit Board
22L Burn-In Board PCB
Application: HTOL- Material: VT-901
- Layers: 22L
- Thickness: 2.5mm
- Surface Finish: ENIG+Gold finger
- Pitch: 0.35mm
- DUT Flatness: ＜100μm
ATE PCB Circuit Board
32L PIMC Probe Card
Application: PMIC Test Board- Material: ISOLA 370HR
- Layers: 32L
- Thickness: 4.2mm
- Surface Finish: ENIG
- Min Trace/Space: 3/3mil
- Min hole: 0.25mm
ATE PCB Circuit Board
28L Mems Probe Card
Application: ATE- Material: TU883
- Layers: 28L
- Thickness: 6.5mm
- Surface Finish: ENIG
- Min Trace/Space: 2.5/2.5mil
- Min hole: 0.2mm
High Frequency Circuit Board
77GHz Millimeter wave radar PCB
High Frequency Circuit Board
2Layers Taconic RF-30 PCB
Application: Power Divider- Material: Taconic RF-30
- Layers: 2L
- Thickness: 1.52mm
- Surface treatment: OSP
- Min Trace/Width: 10/10mil
- Taconic RF-30 dielectric constant: 3.0
High Frequency Circuit Board
RT5880 PCB
Application: Cavity PCB for power divider- Material: RT-Duroid-5880
- Layers: 2L
- Thickness: 0.508mm
- Surface treatment: Soft Gold
- Min Trace/Width: 10/10mil
- RT-Duroid-5880 dielectric constant: 2.2
High Frequency Circuit Board
2 Layers Ro4730G3 PCB
- Material: Ro4730G3 LoPro
- Layers: 2L
- Thickness: 0.762mm
- Surface treatment: OSP
- Min Trace/Width: 4/4mil
- Ro4730G3 dielectric constant: 2.98
Multilayer Circuit Board
10Layers SH260 Burn-In Board PCB
Application: Burn-In Boards/Down Hole- Material: SH260 Polyimide
- Layers: 2-12L
- Thickness: 1.6-3.0mm
- Surface treatment: ENIG+Gold finger
- Min Trace/Width: 4/4mil
Multilayer Circuit Board
12Layers RO4350B+TU872SLK PCB
Application: Spectrum Monitoring- Material: RO4350B+TU872SLK
- Layers: 12L
- Thickness: 2.0mm
- Surface treatment: Immersion Gold
- Min Trace/Width: 3/3mil
Multilayer Circuit Board
10Layers Security Equipment PCB
Application: Security Equipment- Material: IT-180A
- Layers: 10L
- Thickness: 1.6mm
- Surface treatment: OSP
- Min Trace/Width: 3/3mil
- Features: 1-2/3-8/9-10 Blind Via
Multilayer Circuit Board
4Layers 6oz Power PCB
Application: High Power Supply- Material: S1000-2M
- Layers: 4L
- Thickness: 2.5mm
- Surface treatment: Immersion Sn
- Min Trace/Width: 20/20mil
Quality Control for Complex PCB Reliability
For complex PCB and PCBA projects, quality is not only final inspection. It starts from material control, process control and engineering verification.
AOI Inspection
Flying Probe Testing
X-Ray Inspection
Impedance Testing
Electrical Testing
Functional Testing
Chemical Laboratory
Material Traceability
PCB Solutions for Engineering Challenges
Different electronics projects fail for different reasons. QFPCB helps match the PCB structure, material, process and inspection plan to your technical risk.
High-Density Interconnect Solutions
For compact layouts, microvias, buried vias and fine-line routing.
High-Frequency & RF PCB Solutions
For low-loss materials, impedance control and signal stability.
Thermal Management PCB Solutions
For ceramic, metal core, heavy copper and power electronics applications.
Rigid-Flex Integration Solutions
For compact mechanical structures, bending areas and assembly reliability.
Semiconductor Test Board Solutions
For ATE load boards, probe cards, burn-in boards and test fixtures.
Prototype to Production Solutions
For engineering samples, small batches and repeat production transition.
What to Send for a Faster Quote
You do not need a perfect file package to start. Send the available files and QFPCB can help review the missing information before quotation.
Send Files for Quote
Gerber files
BOM for assembly
Pick-and-place files
Quantity and target lead time
Material or stack-up requirements
Impedance or special process notes
Surface finish requirements
Special notes for HDI, rigid-flex, ceramic or high-frequency PCB
Reduce PCB Manufacturing Risks Before Production Starts
Complex PCB projects often fail because of stack-up errors, material mismatch, impedance deviation or insufficient file review. QFPCB focuses on engineering checks before fabrication.
Send files for reviewGerber & DFM Review
Check key manufacturing risks before production.
Stack-Up & Lamination Control
Support multilayer, HDI, rigid-flex and mixed-material structures.
Impedance Control
Manage trace width, spacing, dielectric thickness and impedance targets.
Material Matching
Select FR4, Rogers, Taconic, ceramic, aluminum or flexible materials by application.
Hole Copper & Reliability
Focus on via quality, plating consistency and long-term electrical reliability.
Prototype to Production
Support engineering samples, small batches and volume production transition.
A Clear Workflow From Files to Finished Boards
Make each project step visible, from file review to delivery, so engineering and purchasing teams can move forward with confidence.
Send Project Files
Gerber, BOM, pick-and-place files or technical requirements.
Engineering Review
DFM, stack-up, material, impedance and assembly risk checks.
Questions Clarified
Missing specifications and process details are confirmed before pricing.
Quotation & Lead Time
Clear quotation based on quantity, process, material and delivery needs.
PCB Fabrication / Assembly
Controlled manufacturing for complex structures, assembly and finishes.
Inspection & Delivery
Testing, quality confirmation and shipment support for repeat projects.
Application Fields Across Complex PCB Projects
QFPCB supports PCB fabrication and assembly for high-reliability industries where material choice, stack-up control, inspection and engineering review directly affect project success.
Medical
Medical Devices
Rigid-flex, HDI and assembly support for compact, reliable medical electronics.
Industrial
Industrial Control
PCB and PCBA support for control boards, automation systems and industrial equipment.
Energy
Energy & Power Electronics
Heavy copper, ceramic and thermal management PCB support for power applications.
Automotive
Automotive Electronics
High-frequency, HDI and reliability-focused PCB support for automotive systems.
Aerospace
Aerospace & High-Reliability Systems
Complex multilayer PCB support for demanding reliability and signal requirements.
Communication
Communication Equipment
High-speed, RF and controlled-impedance PCB support for connected devices.
Semiconductor
Semiconductor Testing
ATE load boards, probe cards and burn-in board support for test environments.
Consumer
Consumer & Wearable Devices
Flexible, rigid-flex and compact PCB structures for lightweight electronics.
Engineering Review Before Manufacturing
Before production starts, QFPCB can review key risks such as stack-up, impedance, material selection, hole structure, solder mask clearance and assembly process requirements.
Get Engineering Review
Why Engineers and Buyers Choose QFPCB
QFPCB combines complex PCB manufacturing, assembly support and engineering review to help customers reduce project risk, improve delivery confidence and move from prototype to production with clearer control.
Complex PCB Experience
Engineering Review Before Production
Advanced Material Support
Prototype, Low-Volume and Production
Clear Quotation Process
Export-Oriented B2B Support
Certified Quality Support for PCB & PCBA Projects
QFPCB supports quality and compliance requirements for international electronics projects, including automotive, medical, industrial and export-oriented applications.
- IATF 16949
- ISO 9001:2015
- ISO 13485:2016
- AS9100D
- REACH
- RoHS
- UL
PCB Manufacturing & Assembly FAQ
Answers to common questions before sending a PCB fabrication or PCBA inquiry.
Gerber files are usually required for PCB fabrication. For assembly projects, BOM and pick-and-place files help us review components, assembly process and quotation details.
Yes. QFPCB can review manufacturability risks such as stack-up, material selection, impedance requirements, hole design, solder mask and assembly concerns before production.
Yes. QFPCB supports HDI PCB, rigid-flex PCB, flexible PCB, ceramic PCB, high-frequency PCB, metal core PCB, IC substrate PCB and ATE PCB projects.
Yes. QFPCB supports prototype builds, low-volume production and repeat production orders depending on project requirements.
Quality control may include AOI, flying probe testing, electrical testing, impedance testing, X-ray inspection, functional testing and process control based on the project type.
Yes. QFPCB can help select FR4, high Tg, Rogers, Taconic, ceramic, aluminum, flexible materials or other options based on electrical, thermal and mechanical requirements.
Yes. QFPCB can support SMT assembly, through-hole assembly, mixed assembly and project review when BOM and placement files are available.
Yes. Please provide stack-up requirements, impedance values, trace width or spacing information and related design notes so engineering can review feasibility.
Quantity, layer count, board thickness, copper thickness, surface finish, solder mask color, material requirements, test requirements and delivery expectations help speed up quotation.
Yes. For repeat production, QFPCB can keep project records, review previous manufacturing notes and support consistent process control for future orders.
Ready to Review Your PCB or PCBA Project?
Send your Gerber files, BOM or project requirements. QFPCB can help review manufacturability, material options, lead time and quotation details before production.
PCB Knowledge Center
Technical articles to help engineers understand PCB materials, manufacturing risks, assembly requirements and design decisions.
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